Technical Program
Session 41: Student Interactive PresentationsCommittee: Interactive Presentations
Events Center Exhibition Hall
Session Co-Chairs:
|
Nam Pham IBM Corporation T +1-512-286-8011 F +1-512-973-4240 npham@us.ibm.com |
| Mark Eblen Kyocera America T +1858-614-2537 mark.eblen@kyocera.com |
Papers:
Active Cooling Analysis of the Micro Pump used in IGBT Power Module
Ling Xu - Huazhong University of Science & Technology
Yang Zhou - Huazhong University of Science & Technology
Yang Zhang - Huazhong University of Science & Technology
Bulong Wu - Huazhong University of Science & Technology
Mingxiang Chen - Huazhong University of Science & Technology
Xiaobing Luo - Huazhong University of Science & Technology
Sheng Liu - Huazhong University of Science & Technology
High-Efficient Optics for Different LED Packaging Types in Forward-Lighting Application
Fei Chen - Huazhong University of Science and Technology
Kai Wang - Guangdong Real Faith Optoelectronics Inc.
Sheng Liu - Huazhong University of Science and Technology, Guangdong Real Faith Optoelectronics Inc.
Reliability and Microstructural Studies of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering
M. Mostofizadeh - Tampere University of Technology
K. Kokko - Tampere University of Technology
L. Frisk - Tampere University of Technology
Robust, Novel, and Low Cost Superhydrophobic Nanocomposites Coating for Reliability Improvement of Microelectronics
Yan Liu - Georgia Institute of Technology
Ziyin Lin - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
C.P. Wong - Georgia Institute of Technology, Chinese University of Hong Kong
ZnO Quantum Dots-Filled Encapsulant for LED Packaging
Yan Liu - Georgia Institute of Technology
Ziyin Lin - Georgia Institute of Technology
Xueying Zhao - Georgia Institute of Technology
Sehoon Yoo - Korea Institute of Industrial Technology (KITECH)
Kyoung-sik Moon - Georgia Institute of Technology
C.P. Wong - Georgia Institute of Technology, Chinese University of Hong Kong
Combination of Translucent Eu:YAG Glass Ceramic with LED Chip
Liang Yang - Huazhong University of Science & Technology, Wuhan National Laboratory for Optoelectronics
Zhicheng Lv - Huazhong University of Science & Technology, Wuhan National Laboratory for Optoelectronics
Mingxiang Chen - Huazhong University of Science & Technology, Wuhan National Laboratory for Optoelectronics
Sheng Liu - Huazhong University of Science & Technology. Wuhan National Laboratory for Optoelectronics
Vertically Aligned Nickel Nanowire/Epoxy Composite for Electrical and Thermal Conducting Material
Hyeong-Gi Lee - KAIST
Kyung-Wook Paik - KAIST
Resonance-Based Addressing in Laminate MEMS Devices
Minfeng Wang - University of California, Irvine
Yang Zhang - University of California, Irvine
G.P. Li - University of California, Irvine
Mark Bachman - University of California, Irvine
Low Latency High Throughput Memory-Processor Interface
Qidong Wang - Chinese Academy of Sciences
Daniel Guidotti - Chinese Academy of Sciences
Fujiang Lin - University of Science and Technology of China
Guang Zhu - University of Science and Technology of China
Jie Cui - Chinese Academy of Sciences
Qian Wang - Tsinghua University
Liqiang Cao - Chinese Academy of Sciences
Tianchun Ye - Chinese Academy of Sciences
Lixi Wan - Chinese Academy of Sciences
Double Stub Matching in Multilayered Printed Circuit Board using Vias
Andreas Hardock - TU Hamburg-Harburg
Renato Rimolo-Donadio - TU Hamburg-Harburg
Heinz-Dietrich Brüns - TU Hamburg-Harburg
Christian Schuster - TU Hamburg-Harburg
A Study on the Intermetallic Growth of Fine-Pitch Cu Pillar/SnAg Solder Bump for 3D-TSV Interconnection
Yong-Sung Park - KAIST
Ji-Won Shin - KAIST
Yong-Won Choi - KAIST
Kyung-Wook Paik - KAIST
The Role of Friction Coefficient on the Stitch Bondability in Pd Coated Cu and Bare Cu Wire Bonding
