Technical Program

Thursday, May 31, 2018

Session 39: Posters 3
9:00 AM - 11:00 AM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Nam Pham
IBM Corporation
T +1-512-286-8011
npham@us.ibm.com
Ibrahim Guven
Virginia Commonwealth University
T +1-804-827-3652
iguven@vcu.edu

Tz-Cheng Chiu
National Cheng Kung University
T +886-6-2757575
tcchiu@mail.ncku.edu.tw

Frank Wei
Disco Japan
T +81-3-4590-1035
frank_w@disco.co.jp

Papers:

In-situ stress determination of electroless Cu on PCB-relevant substrates
Tobias Bernhard - Atotech Deutschland GmbH
Ralf Bruening - Physics Department, Mount Allison University

3D Stacking Process with Thermo-Sonic Bonding using Non-Conductive Film
Shigeru Yamatsu - Panasonic Corporation
Kazuki Watanabe Naoki Kanagawa Teppei Kojio Takatoshi Ishikawa

2D magnetic inductors for DC-DC converters on glass interposer
Vincent Lafage - Université de Sherbrooke
Yann Beillard - Université de Sherbrooke
Dominique Drouin - Université de Sherbrooke

3D RDS(ON) Modeling and Characterization of a Hermetic Ceramic Package and its Performance Impact on a 1.5-7V Input, 3-A, Radiation-Hardened Ultra-Low Dropout (LDO) Regulator
Javier Valle - Texas Instruments, Inc.
Ming Li - Texas Instruments, Inc.
Jeff Holloway - Texas Instruments, Inc.
Leon Stiborek - Texas Instruments, Inc.
Rajen Murugan - Texas Instruments, Inc.

A Monte Carlo Approach to Predicting Failure Across Multiple Temperature and Humidity Field Environments
Jonathon Tucker - Microsoft Corporation
Ramji Dhakal - Microsoft Corporation
George Thiel - Microsoft Corporation
Virendra Jadhav - Microsoft Corporation

Electrical characterization of a high speed HBM interface for a low cost interposer
Andy Heinig - Fraunhofer IIS/EAS
Fabian Hopsch - Fraunhofer IIS/EAS
Robert Trieb - Fraunhofer IIS/EAS
Michael Dittrich - Fraunhofer IIS/EAS

Millimeter-wave Wireless Chip-to-chip (C2C) Communications in 3D System in Packaging (SiP) using Compact Through Glass Via (TGV)-integrated Antennas
Seahee Hwangbo - University of Florida
Yong-Kyu Yoon - University of Florida
Aric Shorey - Corning, Inc.

Reliability of Sintered and Soldered High Power Chip Size Packages and Flip Chip LEDs
Alexander Hanss - Technische Hochschule Ingolstadt
Maximilian Schmid - Technische Hochschule Ingolstadt
Gordon Elger - Technische Hochschule Ingolstadt
Srikrishna Bhogaraju - Technische Hochschule Ingolstadt
Fosca Conti - University of Padova

Multi-physics Modeling and Analysis of Plasmonic Terahertz Sources for High-speed Wireless Communications in Terahertz Band?
Mona Nafari - State University of New York at Buffalo
Josep Miquel Jornet

Comparison of Package-on-Package Technologies Utilizing Flip Chip and Fan-Out Wafer Level Packaging
Amy Lujan - SavanSys Solutions LLC

Fork Type Structure of Silicon Waveguide for Optical Coupling Efficiency Optimization
Meiju Lu - Advanced Semiconductor Engineering, Inc

MEMS Optical Packaging Technology Trends and Challenges
John Miranda - STATS ChipPAC, Inc.
TaeKeun Lee - STATS ChipPAC Korea Ltd.

Effect of improved optimization of DFE equalization on crosstalk and jitter in high speed links with multi-level signal
Nana Dikhaminjia - Ilia State University
Han Deng - Missouri S&T
Jiayi He - Missouri S&T
James Drewniak - Missouri S&T
Arun Chada - Dell Inc.
Bhyrav Mutnury - Dell Inc

Transparent Copper Antennas on Flexible Glass by Subtractive and Semi-Additive Fabrication for Automotive Applications
Jack Lombardi - Binghamton University
Robert Malay - Binghamton University
James Schaffner - HRL Laboratories
Hyok Jae Song - HRL Laboratories
Ming-Huang Huang - Corning, Inc.
Scott Pollard - Corning, Inc.
Mark Poliks - Binghamton University

Correlated Model For Wafer Warpage Prediction of Arbitrarily Patterned Films
Gregory Ostrowicki - Texas Instruments, Inc.
Siva Gurrum - Texas Instruments, Inc.
Amit Nangia - Texas Instruments, Inc.

Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness
Haksan Jeong - Sungkyunkwan University
Woo-Ram Myung - Sungkyunkwan University
Kwang-Ho Jung - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

Design of a Miniaturized, Organic Butler Matrix and its Application in Array Antenna Beam-former at the 5 GHz Band
Chung-Yi Hsu - National Sun Yat-Sen University
Chia-Ling Chiang - National Sun Yat-Sen University
Lih-Tyng Hwang - National Sun Yat-Sen University

Three Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods
Shui-Bao Liang - South China University of Technology, China
Chang-Bo Ke - South China University of Technology, China
Cheng Wei - South China University of Technology, China
Min-Bo Zhou - South China University of Technology, China
Xin-Ping Zhang - South China University of Technology, China

FOWLP electrical design and analysis for HBM integration
Teck Guan Lim - IME

Accurate Electrical Modeling of Through Silicon Via with Minority Carrier Redistribution Effect
Huan Liu - Peking University
Runiu Fang - Peking University
Xin Sun - Peking University
Min Miao - Beijing Information Science and Technology University
Yufeng Jin - Shenzhen Graduate School of Peking University

Thermal and Electrical characterization of TSV interposer embedded with Microchannel for 2.5D integration of GaN RF devices
Han Cai - Department of Electrical Engineering, Xiamen University
Shenglin Ma - Department of Electrical Engineering, Xiamen University
Wei Wang - Peking University
Yufeng Jin - Peking University
Jing Chen - Peking University
Weiwei Xiang - Southwest China Research Institute of Electronic Equipment
Jian Zhang - Southwest China Research Institute of Electronic Equipment
Liulin Hu - Chengdu Ganide Technology Co.,Ltd.
Shuwei He - Chengdu Ganide Technology Co.,Ltd.

Alternative deposition solution for cost reduction of TSV integration
Julien VITIELLO - KOBUS
Fabien PIALLAT - KOBUS

Evaluation of Mechanical Stress induced during IC packaging
Vladimir Cherman - IMEC
Melina Lofrano - IMEC
Mario Gonzalez - IMEC
Francisco Cadacio Jr. - IMEC
Kenneth June Rebibis - IMEC
Eric Beyne - IMEC
Akihito Takano - SHINKO ELECTRIC INDUSTRIES CO., LTD.
Mitsutoshi Higashi - SHINKO ELECTRIC INDUSTRIES CO., LTD.

Wireless EAS sensor tags for volatile profiling in food packages
Saranraj Karuppuswami - Michigan State University
Mohd Ifwat Mohd Ghazali - Michigan State University
Saikat Mondal - Michigan State University
Premjeet Chahal - Michigan State University

High Throughput and Improved Edge Straightness for Memory Applications using Stealth Dicing
Natsuki Suzuki - Tokyo Institute of Technology, FIRST, WOW Alliance
Yuta Kondo - Hamamatsu Photonics K.K.
Takeshi Sakamoto - Hamamatsu Photonics K.K.
Kazuhiro Atsuki - Hamamatsu Photonics K.K.
Naoki Uchiyama - Hamamatsu Photonics K.K.
Takayuki Oba - Tokyo Institute of Technology, FIRST, WOW Alliance

3D Transmission line and passive circuits with high Aspect ratio for Wafer level packaging
Mohd Ifwat Ghazali - Michigan State University
Nophadon Wiwatcharagoses - King Mongkut's University of Technology North Bangkok
Premjeet Chahal - Michigan State University

Introduction of a New Metric for the Solder Joint Reliability Assessment of BGA Packages on System Level
Fabian Schempp - Robert Bosch GmbH
Marc Dressler - Robert Bosch GmbH
Daniel Kraetschmer - Robert Bosch GmbH
Friederike Loerke - Robert Bosch GmbH
Juergen Wilde - University of Freiburg, IMTEK

Compact optical coherent receiver for avionics applications
Simon Ayotte - Teraxion
Ghislain Bilodeau - Teraxion
Jocelyn Blanchet-Létourneau - Teraxion
Michel Morin - Teraxion
Pascal Deladurantaye - Teraxion
Francois Costin - Teraxion
André Babin - Teraxion
Louis-Philippe Perron - Teraxion
Guillaume Brochu - Teraxion

Parylene as a dielectric material for electronic applications in space
Franz Selbmann - Fraunhofer ENAS

Comparison of electrical performance between FO WLP and Flip Chip packages
Dev Gupta - APSTL