Technical Program

Friday, June 01, 2018

Session 35: Multiphysics and Solder Joint Reliability
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Nautilus 3 & 4

Session Co-Chairs:

Christopher J. Bailey
University of Greenwich
T +44 (0) 20 8331 8660
C.Bailey@greenwich.ac.uk
Wei Wang
Qualcomm Technologies, Inc.
T +1-858-651-5933
weiwng@qti.qualcomm.com

Papers: