Technical Program

Friday, June 01, 2018

Session 36: Power Delivery Solutions for Components and Systems
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components
Room: Nautilus 5

Session Co-Chairs:

Rajen M Murugan
Texas Instruments
T +1-214-567-6377
r-murugan@ti.com
P. Markondeya Raj
Georgia Institute of Technology
T +1-404 558 2615
raj@ece.gatech.edu

Papers:

1. 1:30 PM - Analog Power Filtering: Modeling, Measuring & Analog PI
Layne Berge - IBM Corporation
Matt Doyle - IBM Corporation
Kyle Schoneck - IBM Corporation

2. 1:55 PM - Improved Staggered through Silicon Via Inductors for RF and Power Applications
Xiao Sun - IMEC
Geert Van der Plas - imec
Eric Beyne - IMEC

3. 2:20 PM - Realization of High Electrical Performance On-Chip Thick Copper Inductor Package by Via Interface Process Improvement for Metal Contact
Ting-Li Yang - Taiwan Semiconductor Manufacturing Company
S. B. Yang - Taiwan Semiconductor Manufacturing Company
W. L. Huang - Taiwan Semiconductor Manufacturing Company
C. C. Chen - Taiwan Semiconductor Manufacturing Company
C. C. Kuo - Taiwan Semiconductor Manufacturing Company
G. C. Huang - Taiwan Semiconductor Manufacturing Company
K. Y. Wu - Taiwan Semiconductor Manufacturing Company
T. C. Chang - Taiwan Semiconductor Manufacturing Company
C. C. Hsu - Taiwan Semiconductor Manufacturing Company
C. L. Chang - Taiwan Semiconductor Manufacturing Company
H. L. Huang

4. 3:30 PM - An Approach for PDN Simplification of a Mobile Processor
Sungwook Moon - Samsung Electronics Company, Ltd.
Seungki Nam - Samsung Electronics Company, Ltd.
Jungil Son - Samsung Electronics Company, Ltd.
Sunha Lee - Samsung Electronics Company, Ltd.

5. 3:55 PM - Design Optimization and Accurate Extraction of On-Die Decoupling Capacitors for High-Performance Applications
Xiaoping Liu - Intel Corporation
Jihong Ren - Intel Corporation
Wendem Beyene - Intel Corporation
Simon Ku - Intel Corporation
Chin Hong Heah - Intel Corporation
Sherman Hsu - Intel Corporation

6. 4:20 PM - Signal and Power Integrity Analysis of InFO Interconnect for Networking Application
Po-Hao Chang - Mediatek, Inc.
Chia-Yuan Hsieh - Mediatek, Inc.
Chun-Wei Chang - Mediatek, Inc.
Chih-Lun Chung - Mediatek, Inc.
Chen-Feng Chiang - Mediatek, Inc.

7. 4:45 PM - A System-in-Package Based Energy Harvesting for IoT Devices with Integrated Voltage Regulators and Embedded Inductors
Edward Lee - Georgia Institute of Technology
Mohammad Amir - Georgia Institute of Technology
Sridhar Sivapurapu - Georgia Institute of Technology
Colin Pardue - Georgia Institute of Technology
Hakki Torun - Georgia Institute of Technology
Mohamed Bellaredj - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Saibal Mukhopadhyay - Georgia Institute of Technology