Technical Program

Friday, June 01, 2018

Session 35: Multiphysics and Solder Joint Reliability
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Nautilus 3 & 4

Session Co-Chairs:

Christopher J. Bailey
University of Greenwich
T +44 (0) 20 8331 8660
C.Bailey@greenwich.ac.uk
Yong Liu
ON Semiconductor
T +1-207-761-3155
Yong.Liu@onsemi.com

Papers:

1. 1:30 PM - Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion subjected to Highly-Accelerated Stress Test
Pradeep Lall - Auburn University
Yihua Luo - Auburn University
Luu Nguyen - Texas Instruments, Inc.

2. 1:55 PM - Smart Packaging – Microscopic temperature and moisture sensors embedded in a flip-chip package
Aurore Quelennec - Université de Sherbrooke
Yosri Ayadi - Université de Sherbrooke
Quentin Vandin - Université de Sherbrooke
Éric Duchesne - IBM Canada Ltd
Hélène Frémont - Université de Bordeaux
Dominique Drouin - Université de Sherbrooke

3. 2:20 PM - Improving Solder Joint Reliability for PoP Packages in Current Mobile Ecosystem
Karthikeyan Dhandapani - Qualcomm, Inc.
Jiantao Zheng - Qualcomm, Inc.
Brian Roggeman - Qualcomm, Inc.
Marcus Hsu - Qualcomm, Inc.

4. 3:30 PM - Experimental investigation on temperature and mean stress effects on high cycle fatigue behavior of SnAgCu-solder alloy
Youssef Maniar - Robert Bosch GmbH
Georg Konstantin - Robert Bosch GmbH
Alexander Kabakchiev - Robert Bosch GmbH
Peter Binkele - University of Stuttgart
Siegfried Schmauder - University of Stuttgart

5. 3:55 PM - Water Effects in Polymers Through Molecular Dynamics
Nancy Iwamoto - Honeywell International, Inc.

6. 4:20 PM - Comprehensive Study on 2.5D Package Design for Board-Level Reliability with Thermal Cycling and Power Cycling
Shuai Shao - The State University of New York at Binghamton
Yuling Niu - The State University of New York at Binghamton
Jing Wang - The State University of New York at Binghamton
Ruiyang Liu - The State University of New York at Binghamton
Seungbae Park - The State University of New York at Binghamton
Hohyung Lee - Xilinx, Inc
Gamal Refai-Ahmed - Xilinx, Inc

7. 4:45 PM - Comparative Study on Mechanical and Thermal Performance of eWLB, M-series and Fan-out chip Last
Meng-kai Shih - Advanced Semiconductor Engineering (ASE) Inc.
Ryan Chen - Advanced Semiconductor Engineering (ASE) Inc.
PeterBS Chen - Advanced Semiconductor Engineering (ASE) Inc.
Ian Hu - Advanced Semiconductor Engineering (ASE) Inc.
Tang-Yuan Chen - Advanced Semiconductor Engineering (ASE) Inc.
Xin-Lu Tang - Advanced Semiconductor Engineering (ASE) Inc.
Chih-Pin Hung - Advanced Semiconductor Engineering (ASE) Inc.