1. Characterization of Warpage of Ultra-Low-K Dielectric Materials and Correlation With Modulus and Coefficient of Thermal Expansion
Mohanalingam Kathaperumal — Georgia Institute of Technology
Pragna Bhaskar — Georgia Institute of Technology
Austin Toro — Georgia Institute of Technology
Pratik Nimbalkar — Georgia Institute of Technology
Lila Dahal — Georgia Institute of Technology
Muhannad Bakir — Georgia Institute of Technology
2. A Highly-Reliable and Cost-Effective Approach by Reducing Flux Cleaning in Chiplet Processes Through Underfill Curing in a Pneumatic Ambient
Huan-Ping Su — Ableprint Technology Co., Ltd.
Ming-Hua Hsu — Ableprint Technology Co., Ltd.
Auger Horng — Ableprint Technology Co., Ltd.
3. 300 nm Pitch W2W HBI for CFET and 3D DRAM Through Module Co-Optimization
Tyler Sherwood — Applied Materials, Inc.
Raghav Sreenivasan — Applied Materials, Inc.
Masha Gorchichko — Applied Materials, Inc.
Amit Prakash — Applied Materials, Inc.
Raghuveer Patlolla — Applied Materials, Inc.
Sarabjot Singh — Applied Materials, Inc.
Yoocharn Jeon — Applied Materials, Inc.
Jason Appell — Applied Materials, Inc.
Ryan Ley — Applied Materials, Inc.
Kun Li — Applied Materials, Inc.
David Hafner — EV Group, Inc.
4. Mechanical Characterization and Modeling of iSAC Lead-Free Solder
Golam Rakib Mazumder — Auburn University
Souvik Chakraborty — Auburn University
Mahbub Alam Maruf — Auburn University
Mohammad Al Ahsan — Auburn University
Jeffrey Suhling — Auburn University
Pradeep Lall — Auburn University
5. High Temperature RF Measurements Using Novel SiO2 Cables With Edge Launch Connectors
Firas Alshatnawi — Binghamton University
Ashraf Umar — Binghamton University
Emuobosan Enakerakpo — Binghamton University
Mohamed Abdelatty — Binghamton University
W.T. Alshaibani — Binghamton University
Mohammed Alhendi — Binghamton University
David Shaddock — Binghamton University
Peter Borgesen — Binghamton University
Mark Poliks — Binghamton University
6. Modeling and 3D Additively Manufactured Inductors on Complex Shape for Extreme High Temperature Electronics
Waleed Alshaibani — Binghamton University
Ashraf Umar — Binghamton University
Firas Alshatnawi — Binghamton University
Emuobosan Enakerakpo — Binghamton University
Mohamed Abdelatty — Binghamton University
David Shaddock — General Electric Company
Mohammed Alhendi — Binghamton University
Mark D. Poliks — Binghamton University
7. Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package
Wen-Yu Teng — Siliconware Precision Industries Co., Ltd.
Liang-Yih Hung — Siliconware Precision Industries Co., Ltd.
Jackson Lee — Siliconware Precision Industries Co., Ltd.
Debby Li — Siliconware Precision Industries Co., Ltd.
Carl Chen — Siliconware Precision Industries Co., Ltd.
Don-Son Jiang — Siliconware Precision Industries Co., Ltd.
Yu-Po Wang — Siliconware Precision Industries Co., Ltd.
8. Comparison of Organic and Inorganic Dielectric Hybrid Bonding With Highly <111>-Oriented Nanotwinned Cu
Pin-Syuan He — National Yang Ming Chiao Tung University
Chih Chen — National Yang Ming Chiao Tung University
10. One-step Surface Modification for Boron Nitride and its Polymer Composite of Enhanced Thermal Conductivity for Advanced Packaging Applications
Zihao Lin — Georgia Institute of Technology
Jiaxiong Li — Georgia Institute of Technology
Zhijian Sun — Georgia Institute of Technology
Andrew Fang — Walton High School
Kyoung-Sik Moon — Georgia Institute of Technology
Ching-Ping Wong — Georgia Institute of Technology
11. Investigation on the Use of Al-Ge Eutectic Bonding in the Structural Part of a Multilayer Stacked MEMS Device
Jun Wang — imec
Manuel Mannarino — imec
Jakob Visker — imec
Shuo Kang — imec
Günther Weidlinger — EV Group, Inc.
Tobias Wernicke — EV Group, Inc.
Jürgen Burggraf — EV Group, Inc.
Markus Wimplinger — EV Group, Inc.