A. Rezvani - University of Waterloo
C. Nan - University of Waterloo
M. Mayer - University of Waterloo
I. Qin - Kulicke and Soffa, Inc.
A Novel Wafer-Level Metal/BCB Interconnection between Both Sides of Wafer using TSV and Its Microwave Performance
Jiajie Tang - Chinese Academy of Sciences
Xiao Chen - Chinese Academy of Sciences
Gaowei Xu - Chinese Academy of Sciences
Le Luo - Chinese Academy of Sciences
Metamaterial-Inspired Miniaturized Microwave Sensing Probes
Nophadon Wiwatcharagoses - Michigan State University
Kyoung Youl Park - Michigan State University
Premjeet Chahal - Michigan State University
Assembly and Alignment of Proximity Communication Enabled Multi-Chip Packages using Elastomeric Bump Interposers
Hyung Suk Yang - Georgia Institute of Technology
Hiren D. Thacker - Oracle
Ivan Shubin - Oracle
John E. Cunningham - Oracle
James G. Mitchell - Oracle
An Investigation on Structure and Materials of Laminated Organic Solar Cell Packaging
Xing Chen - Huazhong University of Science & Technology
Simin Wang - Huazhong University of Science & Technology
Zhang Luo - Huazhong University of Science & Technology
Shengzhi Zhang - Huazhong University of Science & Technology
Zhicheng Lv - Huazhong University of Science & Technology
Hao Jiang - Huazhong University of Science & Technology
Sheng Liu - Huazhong University of Science & Technology
Novel Core-Shell Nanocomposites for RF Embedded Capacitors: Processing and Characterization
Warda Benhadjala - Université de Bordeaux
Isabelle Bord - Université de Bordeaux
Laurent Béchou - Université de Bordeaux
Ephraim Suhir - University of California, Santa Cruz
Matthieu Buet - Polyrise SAS
Fabien Rougé - Polyrise SAS
Yves Ousten - Université de Bordeaux
40µm Ag/Au Composite Flip-Chip Interconnect using Solid State Atomic Bonding at 200°C
Wen P. Lin - University of California, Irvine
Chu-Hsuan Sha - University of California, Irvine
Chin C. Lee - University of California, Irvine
Embedded Actives for Terahertz Circuit Applications: Imaging Array
Xianbo Yang - Michigan State University
Premjeet Chahal - Michigan State University
Phosphor Size Dependence of Lumen Efficiency and Spatial CCT Uniformity for Typical White LED Emitters
Yun Shuai - University of California, Irvine
Nguyen T. Tran - University of California, Irvine
Jiun Pyng You - University of California, Irvine
Frank G. Shi - University of California, Irvine
Metamaterial Transmission Line Based Reconfigurable X-Band Phase Shifter Design
Nophadon Wiwatcharagoses - Michigan State University
Kyoung Youl Park - Michigan State University
Premjeet Chahal - Michigan State University
A Compact 100 MHz to 7 GHz Frequency Equalizer based on Distributed Passive Circuits
Xiaoyu Cheng - University of Florida
David E. Senior - University of Florida
Yong-Kyu Yoon - University of Florida
Nanomanufacturing of Large Area Carbon Nanofibers using Tube Nozzle Electrospinning (TNE), Lithography and Carbonization Processes
Pit Fee Jao - University of Florida
Sheng-Po Fang - University of Florida
David E. Senior - University of Florida
Kyong Tae Kim - University of Florida
Yong-Kyu Yoon - University of Florida
Highly Compact Surface Micromachined Metamaterial Circuits using Multilayers of Low-Loss Benzocyclobutene for Microwave and Millimeter Wave Applications
David E. Senior - University of Florida, Universidad Tecnológica de Bolívar
Xiaoyu Cheng - University of Florida
Yong-Kyu Yoon - University of Florida
60 GHz Tapered-Helix Antenna for WPAN Applications
Paolo Nenzi - University of Rome
Francesco Tripaldi - University of Rome
Frank Silvio Marzano - University of Rome
Fabrizio Palma - University of Rome
Marco Balucani - University of Rome
Liquid Encapsulation for Monochromatic LED Emitter Packages: Enhancement of Thermal-Optical Performance and Reliability
Jiun Pyng You - University of California, Irvine
Yu-Chou Shih - University of California, Irvine
Yeong-Her Lin - University of California, Irvine
Bohan Yan - University of California, Irvine
Frank G. Shi - University of California, Irvine
The Process and Reliability Tests of Glass-to-Glass Laser Bonding for Top-Emission OLED Device
Yuneng Lai - Shanghai University
Zunmiao Chen - Shanghai University
Yuanhao Huang - Shanghai University
Jianhua Zhang - Shanghai University
