Technical Program

Wednesday, May 30, 2018

Session 38: Posters 2
2:00 PM - 4:00 PM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Rao Bonda
Amkor Technology
T +1-480-786-7749
John Hunt
Advanced Semiconductor Engineering, Inc.
T +1 480-718-8011

Eric Beyne
T +32-16-281-261

Richard Rao
T +1-805- 914-2272


Fabrication and characteristics of spin-on glass for multi-level interconnect in WLP
Sarah Kim - Seoul National University of Science and Technology
Sungdong Kim - Seoul National University of Science and Technology

High Density TSV-Free Interposer (TFI) Packaging with Submicron Cu Damascene RDLs for Integration of CPU/GPU and HBM
Masaya Kawano - IME
Chun-Mei Wang - IME
Hong-Yu Li - IME
Mian-Zhi Ding - IME
Sharon Lim - IME
Teck-Guan Lim - IME
Zi-Hao Chen - IME
Fa-Xing Che - IME

Dynamic Warpage Analysis of QFP Packages During Soldering Reflow Process and Thermal Cycle
Marco Rovitto - STMicroelectronics
Arianna Morelli - STMicroelectronics
Carlo Passagrilli - STMicroelectronics
Claudio Maria Villa - STMicroelectronics

Improvement of mechanical properties of Zn added Sn58Bi alloy by Zn segregation on the Sn-Bi phase boundaries during thermal aging
Shiqi Zhou - Osaka University
Omid Mokhtari - Osaka University
Hiroshi Nishikawa - Osaka University

Low Dielectric Properties Encapsulation for High Frequency Devices
Naoki Kanagawa - Panasonic Corporation
Daisuke Sasaki - Panasonic Corporation
Shigeru Yamatsu - Panasonic Corporation

Low Temperature Solder – A Breakthrough Technology for Surface Mounted Devices
Shubhada Sahasrabudhe - Intel Corporation
Scott Mokler - Intel Corporation
Mukul Renavikar - Intel Corporation
Sandeep Sane - Intel Corporation
Eric Brigham - Intel Corporation
Kevin Byrd - Intel Corporation
Owen Jin - Intel Corporation
Satish Parupalli - Intel Corporation
Nilesh Badwe - Intel Corporation

Experimental Assessment and Analysis of the Influence of Radiation on Through-silicon Vias
Qinghua Zeng - Peking University
Jing Chen - Peking University
Yufeng Jin - Peking University

Transient Liquid Phase Bonding Using AgSn-Alloys for Stress Reduced Sensor Mounting
Markus Feisst - University of Freiburg, IMTEK
Juergen Wilde - University of Freiburg, IMTEK

Die Warpage control applying UBM (Under bump metallurgy) on die back-side for fan-out package process applications
Hwan-Pil Park - Hanyang University
Kim Sungchul - Hanyang University
Young-Ho Kim - Hanyang University

3D System Integration beyond 100 GHz – Requirements, Limitations and Solutions
Philipp Schmidbauer - University of Erlangen-Nuremberg
Maciej Wojnowski - Infineon Technologies AG
Robert Weigel - University of Erlangen-Nuremberg
Amelie Hagelauer - University of Erlangen-Nuremberg

Influence of metallization and size on conductive properties of metal-coated polymer particles in anisotropic conductive adhesive
Molly Bazilchuk - Conpart AS
Jianying He - Norwegian Institute of Science and Technology
Helge Kristiansen - Conpart AS

Demonstration of a heterogeneously integrated System-on-Wafer (SoW) assembly
Adeel Ahmad Bajwa - UCLA/K&S
SivaChandra Jangam - UCLA
Randall Irwin - UCLA
Boris Vaisband - UCLA
Saptadeep Pal - UCLA
Mark Goorsky - UCLA
Subramanian Iyer - UCLA

Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging
Hong Zhang - Brewer Science
Xiao Liu - Brewer Science
Rama Puligadda - Brewer Science
Shawna RIckard - Brewer Science
Tony Flaim - Brewer Science

The reliability of thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 um pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA) and effect of NCA trapping
Jae-Yong Park - Hanyang University
Hwan-Pil Park - Hanyang University
Seongchul Kim - Hanyang University
Taeyoung Lee - Korea Institute Industrial Technology
Sehoon Yoo - Korea Institute Industrial Technology
Young-Ho Kim - Hanyang University

Performance of fine and ultra-fine lead-free powders for solder paste applications
Amir Nobari - 5N Plus Micro Powders Inc.
Yannig Thomas - National Research Council Canada
Arslane Bouchemit - École Polytechnique de Montréal

Laser Based Full Cut Dicing Evaluations for Thin Si wafers
Jeroen van Borkulo - ASM Pacific technology
Paul Verburg - ASM Pacific technology
Richard van der Stam - ASM Pacific technology

Thermal Design and Characterization of High Power SiC Inverter with Low Profile and Enhanced Thermal Performance
Gongyue Tang - IME
Tai Chong Chai - IME
Xiaowu Zhang - IME

Challenges of Large Body FCBGA on Board Level Assembly and Reliability
Fletcher (Cheng Piao) Tung - Siliconware Precision Industries Co., Ltd.