Bivragh Majeed — imec
Lan Peng — imec
Gauri Karve — imec
Luc Haspeslagh — imec
12. Limits for Dicing Speed Based on Crack Stop Constructions With Different Levels of Robustness
Maria Heidenblut — Infineon Technologies AG
Michael Goroll — Infineon Technologies AG
Stefan Kaiser — Infineon Technologies AG
Andreas Bauer — Infineon Technologies AG
Kristina Hopfauf — Infineon Technologies AG
13. Vertical Stacking of Heterogeneous Chiplets of Duplexer on LNA/SOI
Tai Chong Chai — Institute of Microelectronics A*STAR
Rotaru Dragos Mihai — Institute of Microelectronics A*STAR
Xiangyu Wang — Institute of Microelectronics A*STAR
Pei Siang Sharon Lim — Institute of Microelectronics A*STAR
Lin Ji — Institute of Microelectronics A*STAR
Rathin Mandal — Institute of Microelectronics A*STAR
Raju Mani — Institute of Microelectronics A*STAR
Ming Chinq Jong — Institute of Microelectronics A*STAR
Yong Liang Ye — Institute of Microelectronics A*STAR
14. Multi Chip Stacked Memory Module Development Using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications
Nagendra Sekhar Vasarla — Institute of Microelectronics A*STAR
Dileep Kumar Mishra — Institute of Microelectronics A*STAR
Sasi Kumar Tippabhotla — Institute of Microelectronics A*STAR
Chandra Rao Bhesetti — Institute of Microelectronics A*STAR
Ser Choong Chong — Institute of Microelectronics A*STAR
King-Jien Chui — Institute of Microelectronics A*STAR
Srinivasa Rao Vempati — Institute of Microelectronics A*STAR
15. Challenges and Error Estimation in Immersion Cooling Liquid Dk-Df Extraction Using Different Methods
Saikat Mondal — Intel Corporation
Xenofon Konstantinou — Intel Corporation
Cemil Geyik — Intel Corporation
Zhichao Zhang — Intel Corporation
Kemal Aygun — Intel Corporation
16. Fluidic Self Alignment for Hybrid Bonding Using Intel Process
Feras Eid — Intel Corporation
Yi Shi — Intel Corporation
Golsa Naderi — Intel Corporation
Shashi Bhushan Sinha — Intel Corporation
Rob Jordan — Intel Corporation
Wenhao Li — Intel Corporation
Charles El Helou — Intel Corporation
Felipe Bedoya — Intel Corporation
Anandi Roy — Intel Corporation
Tayseer Mahdi — Intel Corporation
Jiun-Ruey Chen — Intel Corporation
Brandon M Rawlings — Intel Corporation
17. An Advanced Remote-Plasma Assisted Ozone-Ethylene-Radical (OER) Process for Cu-SiO2 Hybrid Bonding Yield Enhancement
Tatsunori Shino — MEIDEN NANOPROCESS INNOVATIONS, Inc.
Mariappan Murugesan — NICHe
Kiyoharu Mori — NICHe
Bungo Tanaka — Tohoku University
Eitaro Toyama — MEIDEN NANOPROCESS INNOVATIONS, Inc.
Tetsuya Nishiguchi — MEIDEN NANOPROCESS INNOVATIONS, Inc.
Takafumi Fukushima — Tohoku University
18. Influence of Temporary Rigid Carrier Structure on Warpage During Wafer/Panel Level Packaging
Yoshinori Matsuura — Mitsui Mining & Smelting Co., Ltd.
Joji Fujii — Mitsui Mining & Smelting Co., Ltd.
Vivek Dutta — Mitsui Mining & Smelting Co., Ltd.
19. Extremely Advanced Substrate as an Integrated Package Solution (iPaS) for Next Generation High Performance Computing (HPC) Applications
Tatsuya Kitamura — Murata Manufacturing Co., Ltd.
Takeshi Furukawa — Murata Manufacturing Co., Ltd.
Shuhei Yamada — Murata Manufacturing Co., Ltd.
Koshi Himeda — Murata Manufacturing Co., Ltd.
Atsushi Yamamoto — Murata Manufacturing Co., Ltd.
21. A CMP Process for Hybrid Bonding Application With Conventional / nt-Cu and SixNy / SixOy Dielectrics
Tri Widodo — Intel Corporation
Yi Shi — Intel Corporation
Xavier F Brun — Intel Corporation
Prayudi Lianto — Applied Materials, Inc.
Avery Tan — Applied Materials, Inc.
Joselyn Lie — Applied Materials, Inc.
Patrick Lim — Applied Materials, Inc.
Guan Huei See — Applied Materials, Inc.
22. Effect of Material Aging on the Reliability of An Automotive BGA Device Under TC Test Conditions
Abdullah Fahim — NXP Semiconductor, Inc.
Ryan Zhang — NXP Semiconductor, Inc.
