Technical Program

Session 40: Interactive Presentations
Committee: Interactive Presentations
Room: Events Center Exhibition Hall

Session Co-Chairs:

Patrick Thompson
Texas Instruments, Inc.
T +1-214-567-0660
patrick.thompson@ti.com 		Rao Bonda
Amkor Technology
T +1-480-786-7749
Rao.Bonda@amkor.com

Papers:

Piezoresistive Stress Sensor for Inline Monitoring During Assembly and Packaging of QFN
Thomas Schreier-Alt - Fraunhofer IZM
Gerhard Chmiel - Elmos Semiconductor AG
Frank Ansorge - Fraunhofer IZM
Klaus-Dieter Lang - TU Berlin

Thermo-Mechanical Reliability of Copper-Filled and Polymer-Filled Through Silicon Vias in 3D Interconnects
Xiang Gao - Huazhong University of Science & Technology, Wuhan National Lab for Optoelectronics
Run Chen - Huazhong University of Science & Technology, Wuhan National Lab for Optoelectronics
Xuefang Wang - Huazhong University of Science & Technology, Wuhan National Lab for Optoelectronics
Xiaobing Luo - Huazhong University of Science & Technology,Wuhan National Lab for Optoelectronics
Sheng Liu - Huazhong University of Science & Technology, Wuhan National Lab for Optoelectronics

Electrochemical Reactions in Solder Mask of Flip Chip-Plastic Ball Grid Array Package
Kang-Wook Lee - IBM Corporation
Stephane Barbeau - IBM Corporation
Francois Racicot - IBM Corporation
Douglas Powell - IBM Corporation
Charles Arvin - IBM Corporation
Thomas Wassick - IBM Corporation
Joseph Ross - IBM Corporation

Design and Assembly Process Simulation for an Automotive Power Module
Yong Liu - Fairchild Semiconductor Corporation
Qiuxiao Qian - Fairchild Semiconductor Corporation
Byoungok Lee - Fairchild Semiconductor Corporation
Taekkeun Lee - Fairchild Semiconductor Corporation
Joonseo Son - Fairchild Semiconductor Corporation
Oseob Jeon - Fairchild Semiconductor Corporation

Investigation of Copper-Tin Transient Liquid Phase Bonding Reliability for 3D Integration
A. Garnier - CEA-LETI
C. Grémion - CEA-LETI
R. Franiatte - CEA-LETI
D. Bouchu - CEA-LETI
R. Anciant - CEA-LETI
S. Chéramy - CEA-LETI

Development of PCB Design Guide and PCB Deformation Simulation Tool for Slim PCB Quality and Reliability
Soonwan Chung - Samsung Electronics Company, Ltd.
Gyun Heo - Samsung Electronics Company, Ltd.
Jae Kwak - Samsung Electronics Company, Ltd.
Seunghee Oh - Samsung Electronics Company, Ltd.
Yongwon Lee - Samsung Electronics Company, Ltd.
Changsun Kang - Samsung Electronics Company, Ltd.
Tackmo Lee - Samsung Electronics Company, Ltd.

Thermal Cycling Effect on Intermetallic Formation with Various Surface Finish of Micro Bump Interconnect for 3D Package
Mu-Hsuan Chan - Siliconware Precision Industries Co., Ltd.
Yi-Chian Liao - Siliconware Precision Industries Co., Ltd.
Chun-Tang Lin - Siliconware Precision Industries Co., Ltd.
Kuan-Weir Chuang - Siliconware Precision Industries Co., Ltd.
Huei-Nuan Huang - Siliconware Precision Industries Co., Ltd.
Chi-Tung Yeh - Siliconware Precision Industries Co., Ltd.
Wen-Tsung Tseng - Siliconware Precision Industries Co., Ltd.
Jeng-Yuan Lai - Siliconware Precision Industries Co., Ltd.

Development of 300 mm TSV Interposer with Redistribution Layers on Both Sides Using MEMS Processes
S. Yoshimi - Dai Nippon Printing Co., Ltd., NMEMS Technology Research Organization
K. Fujimoto - Dai Nippon Printing Co., Ltd., NMEMS Technology Research Organization
M. Akazawa - Dai Nippon Printing Co., Ltd., NMEMS Technology Research Organization
H. Matsumoto - Dai Nippon Printing Co., Ltd.
H. Mawatari - Dai Nippon Printing Co., Ltd.
K. Suzuki - Dai Nippon Printing Co., Ltd.
T. Itoh - NMEMS Technology Research Organization, Advanced Industrial Science and Technology
R. Maeda - NMEMS Technology Research Organization, Advanced Industrial Science and Technology

Optical Transceiver Sub-System Package Based on SiOB with 8×14Gbps Two-Way Bandwidth
Fengman Liu - Institute of Microelectronics, Chinese Academy of Sciences
Binbin Yang - Institute of Microelectronics, Chinese Academy of Sciences
Baoxia Li - Institute of Microelectronics, Chinese Academy of Sciences
Haidong Wang - Institute of Microelectronics, Chinese Academy of Sciences
Lixi Wan - Institute of Microelectronics, Chinese Academy of Sciences

Understanding Loss Mechanisms of Passive Interconnects with Innovative/Cost Effective Structure Implementations for Supporting 28Gbps and Beyond Transmission
Namhoon Kim - Xilinx, Inc.
Joong-Ho Kim - Xilinx, Inc.
Ray Anderson - Xilinx, Inc.
Paul Wu - Xilinx, Inc.
Suresh Ramalingam - Xilinx, Inc.

