Technical Program

Friday, June 01, 2018

Session 35: Multiphysics and Solder Joint Reliability
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Nautilus 3 & 4

Session Co-Chairs:

Christopher J. Bailey
University of Greenwich
T +44 (0) 20 8331 8660
C.Bailey@greenwich.ac.uk
Wei Wang
Qualcomm Technologies, Inc.
T +1-858-651-5933
weiwng@qti.qualcomm.com

Papers:

1. 1:30 PM - Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test
Pradeep Lall - Auburn University
Yihua Luo - Auburn University
Luu Nguyen - Texas Instruments, Inc.

2. 1:55 PM - Smart Packaging – Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package
Aurore Quelennec - Université de Sherbrooke
Hélène Frémont - Université de Bordeaux
Éric Duchesne - IBM Canada Ltd
Yosri Ayadi - Université de Sherbrooke
Quentin Vandier - Université de Sherbrooke
Dominique Drouin - Université de Sherbrooke

3. 2:20 PM - Improving Solder Joint Reliability for PoP Packages in Current Mobile Ecosystem
Karthikeyan Dhandapani - Qualcomm, Inc.
Jiantao Zheng - Qualcomm, Inc.
Brian Roggeman - Qualcomm, Inc.
Marcus Hsu - Qualcomm, Inc.

4. 3:30 PM - Experimental Investigation on Temperature and Mean Stress Effects on High Cycle Fatigue Behavior of SnAgCu-Solder Alloy
Youssef Maniar - Robert Bosch GmbH
Georg Konstantin - Robert Bosch GmbH
Alexander Kabakchiev - Robert Bosch GmbH
Peter Binkele - University of Stuttgart
Siegfried Schmauder - University of Stuttgart

5. 3:55 PM - Water Effects in Polymers Through Molecular Dynamics
Nancy Iwamoto - Honeywell International, Inc.

6. 4:20 PM - Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling
Shuai Shao - Binghamton University
Yuling Niu - Binghamton University
Jing Wang - Binghamton University
Ruiyang Liu - Binghamton University
Seungbae Park - Binghamton University
Hohyung Lee - Xilinx, Inc.
Gamal Refai-Ahmed - Xilinx, Inc.
Laurene Yip - Xilinx, Inc.

7. 4:45 PM - Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series(TM) and Fan-Out Chip Last Packages
Meng-kai Shih - Advanced Semiconductor Engineering Inc
Ryan Chen - Advanced Semiconductor Engineering Inc
PeterBS Chen - Advanced Semiconductor Engineering Inc
Ying-Chih Lee - Advanced Semiconductor Engineering Inc
Karen Yu Chen - Advanced Semiconductor Engineering Inc
Ian Hu - Advanced Semiconductor Engineering Inc
Tang-Yuan Chen - Advanced Semiconductor Engineering Inc
Lung Tsai - Advanced Semiconductor Engineering Inc
Eatice Chen - Advanced Semiconductor Engineering Inc
Eddie Tsai - Advanced Semiconductor Engineering Inc
David Tarng - Advanced Semiconductor Engineering Inc