Amar Mavinkurve — NXP Semiconductor, Inc.
Sandeep Shantaram — NXP Semiconductor, Inc.
Ali Rezaie Adli — NXP Semiconductor, Inc.
Wiwat Tanwongwan — NXP Semiconductor, Inc.
Torsten Hauck — NXP Semiconductor, Inc.
23. Overlay Challenges of Extremely Large Exposure Field, Fine Resolution Lithography Due to Alignment Solution Errors and a Solution Using Early Zone Corrections in Advanced IC Substrates
John Chang — Onto Innovation
Xin Song — Onto Innovation
Timothy Chang — Onto Innovation
24. World’s Smallest, Membrane-Based Capacitive Differential Pressure Sensor- Package Structure, Material Selection, Assembly Challenges & Solutions
KM Rafidh Hassan — Renesas Electronics America
Gaurav Mehrotra — Renesas Electronics America
Hazel Caballero — Renesas Electronics America
Young Kim — Renesas Electronics America
Steven Lee — Renesas Electronics America
Karim Allidina — MEMS Vision International, Inc.
Tommy Tsang — MEMS Vision International, Inc.
Mohannad Elsayed — MEMS Vision International, Inc.
Hani Tawfik — MEMS Vision International, Inc.
25. Packaging Challenges and Solutions for Next Generation Low-Profile WLCSP
Humi (Shih-Wen) Tang — Renesas Electronics Corporation
Jerry (Che-Han) Li — Renesas Electronics Corporation
Jessie (Yu-Shan) Wei — Renesas Electronics Corporation
Baltazar Canete — Renesas Electronics Corporation
Leo (Hsin-Hung) Huang — Renesas Electronics Corporation
Jesus Mennen Belonio — Renesas Electronics Corporation
26. A Study on Novel Low Temperature Soldering Process Using Vapor phase
Youngja Kim — Samsung Electronics Co., Ltd.
Woojin Choi — Samsung Electronics Co., Ltd.
Seungyeop Oh — Samsung Electronics Co., Ltd.
Sinyeob Lee — Samsung Electronics Co., Ltd.
Sunwon Kang — Samsung Electronics Co., Ltd.
27. Numerical Study on Hybrid Discontinuous Microchannel Heat Ink Combining Manifold With Pin Fins (DMC-MPF) for High Power Electronic Device
Jianyu Du — Peking University
Lang Chen — Peking University
Ran Hu — Peking University
Huaiqiang Yu — 26th Research Institute of China Electronics Technology Group Corporation
Chi Zhang — Peking University
Wei Wang — Peking University
28. Room-Temperature Hybrid Bonding of Via-Middle TSV Wafer Fabricated by Direct Si/Cu Grinding and Residual Metal Removal
Naoya Watanabe — National Institute of Advanced Industrial Science and Technology
Hiroshi Yamamoto — Okamoto Machine Tool Works, Ltd.
Takahiko Mitsui — Okamoto Machine Tool Works, Ltd.
32. Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packaging
Jay Li — Siliconware Precision Industries Co., Ltd.
Zen-Wei Zhang — Siliconware Precision Industries Co., Ltd.
Sam Lin — Siliconware Precision Industries Co., Ltd.
Vito Lin — Siliconware Precision Industries Co., Ltd.
Teny Shih — Siliconware Precision Industries Co., Ltd.
Nicholas Kao — Siliconware Precision Industries Co., Ltd.
Yu-Po Wang — SPIL
33. Panel Level Plasma Etching Characteristics for Advanced Packaging
Md Ishak Khan — Intel Corporation
Wei Wei — Intel Corporation
Haobo Chen — Intel Corporation
Xiyu Hu — Intel Corporation
Nicholas Haehn — Intel Corporation
Xiaoying Guo — Intel Corporation
Leonel Arana — Intel Corporation
Kensuke Akazawa — ULVAC, Inc.
34. Development of a Reusable Smart-Catheter System for Improved Urinary Health Monitoring
Zhi Dou — Binghamton University
W.T. AlShaibani — Binghamton University
Erika Solano Diaz — Binghamton University
Mohammed Alhendi — Binghamton University
Abdullah Obeidat — Binghamton University
Riadh Al-Haidari — Binghamton University
Mark Schadt — Binghamton University
Kara Allanach — CathBuddy, Inc.
Daniel Wollin — CathBuddy, Inc.
Souvik Paul — CathBuddy, Inc.
Mark Poliks — Binghamton University
35. Focal Extension – A Novel Lithography Technique to Enable Fine-Pitch Patterning on Large-Area Warped Substrate
Golam Sabbir — University of California, Los Angeles
Subramanian Iyer — University of California, Los Angeles
