Technical Program

Friday, June 01, 2018

Session 36: Power Delivery Solutions for Components and Systems
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components
Room: Nautilus 5

Session Co-Chairs:

Rajen M Murugan
Texas Instruments
T +1-214-567-6377
r-murugan@ti.com
P. Markondeya Raj
Georgia Institute of Technology
T +1-404 558 2615
raj@ece.gatech.edu

Papers:

1. 1:30 PM - Analog Power Filtering: Modeling, Measuring & verifying Analog PI
Layne Berge - IBM Corporation
Matt Doyle - IBM
Kyle Schoneck - IBM Corporation

2. 1:55 PM - Improved staggered through silicon via inductors for RF and power applications
Xiao Sun - IMEC
Geert Van der Plas - imec
Eric Beyne - IMEC

3. 2:20 PM - Realization of High Electrical Performance On-chip Thick Copper Inductor Package by Via Interface Process Improvement for Metal Contact
Ting-Li Yang - Taiwan Semiconductor Manufacturing Company
S. B. Yang - Taiwan Semiconductor Manufacturing Company
W. L. Huang - Taiwan Semiconductor Manufacturing Company
C. C. Chen - Taiwan Semiconductor Manufacturing Company
C. C. Kuo - Taiwan Semiconductor Manufacturing Company
H. L. Huang - Taiwan Semiconductor Manufacturing Company
Edward Chen - Taiwan Semiconductor Manufacturing Company
K. C. Liu - Taiwan Semiconductor Manufacturing Company
Marvin Liao - Taiwan Semiconductor Manufacturing Company
Harry Ku - Taiwan Semiconductor Manufacturing Company

4. 3:30 PM - An Approach for PDN Simplification of a Mobile Processor
Sungwook Moon - Samsung Electronics Company, Ltd.
Seungki Nam - Samsung Electronics Company, Ltd.
Jungil Son - Samsung Electronics Company, Ltd.
Sunha Lee - Samsung Electronics Company, Ltd.

5. 3:55 PM - Design Optimization and Accurate Extraction of On-Die Decoupling Capacitors for High-Performance Applications
Xiaoping Liu - Intel Corporation
Jihong Ren - Intel Corporation
Wendem Beyene - Intel Corporation
Simon Ku - Intel Corporation
Chin Hong Heah - Intel Corporation
Sherman Hsu - Intel Corporation

6. 4:20 PM - Design and Fabrication of Embedded PCB Inductor with Ferrite Magnetic Cores
Zeeshan Umar - Infineon Technologies
Maciej Wojnowski - Infineon Technologies
Petteri Palm - Infineon Technologies
Amelie Hagelauer - Universität Erlangen-Nürnberg
Robert Weigel - Universität Erlangen-Nürnberg

7. 4:45 PM - A System-In-Package Based Energy Harvesting for IoT Devices with Integrated Voltage Regulators and Embedded Inductors
Edward Lee - Georgia Institute of Technology
Mohammad Amir - Georgia Institute of Technology
Sridhar Sivapurapu - Georgia Institute of Technology
Colin Pardue - Georgia Institute of Technology
Hakki Torun - Georgia Institute of Technology
Mohamed Bellaredj - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Saibal Mukhopadhyay - Georgia Institute of Technology