Technical Program

Friday, June 01, 2018

Session 41: Posters 5
8:30 AM - 10:30 AM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Michael Mayer
University of Waterloo
T +1-519-888-4024
mmayer@uwaterloo.ca
Pavel Roy Paladhi
IBM Corporation
T +1-512-286-9677
Pavel.Roy.Paladhi@ibm.com

Papers:

Broad-Band Dielectric Probes for On-Wafer Characterization of Terahertz Devices
Jennifer Byford - Michigan State University
Premjeet Chahal - Michigan State University

Machine Learning Driven Advanced Packaging and Miniaturization of IoT for Wireless Power Transfer Solutions
Hakki Torun - Georgia Institute of Technolog
Colin Pardue - Georgia Institute of Technolog
Mohamed Belladredj - Georgia Institute of Technolog
Anto K. Davis - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technolog

Application of Additive Manufacturing Technologies for Realization of Multilayer Microstrip Directional Filter
Jakub Sorocki - AGH University of Science and Technology
Ilona Piekarz - AGH University of Science and Technology
John Papapolymerou - Michigan State University
Slawomir Gruszczynski - AGH University of Science and Technology
Krzysztof Wincza - AGH University of Science and Technology

3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges
Tiwei Wei - IMEC
Herman Oprins - IMEC
Vladimir Cherman - IMEC
Ingrid De wolf - IMEC
Eric Beyne - IMEC
S. Yang - KU Leuven
Martine Baelmans - KU Leuven

Design and Surface Modification of PET Substrates Using UV/Ozone Treatment for Roll-to-Roll Processed Solar Photovoltaic (PV) Module Packaging
Jinho Hah - Georgia Institute of Technology
Bo Song - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
Samuel Graham - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

A Wireless PZT Based Harmonic Tag for Remote Vibration Detection
Deepak Kumar - Michigan State University
Saikat Mondal - Michigan State University
Saranraj Karuppuswami - Michigan State University
Yiming Deng - Michigan State University
Premjeet Chahal - Michigan State University

A Study on the High Frequency Performance of solder ACFs Joints for Flex-on-Board Applications using Coplanar Waveguide
Shuye Zhang - Harbin Institute of Technology
Tiesong Lin - Harbin Institute of Technology
Peng He - Harbin Institute of Technology
Junyong Park - Korea Advanced Institute of Science and Technology
Gapyeol Park - Korea Advanced Institute of Science and Technology
Huijin Song - Korea Advanced Institute of Science and Technology
Joungho Kim - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Low-Temperature Cu-Cu Bonding by Anti-Oxidative Copper Nanoparticle Paste
Yun Mou - Huazhong University of Science and Technology
Yang Peng - Huazhong University of Science and Technology
Junjie Li - Huazhong University of Science and Technology
Hao Cheng - Huazhong University of Science and Technology
Xingxing Liu - Huazhong University of Science and Technology
Mingxiang Chen - Huazhong University of Science and Technology

Deep Understanding of the Role of Cu in RDL to Warpage by Exploring the Warpage Evolution with Microstructural Changes
Gong Cheng - Shanghai Institute of Microsystem and Information Technology
Gaowei Xu - Shanghai Institute of Microsystem and Information Technology
Wei Gai - Shanghai Institute of Microsystem and Information Technology
Le Luo - Shanghai Institute of Microsystem and Information Technology

A 56 Gbps I/O Interface Design with Exact Power Source Simulation - Total I/O Circuit Design with over 28 GHz from Driver to Receiver Device Models
Daisuke Ogawa - Meisei University
Daisuke Iguchi - Fuji Xerox Co., Ltd.
Yasutaka Wada - Meisei University
Kaoru Hashimoto - Meisei University
Yusuke Taira - Fuji Xerox Co., Ltd.
Nobutaka Hara - Fuji Xerox Co., Ltd.
Kanji Otsuka - Meisei University

