Technical Program

Wednesday, May 30, 2018

Session 37: Posters 1
9:00 AM - 11:00 AM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Mark Eblen
Kyocera International SC
T +1-858-614-2537
Patrick Thompson
Texas Instruments, Inc.
T +1-214-567-0660

Deborah S. Patterson
Principal, Patterson Group
T +1-480-703-5683

Andy Tseng
JSR Micro
T +1-408-472-7345


Achieving of intensified conductive interconnections for Flex-on-Flex by using metal passivated Copper – Copper Thermocompression bonding
Hemanth Kumar Cheemalamarri - Indian Institute of Technology Hyderabad
Asisa Kumar panigrahi - KL University Hyderabad Campus
Satish Bonam - Indian Institute of Technology Hyderabad
Nirupam Paul - Indian Institute of Technology Hyderabad
Siva Rama Krishna Vanjari - Indian Institute of Technology Hyderabad
Shiv Govind Singh - Indian Institute of Technology Hyderabad

Reliability test of organic substrate processed by newly desmear method “PhotodesmearTM”.
Shinichi Endo - Ushio Inc.
Tomoyuki Habu - Ushio Inc.
Shintaro Yabu - Ushio America Inc.
Yasushi Muto - Ushio Inc.

Highly-conductive stretchable electrically conductive composites by halogenation treatment and its application in stretchable electronics
Peng Zheng - Fudan University
Haoyue Zhuo - Fudan University
Yuxiao Zou - Fudan University
Wei Guo - Huazhong University of Science and Technology
Hao Wu - Huazhong University of Science and Technology
Zhuo Li - Fudan University

Electroplating Enhanced Silver Nanowire Networks for Transparent Heaters
Shang Wang - Harbin Institute of Technology
Yanhong Tian - Harbin Institute of Technology

Low transmission loss film material for high-speed/high-frequency devices
Takao TANIGAWA - Hitachi Chemical Co. Ltd.
Shin TAKANEZAWA - Hitachi Chemical Co. Ltd.
Minoru KAKITANI - Hitachi Chemical Co. Ltd.
Kouji MORITA - Hitachi Chemical Co. Ltd.
Mami SHIMADA - Hitachi Chemical Co. Ltd.
Etsuo MIZUSHIMA - Hitachi Chemical Co. Ltd.

Wet-spun graphene sheet as flexible heat spreader for efficient thermal management
Guang Yang - Fudan University
Yuze Yan - Fudan University
Chaowei Li - Chinese Academy of Sciences
Yagang Yao - Chinese Academy of Sciences
Zhuo Li - Fudan University

Aging Characteristics of Green Mold Compound for use in Encapsulation of Microelectronic Devices
Subramani Manoharan - University of Maryland
Chandradip Patel - Schlumberger Technology Corporation
Steven Dunford - Schlumberger Technology Corporation
Carlos Morillo - University of Maryland
Patrick McCluskey - University of Maryland

Effective stress relief without jeopardizing reliability in overmolded packages with stress buffers
Amar Mavinkurve - NXP Semiconductors
Jeroen Zaal - NXP Semiconductors
Yukai Liang - NXP Semiconductors
Sean Xu - NXP Semiconductors
Antoine Storez - NXP Semiconductors
Seng Kiong Teng - NXP Semiconductors
Yuan Guo - NXP Semiconductors
Sheila Chopin - NXP Semiconductors

Solder resist surface condition impact on IC package Electrostatic Discharge behavior
Layal Rouhana - Qualcomm Technologies Inc.
Kevin Kang - Qualcomm Technologies Inc.
Houssam Jomaa - Qualcomm Technologies Inc.

Porous Epoxy Film for Low Dielectric Constant Chip Substrates and Boards
Oluwadamilola Phillips - Georgia Institute of Technology
Paul Kohl - Georgia Institute of Technology

High Temperature Mechanical Behavior of SAC and SAC+X Lead Free Solders
Mohammad Alam - Auburn University
Jeffrey Suhling - Auburn University
Pradeep Lall - Auburn University

Flexible Wearable Biometric Band and Smartphone Application for Prevention of Sudden Causes of Death
Pradeep Lall - Auburn University
Hao Zhang - Auburn University
Rahul Lall - Stanford University

Developing Backward Compatible Connectors for the 5th Generation PCIe Electrical I/O
Lei Shan - IBM Corporation
Daniel Freidman - IBM Corporation
Craig Kennedy - Amphenol Corporation
Warren Persak - Amphenol Corporation
Kevin Lau - Amphenol Corporation

Experimental strain energy densities dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurements
Jean-Baptiste Libot - Safran Electronics & Defense
Joël Alexis - University of Toulouse - INP/ENIT
Lionel Arnaud - University of Toulouse - INP/ENIT
Olivier Dalverny - University of Toulouse - INP/ENIT
Philippe Milési - Safran Electronics & Defense
Frédéric Dulondel - Safran Electronics & Defense

