Technical Program
Session 39: Interactive PresentationsCommittee: Interactive Presentations
Events Center Exhibition Hall
Session Co-Chairs:
|
Nam Pham IBM Corporation T +1-512-286-8011 F +1-512-973-4240 npham@us.ibm.com |
| Mark Eblen Kyocera America T +1858-614-2537 mark.eblen@kyocera.com |
Papers:
Extraction of Electrical Properties of Nanomagnetic Materials through Meander-Shaped Inductor and Inverted-F Antenna Structures
Kyu Han - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
P. Markondeya Raj - Georgia Institute of Technology
Himani Sharma - Georgia Institute of Technology
K.P. Murali - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
Vijay Nair - Intel Corporation
Investigation of Integrated Passive Device with Through-Silicon Via
Kai Liu - STATS ChipPAC, Inc.
Robert Frye - RF Design Consulting
MaPhooPwint Hlaing - STATS ChipPAC, Inc.
YongTaek Lee - STATS ChipPAC, Inc.
HyunTai Kim - STATS ChipPAC, Inc.
Gwang Kim - STATS ChipPAC, Inc.
Billy Ahn - STATS ChipPAC, Inc.
Characterization of Al Wire Wedge Bonding in Power Electronics Package
Yumin Liu - Fairchild Semiconductor Corporation
Yong Liu - Fairchild Semiconductor Corporation
Daren Keller - Fairchild Semiconductor Corporation
Suresh Belani - Fairchild Semiconductor Corporation
Michael Dube - Fairchild Semiconductor Corporation
The Effect of Sintering Profile and Printed Layer Variations with Inkjet-Printed, Large-Area Applications
Vesa Pynttäri - Tampere University of Technology
Eerik Halonen - Tampere University of Technology
Matti Mäntysalo - Tampere University of Technology
Riku Mäkinen - Tampere University of Technology
Efficient Parametric Modeling and Analysis for Backplane Channel Characterization
Xiaoxiong Gu - IBM Corporation
Ki Jin Han - IBM Corporation, Ulsan National Institute of Science and Technology
Michael Cracraft - IBM Corporation
Renato Rimolo Donadio - IBM Corporation
Young Kwark - IBM Corporation
Refined but Handy Electrical Models of TSV Useable from Low to High Density and for RF or Fast Digital Signals in 3D-IC
L. Fourneaud - Université de Savoie
T. Lacrevaz - Université de Savoie
C. Bermond - Université de Savoie
J. Charbonnier - CEA-LETI
C.. Fuchs - CEA-LETI
A. Farcy - STMicroelectronics
Y. Gaeremynck - Université de Savoie
B. Flechet - Université de Savoie
Modular Assembly of Diode Lasers in a Compact and Reliable Setup for a Wide Range of Applications
A. Sahm - Ferdinand Braun Institute
C. Fiebig - Ferdinand Braun Institute
S. Spießberger - Ferdinand Braun Institute
M. Schiemangk - Humboldt-Universität zu Berlin
E. Luvsandamdin - Ferdinand Braun Institute
K. Paschke - Ferdinand Braun Institute
G. Erbert - Ferdinand Braun Institute
G. Tränkle - Ferdinand Braun Institute
Channel Design Methodology for 28Gbps SerDes FPGA Applications with Stacked Silicon Interconnect Technology
Namhoon Kim - Xilinx, Inc.
Daniel Wu - Xilinx, Inc.
Jack Carrel - Xilinx, Inc.
Joong-Ho Kim - Xilinx, Inc.
Paul Wu - Xilinx, Inc.
Aspects of Scaling to Mesoscale Models Derived from the Molecular Scale for Understanding Epoxy Interfaces
Nancy Iwamoto - Honeywell Performance Materials and Technologies
Design, Modeling, and Fabrication of mm3 Three-Dimensional Integrated Antennas
Peter Gadfort - North Carolina State University
Paul D. Franzon - North Carolina State University
Decoupling Optimization for IC-Package and PCB Systems Considering High Performance Microprocessor Core and Signal Interface Interactions
Om P. Mandhana - Sigrity, Inc.
A New Methodology for Board-Level Harmonic Analysis of Multi-Level Packages
Cheng-fu Chen - University of Alaska, Fairbanks
Comprehensive, Scalable Design Guidance for Serpentine Time Delay Variation in Digital System
Jaemin Shin - Qualcomm, Inc.
Timothy Michalka - Qualcomm, Inc.
Multiple Voltage-Supplies in TSV-Based Three-Dimensional (3D) Power Distribution Networks
Zheng Xu - Rensselaer Polytechnic Institute, IBM Corporation
Xiaoxiong Gu - IBM Corporation
Michael Scheuermann - IBM Corporation
Kenneth Rose - Rensselaer Polytechnic Institute
Buckwell C. Webb - IBM Corporation
John U. Knickerbocker - IBM Corporation
Jiang Qiang Lu - Rensselaer Polytechnic Institute
Thermal Evaluation and Analyses of 3D IC Integration SiP with TSVs for Network System Applications
Heng-Chieh Chien - ITRI
John H. Lau - ITRI
Yu-Lin Chao - ITRI
Ming-Ji Dai - ITRI
Ra-Min Tain - ITRI
L. Li - Cisco Systems, Inc.
P. Su - Cisco Systems, Inc.
J. Xue - Cisco Systems, Inc.
M. Brillhart - Cisco Systems, Inc.
Reverse Wire Bonding and Phosphor Printing for LED Wafer Level Packaging
Jeffery C.C. Lo - Hong Kong University of Science & Technology
S.W. Ricky Lee - Hong Kong University of Science & Technology
Rong Zhang - Hong Kong University of Science & Technology
Mei Li - Hong Kong University of Science & Technology
Non-Causal Behavior: The Cause for Concern
Wesley Martin - IBM Corporation
Jerry Bartley - IBM Corporation
Matt Doyle - IBM Corporation
Richard Ericson - IBM Corporation
George Zettles - IBM Corporation
Surface Plasmon-Assisted Terahertz Imaging Array
Kyoung Youl Park - Michigan State University
Collin S. Meierbachtol - Michigan State University
Nophadon Wiwatcharagoses - Michigan State University
Premjeet Chahal - Michigan State University
A Compact Thermal Model to Predict the Junction Temperature of High Power Light Emitting Diode Package
Run Hu - Huazhong University of Science & Technology
Zhangming Mao - Huazhong University of Science & Technology
Huai Zheng - Huazhong University of Science & Technology
Quan Chen - Huazhong University of Science & Technology
Sheng Liu - Huazhong University of Science & Technology
Xiaobing Luo - Huazhong University of Science & Technology
