Technical Program

Thursday, May 31, 2018

Session 40: Posters 4
2:00 PM - 4:00 PM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Swapan Bhattacharya
Engent Inc.
T 770 280 4259
Mark Poliks
Binghamton University
T +1-607-727-7104


Practical Design Method to Reduce Crosstalk for Silicon Wafer Integrated Fan-Out Technology (SWIFT) Packages
HoJeong Lim - Amkor Technology, Inc.
JeongKyu Yang - Amkor Technology, Inc.
Ruben Fuentes - Amkor Technology, Inc.

Fully Inkjet-Printed Three-Dimensional Bandpass Filter on Liquid Crystal Polymer Substrate
Hsuan-Ling Kao - Chang Gung University
Cheng-Lin Cho - National Tsing Hua University

A Dynamic Bending Method for PoP Package Board Level Reliability Validation
Jeffrey Lee - iST-Integrated Service Technology Inc
Cheng-Chih Chen - iST-Integrated Service Technology Inc
Lane Brown - Motorola Lenovo
Esme Mehretu - Motorola Lenovo
Thomas O'Brien - Motorola Lenovo
Feng Lu - Motorola Lenovo

Eliminating Harmful Intermetallic Compound Phase in Silver Wire Bonding by Alloying Silver with Indium
Jiaqi Wu - University of California, Irvine
Chin C. Lee - University of California, Irvine

Cyanate Ester/Epoxy Co-curing System with Thermal Stabilizers for High Temperature Stability
Fan Wu - Georgia Institute of Technology
Bo Song - Georgia Institute of Technology
Kyoung-Sik Moon - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

Demonstration of 28 GHz Band Pass Filter Toward 5G Using Ultra Low Loss and High Accuracy Through Quartz Vias
Yoichiro Sato - Asahi Glass Co., Ltd.
Nobutaka Kidera - Asahi Glass Co., Ltd.

Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics
Shanshan Xu - University of Colorado, Boulder
Ryan Lewis - University of Colorado, Boulder
Rongfu Wen - University of Colorado, Boulder
Ronggui Yang - University of Colorado, Boulder
Y.C. Lee - University of Colorado, Boulder
Luu Nguyen Woochan Kim

Die Edge Crack Propagation Modeling for Risk Assessment of Advanced Technology Nodes
Patrick Justison - GLOBALFOUNDRIES

Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon Interposer
Matthias Wietstruck - IHP
Steffen Marschmeyer - IHP
Philipp Kulse - IHP
Thomas Voß - IHP
Marco Lisker - IHP
Andreas Krüger - IHP
Dirk Wolansky - IHP
Mirko Fraschke - IHP
Mehmet Kaynak - IHP

A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
Robert Klengel - Fraunhofer IMWS
Sandy Klengel - Fraunhofer IMWS
G. Schusser - Fraunhofer IMWS
M. Krause - Fraunhofer IMWS

Effect of Interaction Between Multiple Defects on Z-Depth Estimate in Lock-In Thermography Applications
Bharath Viswanath Ravi - Intel Corporation
Mayue Xie - Intel Corporation
Deepak Goyal - Intel Corporation

3D Integration of Physics System Using Foldable Packaging for MEMS Atomic Clocks
Jongcheol Park - National NanoFab Center
Tae Hyun Kim - National NanoFab Center
Hee Yeoun Kim - National NanoFab Center
Gil Sun Roh - National NanoFab Center
Gapseop Sim - National NanoFab Center
HaeCheol Hwang - National NanoFab Center
JinWon Ko - National NanoFab Center
Taeg Yong Kwon - Korea Research Institute of Standards and Science
Hyun Gue Hong - Korea Research Institute of Standards and Science

Practical High Speed PCB Stackup Tool – Generation and Validation
Wei Jiang - Cisco Systems, Inc
Kevin Cai - Cisco Systems, Inc
Bidyut Sen - Cisco Systems, Inc
Guoan Wang - University of South Carolina

A Volatile Molecular Sensor Using Terahertz Resonators on Porous Substrates
Saranraj Karuppuswami - Michigan State University
Jennifer Byford - Michigan State University
Premjeet Chahal - Michigan State University

Effects of the Adhesion Strength on the Bending Fatigue Behavior of Cu Pattern Laminated Fabrics Using B-Stage Non-conductive Films (NCFs)
Seung-Yoon Jung - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Process Development of 4-die Stack Module Using Moldable Underfill
Ser Choong Chong - Institute of Microelectronics
Hongyu Li - Institute of Microelectronics
Ling Xie - Institute of Microelectronics
Siak Boon Lim - Institute of Microelectronics
Zhaohui Chen - Institute of Microelectronics

Integrated Fully Solid-State Capacitor Based on Carbon Nanofibers and Dielectrics
Rickard Andersson - Smoltek AB
Amin Muhammad Saleem - Smoltek AB
Vincent Desmaris - Smoltek AB

Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF(Chip-in-Flex) Packages at Humid Conditions
Tae-Ik Lee - Korea Advanced Institute of Science and Technology
Taek-Soo Kim - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Warpage Simulation/ Experiments and Analysis of 12” Wafer Level Fan-out Packaging Technology
Jia-Shen Lan - National Sun Yat-sen University
Shang Lee - Advanced Semiconductor Engineering Inc.
Yaochen Wang - Advanced Semiconductor Engineering Inc.
Brian Wu - Advanced Semiconductor Engineering Inc.
Mei-Ling Wu - National Sun Yat-sen University

On Using Packaging Parasitics to Implement a Tunable Matching Circuit for Low Power Wake-Up Receivers
Jack Ou - California State University Northridge

Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications
Jie Geng - Indium Corporation
Hongwen Zhang - Indium Corporation
Francis Mutuku - Indium Corporation
Ning-Cheng Lee - Indium Corporation

Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages
Scott McCann - Xilinx, Inc
HoHyung Lee - Xilinx, Inc
Gamal Refai-Ahmed - Xilinx, Inc
Tom Lee - Xilinx, Inc
Suresh Ramalingam - Xilinx, Inc

Effect of Shallow Cycling on Flexible Power-Source Survivability under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion
Pradeep Lall - Auburn University
Amrit Abrol - Auburn University
Jason Marsh - NextFlex
Ben Leever - US AFRL

Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints
Abdullah Fahim - Auburn University
Sudan Ahmed - Auburn University
Jeffrey Suhling - Auburn University
Pradeep Lall - Auburn University

Fan-Out Wafer-Level Packaging for Heterogeneous Integration
Ming Li - ASM
Margie Li - ASM
Iris Xu - JCAP
Tony Chen - JCAP
Qing Xiang Yong - JCAP
Zhong Cheng - JCAP
Nelson Fan - ASM
Eric Kuah - ASM
Zhang Li - JCAP
Kim Hwee Tan - JCAP
Y. M. Cheung - ASM