Optimization of Via Bottom Cleaning for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration
Youngsuk Kim - Tokyo Institute of Technology
S Kodama - Tokyo Institute of Technology
Y Mizushima - Tokyo Institute of Technology
N Araki - Tokyo Institute of Technology
C Hsiao - Industrial Technology Research Institute of Taiwan
H Chang - Industrial Technology Research Institute of Taiwan
C Lin - Industrial Technology Research Institute of Taiwan
T Ohba - Tokyo Institute of Technology

Design, fabrication and characterization of TSV interposer integrated 3D Capacitor for SIP applications
Jiwei Li - Xiamen University
Huan Liu - Peking University
Shenglin Ma - Xiamen University
Min Miu - Beijing Information Science and Technology University
Wei Wang - Peking University
Yufeng Jin - Peking University
Jing Chen - Peking University
Liulin Hu - Chengdu Garner Haiwei Co.,Ltd
Shuwei He - Chengdu Garner Haiwei Co.,Ltd

High Speed, Precision Small Chip Handling for Wafer-level Fan-out Packaging Application
Qianwen Chen - IBM Corporation
Li-wen Hung Bing Dang BO WEN Russell Budd Jae-woong Nah John Knickerbocker

A Novel Inorganic Substrate by Three Dimensionally Stacked Glass Core Technology
Toshiki Iwai - Fujitsu Laboratories, Ltd.
Taiji Sakai - Fujitsu Laboratories, Ltd.

High Reliability Sintered Silver-Indium Bonding with Anti-oxidation Property for High Temperature Applications
Chun An Yang - National Taiwan University
C. Robert Kao - National Taiwan University
Hiroshi Nishikawa - Osaka University
Chin C. Lee - University of California, Irvine

RF characterization, analysis and miniaturization impact of RDL interconnects
Kévin MOROT - ST-Microelectronics
Alexis FARCY - ST-Microelectronics
Rémi VELARD - ST-Microelectronics
Jean-Charles BARBE - CEA-LETI

Compact chip-scale atomic devices using interconnected micro-fabricated alkali vapor cells
Jin Zhang - Southeast University
Jintang Shang - Southeast University
Yu Ji - Southeast University
Ching-Ping Wong - The Chinese University of Hong Kong

Integrated Cu Heat Spreaders in Glass Fan-Out (GFO) Packages Using Near-Zero Resistance Thermal Interface Material (TIM) for High-Power Devices
Nithin Nedumthakady - Georgia Institute of Technology: Packaging Research Center
Bartlet DeProspo - Georgia Institute of Technology: Packaging Research Center
Venkatesh Sundaram - Georgia Institute of Technology: Packaging Research Center
P. Markondeya Raj - Georgia Institute of Technology: Packaging Research Center
Sean Garrison - Honeywell Federal Manufacturing and Technologies, LLC
Kyle Byers - Honeywell Federal Manufacturing and Technologies, LLC
Barbara Reed - Honeywell Federal Manufacturing and Technologies, LLC
Rao Tummala - Georgia Institute of Technology: Packaging Research Center

Investigation of material dynamic processes during shear test of heavy wire bond contacts
Robert Klengel - Fraunhofer IMWS
Sebastian Tismer - Fraunhofer IMWS
Falk Naumann - Fraunhofer IMWS
Sandy Klengel - Fraunhofer IMWS

Leading-edge and Ultra-thin 3D Glass-polymer 5G Modules with Seamless Antenna-to-transceiver Signal Transmissions
Atom Watanabe - Georgia Institute of Technology
Tong-Hong Lin - Georgia Institute of Technology
Tomonori Ogawa - Asahi Glass Company
Markondeya R. Pulugurtha - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Manos M. Tentzeris - Georgia Institute of Technology
Rao R. Tummala - Georgia Institute of Technology

Effect of Surface Finish and High Bi Solder Alloy on Component Reliability In Thermal Cycling
Sa'd Hamasha - Auburn University
Francy Akkara - Auburn University
Cong Zhao - Apple Inc.
Jeffery Suhling - Auburn University
John Evans - Auburn University

Electromigration and Mechanical Properties of the Whole Preferred Orientation Intermetallic Compound Interconnects for 3D Packaging
Mingliang Huang - Dalian University of Technology
Lin Zou - Dalian University of Technology