PCB Pin Area Wire Modeling Based on Representative Layer 2D Misregistration
Zhaoqing Chen - IBM Corporation

Compact Low Power Avionics for the Europa Lander Concept and Other Missions to Ocean Worlds
Don Hunter - JPL
Gary Bolotin - JPL
Doug Sheldon - JPL
Eric Suh - JPL
Malcolm Lias - JPL

High Performance Metal-based Nanocomposite Thermal Interface Materials Toward Enhanced Cooling Efficiency in Electronic Applications
Cengiz Yegin - Incendium Technologies LLC
Nirup Nagabandi - Incendium Technologies LLC
Kevin Holder - Incendium Technologies LLC
Elisa Teipel - Incendium Technologies LLC
Mustafa Akbulut - Texas A&M University

Optimization of laser release process for throughput enhancement of Fan-Out Wafer-Level-Packaging
Yu-Hua Chen - Unimicron Technology Corp
Yu-Min Lin - Electronics and Optoelectronics Research Laboratories, Indu
Kuan-Neng Chen - National Chiao Tung University, Hsinchu, Taiwan
Jay Su - Brewer Science Inc.

High Thermal Conductivity Underfill and Its Viscoelastic Properties using Nanofiller, Hexagonal Boron Nitride (hBN)
sara razgaleh - Joint School of Nanoscience and Nanoengineering
Shyam Aravamudhan - Joint School of Nanoscience and Nanoengineering

Jong Heon Kim - NEPES Corporation
Yong Tae KWON - NEPES Corporation
Yong Ho KWON - NEPES Corporation
Yong Woon YEO - NEPES Corporation
Eung Ju LEE - NEPES Corporation
Jun Gyu LEE - NEPES Corporation
Ho Il LEE - NEPES Corporation
Young Mo LEE - NEPES Corporation
Nam Chul KIM - NEPES Corporation
Tae Hoon KIM - NEPES Corporation

Self-Assembly Technology for FlexTrate
Tak Fukushima - Tohoku University / UCLA
Yuki Susumago - Tohoku University
Arsalan Alam - UCLA
Amir Hanna - UCLA
Hisashi Kino - Tohoku University
Tetsu Tanaka - Tohoku University
Subramanian Iyer - UCLA

Solder life prediction for extra tall packages with the Digital Image Correlation (DIC) method
Van Lai Pham - Binghamton University
Yuling Niu - Binghamton University
Cheng Zhong - Huawei Technology Co. Ltd
Sau Wee Koh - Huawei Technology Co. Ltd
Jifan Wang - Huawei Technology Co. Ltd
Seungbae Park - Binghamton University

High Performance EMI Shielding Materials and Spraying Process Parameters for High Frequency FCBGA package Application
Kisu Joo - Ntrium Incorporation
Kyu Jae Lee - Ntrium Incorporation
Jung Woo Hwang - Ntrium Incorporation
Jin-Ho Yoon - Ntrium Incorporation
Yoon-Hyun Kim - Ntrium Incorporation
Joo-Wook Park - Ntrium Incorporation
Myung Jin Yim - Intel Corporation
Se Young Jeong - Ntrium Incorporation

Physical aging of epoxy molding compound and its influences on the warpage of reconstituted wafer
Tz-Cheng Chiu - National Cheng Kung University
Wei-Jie Yin - ASE Group
En-Yu Yeh - National Cheng Kung University
Yu-Ting Yang - ASE Group
Dao-Long Chen - ASE Group
Yi-Hsiu Tseng - ASE Group

High Thermal Conductive Semi-Sintering Die Attach Paste
RAJASEKHAR PEDDI - Henkel Corporation
WEI YAO - Henkel Corporation
KILY WU - Henkel Corporation
ROBIN FU - Henkel Corporation
HOSEUNG YOO - Henkel Corporation

Non-destructive Assessment of the Porosity in Ag-sinter joints using acoustic waves
Sebastian Brand - Fraunhofer IMWS
Bianca Böttge - Fraunhofer IMWS
Jurrian Zijl - BESI Netherlands
Sebastiaan Kersjes - BESI Netherlands
Thomas Behrens - Infineon Technologies

Reliability Study and Finite Element Modeling of a Wearable Sensor Patch (WSP) to Monitor ECG Signals
Varun Soman - Binghamton University
Mark Poliks - Binghamton University
James Turner - Binghamton University
Mark Schadt - i3 Electronics, Inc.
Michael Shay - i3 Electronics, Inc.
Frank Egitto - i3 Electronics, Inc.

Reliability of Inkjet Printed Structures on Flexible Substrates Deformed over Sculptured Surfaces
Isaac Bower - Georgia Institute of Technology
Suresh Sitaraman - Georgia Institute of Technology