Numerical Comparison of the Thermal Performance of 3D Stacking and Si Interposer Based Packaging Concepts
H. Oprins - IMEC
B. Vandevelde - IMEC
M. Badaroglu - IMEC
M. Gonzalez - IMEC
G. Van der Plas - IMEC
E. Beyne - IMEC

Investigation of Modern Electrically Conductive Adhesives for Die-Attachment in Power Electronics Applications
Johanna Ocklenburg - University of Freiburg
Eugen Rastjagaev - Infineon Technologies Austria AG
Jürgen Wilde - University of Freiburg

Shape Engineering of the Fillers in Stretchable, Electrically Conductive Adhesives: Its Effect on Percolation and Conductivity Change During Stretching
Zhuo Li - Georgia Institute of Technology
Kristen Hansen - Georgia Institute of Technology
Kyoung-Sik Moon - Georgia Institute of Technology
C.P. Wong - Georgia Institute of Technology, Chinese University of Hong Kong

Electrochemically Etched TSV for Porous Silicon Interposer Technologies
Paolo Nenzi - University of Rome
Konstantin Kholostov - University of Rome
Rocco Crescenzi - University of Rome
Hanna Bondarenka - BSUIR
Vitaly Bondarenko - BSUIR
Marco Balucani - University of Rome

Role of FBEOL Al Pads and Hard Dielectric for Improved Mechanical Performance in Lead-Free C4 Products
E. Misra - IBM Corporation
T. Daubenspeck - IBM Corporation
T. Wassick - IBM Corporation
K. Tunga - IBM Corporation
D. Questad - IBM Corporation
G. Osborne - IBM Corporation
T.M. Shaw - IBM Corporation
K. McLaughlin - IBM Corporation

Modeling and Simulation of the Comb Structure in the Presence of Imperfections
Zhang Luo - Huazhong University of Science & Technology, Wuhan National Laboratory for Optoelectronics
Sheng Liu - Huazhong University of Science & Technology, Wuhan National Laboratory for Optoelectronics
Gang Cao - Huazhong University of Science & Technology, Wuhan National Laboratory for Optoelectronics
Xiaojie Chen - Huazhong University of Science & Technology, Wuhan National Laboratory for Optoelectronics

Realization of Ultra-Low Power I/O
L. Shan - IBM Corporation
T. Dickson - IBM Corporation
Y. Kwark - IBM Corporation
C. Baks - IBM Corporation
D. Becker - IBM Corporation
R. Krabbenhoft - IBM Corporation
T. Chainer - IBM Corporation
S. Mueller - TU Hamburg
M. Hoshino - Zeon Corporation
J. Kodemura - Zeon Corporation
M. Hashimoto - Zeon Corporation
T. Jimbo - Zeon Chemicals

Assembly Level Digital Image Correlation under Reflow and Thermal Cycling Conditions
W.C. Ralph - Southern Research Institute
G.F. Raiser - Medtronic, Inc.

Thermo-Mechanical Simulations of a Copper to Copper Direct Bonded 3D TSV Chip-Package Interaction Test Vehicle
Ah-Young Park - SUNY Binghamton
Daniel Ferrone - SUNY Binghamton
Stephen Cain - SUNY Binghamton
Dae Young Jung - SUNY Binghamton
Bruce T. Murray - SUNY Binghamton
Seungbae Park - SUNY Binghamton
Klaus Hummler - SEMATECH

Characterization and Modeling of Copper TSVs for Silicon Interposers
D. Malta - RTI International
C. Gregory - RTI International
M. Lueck - RTI International
J. Lannon - RTI International
J. Lewis - RTI International
D. Temple - RTI International
P. DiFonzo - U.S. Department of Defense
F. Naumann - Fraunhofer IWM
M. Petzold - Fraunhofer IWM

Design, Fabrication and Assembly of a Novel Electrical and Microfluidic I/Os for 3-D Chip Stack and Silicon Interposer
Li Zheng - Georgia Institute of Technology
Yue Zhang - Georgia Institute of Technology
Muhannad S. Bakir - Georgia Institute of Technology

Homogenization of TSV Interposer and Quick Assessment of Its Thermomechanical Influence on 3D Packages
Cheng-Fu Chen - University of Alaska, Fairbanks

Post Assembly Warpage Prediction Using Refined Zigzag Element
Bahattin Kilic - Intel Corporation
Atila Barut - University of Arizona
Erdogan Madenci - University of Arizona

Atomistic Study of Welding of Carbon Nanotubes onto Metallic Substrates
Xiaohui Song - Wuhan National Lab for Optoelectronics, Henan Academy of Sciences
Mingxiang Chen - Wuhan National Lab for Optoelectronics
Zhinyin Gan - Wuhan National Lab for Optoelectronics