Enhancements on Underfill Materials’ Thermal Conductivity by Insulation Coating Layer Control of Conductive Particles
Tae-Ryong Kim - Seoul National University/Ntrium
Kisu Joo - Ntrium Incorporation
Boo Taek Lim - National Nanofab Center
Sung-Soon Choi - Korea Electronics Technology Institute
Boung Ju Lee - National Nanofab Center
Se Young Jeong - Ntrium Incorporation
Euijoon Yoon - Seoul National University
Myung Jin Yim - Intel Corporation

Fabrication of Fe-4.5 wt.%Si Magnetic Cores for Power Electronic Converters by Selective Laser Melting
Wangyun Li - Loughborough University
Jing Wang - Loughborough University
Guang Chen - Loughborough University
Daniel Engstrom - Loughborough University
Changqing Liu - Loughborough University
Xinping Zhang - South China University of Technology
Adam Walker - University of Nottingham
Gaurang Vakil - University of Nottingham
Andrew Forsyth - University of Manchester

Accurate Core Alignment for Polymer Optical Waveguide in the Mosquito Method for High-Efficient Coupling
Yoshie Morimoto - Keio University
Kumi Date - Keio University
Takaaki Ishigure - Keio University

Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications
Josef Hansson - Chalmers University of Technology
Majid Kabiri Samani - Chalmers University of Technology
Andreas Nylander - Chalmers University of Technology
Lilei Ye - Smart High Tech AB
Nan Wang - Chalmers University of Technology
Torbjörn Nilsson - SAAB AB
Johan Liu - Chalmers University of Technology

Size and Shape Effect in the Determination of the Fracture Strength of Silicon Nitride in MEMS Structures at High Temperatures
Alex Axel Navarrete Gonzalez - University of Waterloo
Eric Brace - University of Waterloo
Patricia Nieva - University of Waterloo

A Study on the Curing Properties and Viscosities of Non-conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly
HanMin Lee - Korea Advanced Institute of Science and Technology
SeYong Lee - Korea Advanced Institute of Science and Technology
JongHo Park - Korea Advanced Institute of Science and Technology
Chang-kyu Chung - Samsung Electronics Company, Ltd.
Kyung-Woon Jang - Samsung Electronics Company, Ltd.
Il Kim - Samsung Electronics Company, Ltd.
SeongWoo Choi - Samsung Electronics Company, Ltd.
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Suspended Microstrip Low-Pass Filter Realized Using FDM Type 3D Printing with Conductive Copper-Based Filament
Ilona Piekarz - AGH University of Science and Technology
Jakub Sorocki - AGH University of Science and Technology
John Papapolymerou - Michigan State University
Slawomir Gruszczynski - AGH University of Science and Technology
Krzysztof Wincza - AGH University of Science and Technology

Modeling and Design of 2.5D Package with Mitigated Warpage and Enhanced Thermo-Mechanical Reliability
Jing Wang - State University of New York at Binghamton
Alexander Yatskov - Juniper Networks
Yuling Niu - Binghamton University
Seungbae Park - Binghamton University

Piezoelectric Ceramics and Flexible Printed Circuits (FPCs) Interconnection Using Anisotropic Conductive Films (ACFs) for Ultrasound Transducers Assembly
Jae-Hyeong Park - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Warpage Simulation for Fan-Out Wafer Level Packaging Investigation
Chun-Wei Hsiao - National Sun Yat-sen University
Mei-Ling Wu - National Sun Yat-sen University

Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications
Yunheng Sun - Peking University
Han Cai - Xiamen University
Jiwei Li - Xiamen University
Shenglin Ma - Xiamen University
Yufeng Jin - Peking University
Wei Wang - Peking University
Jing Chen - Peking University
Min Miao - Beijing Information Science and Technology University
Liulin Hu - Chengdu Ganide Technology
Shuwei He - Chengdu Ganide Technology