Technical Program

Thursday, May 31, 2018

Session 39: Posters 3
9:00 AM - 11:00 AM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Nam Pham
IBM Corporation
T +1-512-286-8011
npham@us.ibm.com
Ibrahim Guven
Virginia Commonwealth University
T +1-804-827-3652
iguven@vcu.edu

Papers:

3D Stacking Process with Thermo-Sonic Bonding Using Non-conductive Film
Shigeru Yamatsu - Panasonic Corporation
Kazuki Watanabe - Panasonic Corporation
Naoki Kanagawa - Panasonic Corporation
Teppei Kojio - Panasonic Corporation
Takatoshi Ishikawa - Panasonic Corporation

2D Magnetic Inductors for DC-DC Converters on Glass Interposer
Vincent Lafage - Université de Sherbrooke
Yann Beillard - Université de Sherbrooke
Dominique Drouin - Université de Sherbrooke
Arvind Sridhar - IBM Research Zurich
Thomas Brunschwiler - IBM Research Zurich

Modeling and Characterization of a Hermetic Ceramic Package and Its Performance Impact on a 1.5-7V Input, 3-A, Radiation-Hardened Ultra-Low Dropout (LDO) Regulator
Javier Valle - Texas Instruments, Inc.
Ming Li - Texas Instruments, Inc.
Jeff Holloway - Texas Instruments, Inc.
Leon Stiborek - Texas Instruments, Inc.
Rajen Murugan - Texas Instruments, Inc.

Electrical Characterization of a High Speed HBM Interface for a Low Cost Interposer
Michael Dittrich - Fraunhofer IIS/EAS
Andy Heinig - Fraunhofer IIS/EAS
Fabian Hopsch - Fraunhofer IIS/EAS
- Fraunhofer IIS/EAS

Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D System-in- Packaging (SiP) Using Compact Through Glass Via (TGV)-Integrated Antennas
Seahee Hwangbo - University of Florida
Yong-Kyu Yoon - University of Florida
Aric Shorey - Corning, Inc.

Reliability of Sintered and Soldered High Power Chip Size Packages and Flip Chip LEDs
Alexander Hanss - Technische Hochschule Ingolstadt
Maximilian Schmid - Technische Hochschule Ingolstadt
Srikrishna Bhogaraju - Technische Hochschule Ingolstadt
Fosca Conti - University of Padova
Gordon Elger - Technische Hochschule Ingolstadt

Multi-Physics Modeling and Analysis of Plasmonic Terahertz Sources for High-Speed Wireless Communications in Terahertz Band
Mona Nafari - State University of New York at Buffalo
Josep Miquel Jornet - State University of New York at Buffalo

Comparison of Package-on-Package Technologies Utilizing Flip Chip and Fan-Out Wafer Level Packaging
Amy Lujan - SavanSys Solutions LLC

Fork Type Structure of Silicon Waveguide for Optical Coupling Efficiency Optimization
Warren Wang - Advanced Semiconductor Engineering, Inc
OnionZY Yang - Advanced Semiconductor Engineering, Inc
Shian Tu - Advanced Semiconductor Engineering, Inc
Meiju Lu - Advanced Semiconductor Engineering, Inc
Jihan Chen - Advanced Semiconductor Engineering, Inc
Vincent Lin - Advanced Semiconductor Engineering, Inc

MEMS Optical Packaging Technology Trends and Challenges
John Miranda - STATS ChipPAC, Inc.
TaeKeun Lee - STATS ChipPAC Korea Ltd.

Effect of Improved Optimization of DFE Equalization on Crosstalk and Jitter in High Speed Links with Multi-level Signal
Nana Dikhaminjia - Ilia State University
Han Deng - Missouri University of Science and Technology
Jiayi He - Missouri University of Science and Technology
M. Tsiklauri - Missouri University of Science and Technology
James Drewniak - Missouri University of Science and Technology
Arun Chada - Dell Inc.
Bhyrav Mutnury - Dell Inc.

Copper Transparent Antennas on Flexible Glass by Subtractive and Semi-Additive Fabrication for Automotive Applications
Jack Lombardi - Binghamton University
Robert Malay - Binghamton University
James Schaffner - HRL Laboratories
Hyok Jae Song - HRL Laboratories
Ming-Huang Huang - Corning, Inc.
Scott Pollard - Corning, Inc.
Mark Poliks - Binghamton University
Timothy Talty - General Motors

Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned Films
Gregory Ostrowicki - Texas Instruments, Inc.
Siva Gurrum - Texas Instruments, Inc.
Amit Nangia - Texas Instruments, Inc.

Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness
Haksan Jeong - Sungkyunkwan University
Woo-Ram Myung - Sungkyunkwan University
Kwang-Ho Jung - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

Design of a Compact Broadband Butler Matrix and its Application in Organic Beam-former at the 5 GHz Band
Chung-Yi Hsu - National Sun Yat-Sen University
Chia-Ling Chiang - National Sun Yat-Sen University
Lih-Tyng Hwang - National Sun Yat-Sen University
Fa-Shian Chang - Cheng Shiu University

Three Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods
Shui-Bao Liang - South China University of Technology
Chang-Bo Ke - South China University of Technology
Cheng Wei - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology

Electrical design for the development of FOWLP for HBM integration
Teck Guan Lim - Institute of Microelectronics
David Ho Soon Wee - Institute of Microelectronics

Accurate Electrical Modeling of Through Silicon Via with Minority Carrier Redistribution Effect
Huan Liu - Peking University
Runiu Fang - Peking University
Xin Sun - Peking University
Min Miao - Beijing Information Science and Technology University
Yufeng Jin - Shenzhen Graduate School of Peking University

Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices
Han Cai - Xiamen University
Shenglin Ma - Xiamen University
Wei Wang - Peking University
Yufeng Jin - Peking University
Jing Chen - Peking University
Weiwei Xiang - Southwest China Research Institute of Electronic Equipment
Jian Zhang - Southwest China Research Institute of Electronic Equipment
Liulin Hu - Chengdu Ganide Technology Co.,Ltd.
Shuwei He - Chengdu Ganide Technology Co.,Ltd.

Alternative Deposition Solution for Cost Reduction of TSV integration
Julien Vitiello - KOBUS
Fabien Piallat - KOBUS

Evaluation of Mechanical Stress Induced During IC Packaging
Vladimir Cherman - IMEC
Melina Lofrano - IMEC
Mario Gonzalez - IMEC
Francisco Cadacio Jr. - IMEC
Kenneth June Rebibis - IMEC
Eric Beyne - IMEC
Akihito Takano - Shinko Electric Industries Co. Ltd.
Mitsutoshi Higashi - Shinko Electric Industries Co. Ltd.

Wireless EAS Sensor Tags for Volatile Profiling in Food Packages
Saranraj Karuppuswami - Michigan State University
Mohd Ifwat Mohd Ghazali - Michigan State University
Saikat Mondal - Michigan State University
Premjeet Chahal - Michigan State University

High Throughput and Improved Edge Straightness for Memory Applications Using Stealth Dicing
Natsuki Suzuki - Tokyo Institute of Technology
Takayuki Ohba - Tokyo Institute of Technology
Yuta Kondo - Hamamatsu Photonics K.K.
Takeshi Sakamoto - Hamamatsu Photonics K.K.
Naoki Uchiyama - Hamamatsu Photonics K.K.
Kazuhiro Atsumi - Hamamatsu Photonics K.K.

Thick 3D Printed RF Components: Transmission Lines and Bandpass Filters
Mohd Ifwat Ghazali - Michigan State University
Premjeet Chahal - Michigan State University
Nophadon Wiwatcharagoses - King Mongkut’s University of Technology North Bangkok

Introduction of a New Metric for the Solder Joint Reliability Assessment of BGA Packages on System Level
Fabian Schempp - Robert Bosch GmbH
Marc Dressler - Robert Bosch GmbH
Daniel Kraetschmer - Robert Bosch GmbH
Friederike Loerke - Robert Bosch GmbH
Juergen Wilde - University of Freiburg, IMTEK

Compact Optical Coherent Receiver for Avionics Applications
Simon Ayotte - Teraxion
Ghislain Bilodeau - Teraxion
Jocelyn Blanchet-Létourneau - Teraxion
Michel Morin - Teraxion
Pascal Deladurantaye - Teraxion
Francois Costin - Teraxion
André Babin - Teraxion
Louis-Philippe Perron - Teraxion
Guillaume Brochu - Teraxion
C.-A. Davidson - Teraxion
D. D'Amato - Teraxion

Parylene as a Dielectric Material for Electronic applications in Space
Franz Selbmann - Fraunhofer ENAS
Mario Baum - Fraunhofer ENAS
Maik Wiemer - Fraunhofer ENAS
Yvonne Joseph - TU Bergakademie Freiberg
Thomas Otto - Fraunhofer ENAS