Technical Program

Friday, June 01, 2018

Session 41: Posters 5
8:30 AM - 10:30 AM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Michael Mayer
University of Waterloo
T +1-519-888-4024
mmayer@uwaterloo.ca
Pavel Roy Paladhi
IBM Corporation
T +1-512-286-9677
Pavel.Roy.Paladhi@ibm.com

Vaidyanathan Chelakara
Ciena Corporation
T +1-613-670-2472
cvaidyan@ciena.com

Suresh K. Sitaraman
Georgia Institute of Technology
T +1-404-894-3405
suresh.sitaraman@me.gatech.edu

Papers:

Broad-band Dielectric Probes for On-Wafer Characterization of Terahertz Devices
Jennifer Byford - Michigan State University
Karsun Proudfoot - Michigan State University
Saranraj Karuppuswami - Michigan State University
Premjeet Chahal - Michigan State University

3D Printed High Aspect Ratio Structures for the Design of Low-loss Filter
Mohd Ifwat Mohd Ghazali - Michigan State University
Kyoung Youl Park - Agency for Defense Development, Daejeon, Republic of Korea
Nophadon Wiwatcharagoses - King Mongkut's University of Technology North Bangkok
Premjeet Chahal - Michigan State University

A Novel Integration of Stereolithography and Inkjet Printing for Multichip Modules with High Frequency Packaging Applications
Ryan Bahr - Georgia Institute of Technology
Bijan Teharani - Georgia Institute of Technology
Kyle Byers - Honeywell International, Inc.
Manos Tentzeris - Georgia Institute of Technology

Machine Learning driven Advanced Packaging and Miniaturization of IoT for Wireless Power Transfer Solutions
Hakki Torun - School of ECE, C3PS, Georgia Tech
Colin Pardue - School of ECE, C3PS, Georgia Tech
Mohamed Belladredj - School of ECE, C3PS, Georgia Tech
Anto K. Davis - School of ECE, C3PS, Georgia Tech
Madhavan Swaminathan - School of ECE, C3PS, Georgia Tech

Application of Additive Manufacturing Technologies for Realization of Multilayer Microstrip Directional Filter
Ilona Piekarz - AGH University of Science and Technology
Jakub Sorocki - AGH University of Science and Technology
John Papapolymerou - Michigan State University
Slawomir Gruszczynski - AGH University of Science and Technology
Krzysztof Wincza - AGH University of Science and Technology

3D printed liquid jet impingement cooler: demonstration, opportunities and challenges
Tiwei Wei - IMEC
Herman Oprins - IMEC
Vladimir Cherman - IMEC
Ingrid De wolf - IMEC
Eric Beyne - IMEC
Martine Baelmans - KU Leuven

Design of Adhesive Materials for Roll-to-Roll Processed Solar Photovoltaic (PV) Module Packaging
Bo Song - Georgia Institute of Technology
Jinho Hah - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

A wireless PZT based harmonic tag for remote vibration detection
Deepak Kumar - MSU
Saikat Mondal - MSU
Saranraj Karuppuswami - MSU
Yiming Deng - MSU
Premjeet Chahal - MSU

A Study on the High Frequency Performance and Physical Modelling of ACFs joints using Coplanar Waveguide for Flex-on-board Applications
Shuye Zhang - Harbin Institutue of Techonology
Junyong Park - KAIST
Gapyeol Park - KAIST
Huijin Song - KAIST
Joungho Kim - KAIST
Kyung-Wook Paik - KAIST

Robust Low-Temperature Cu-Cu Bonding by Anti-Oxidative Copper Nanoparticle paste
Yun Mou - Huazhong University of Science and Technology
Yang Peng - Huazhong University of Science and Technology
Junjie Li - Huazhong University of Science and Technology
Hao Cheng - Huazhong University of Science and Technology
Xingxing Liu - Huazhong University of Science and Technology
Mingxiang Chen - Huazhong University of Science and Technology

Deep understanding the role of Cu in RDL to warpage by exploring the warpage evolution with microstructural changes
Gong Cheng - Shanghai institute of microsystem and information technology
Gaowei Xu - Shanghai institute of microsystem and information technology
Wei Gai - Shanghai institute of microsystem and information technology
Le Luo - Shanghai institute of microsystem and information technology

Design of 56 Gbps I/O Interface by Exact Power Source Simulation
Daisuke Ogawa - Meisei University
Daisuke Iguchi - Fuji Xerox Co., Ltd
Naoto Yoshii - Murata Manufacturing Co., Ltd
Chihiro Ueda - Meisei University
Kaoru Hashimoto - Meisei University
Yusuke Taira - Fuji Xerox Co., Ltd
Nobutaka Hara - Fuji Xerox Co., Ltd
Yusuke Niisaka - Fuji Xerox Co., Ltd
Kanji Otsuka - Meisei University

Integration of Group IV alloy thin films on Various Substrates towards Optoelectronic Applications
Jignesh Vanjaria - Arizona State University
Tom Salagaj - Structured Materials Industries
Nick Sbrockey - Structured Materials Industries
Gary Tompa - Structured Materials Industries
Hongbin Yu - Arizona State University

Enhancements on Underfill Materials’ Thermal Conductivity by Insulation Coating Layer Control of Conductive Particles
Tae-Ryong Kim - Seoul National University/Ntrium
Kisu Joo - Ntrium Incorporation
Boo Taek Lim - National Nanofab Center
Sung-Soon Choi - Korea Electronics Technology Institute
Boung Ju Lee - National Nanofab Center
Se Young Jeong - Ntrium Incorporation
Euijoon Yoon - Seoul National University
Myung Jin Yim - Intel Corporation

Fabrication of Fe-3.5 wt.%Si magnetic cores for power electronic converters by selective laser melting
WANGYUN LI - Loughborough University
Jing Wang - Loughborough University
Guang Chen - Loughborough University
Daniel Engstrom - Loughborough University
Changqing Liu - Loughborough University
Xinping Zhang - South China University of Technology
Adam Walker - University of Nottingham
Gaurang Vakil - University of Nottingham
Andrew Forsyth - University of Manchester

Accurate core alignment for polymer optical waveguide in the Mosquito method for high-efficient coupling
Takaaki Ishigure - Keio University
Kumi Date - Keio University

Synthesis of a Graphene Film Carbon Nanotube Composite by Joule Self-heating CVD for Thermal Applications
Josef Hansson - Chalmers University of Technology
Nan Wang - Chalmers University of Technology
Torbjörn Nilsson - SAAB AB
Lilei Ye - Smart High Tech AB
Johan Liu - Chalmers University of Technology

Size and Shape Effect in the Determination of the Fracture Strength of Silicon Nitride in MEMS Structures at High Temperatures
Alex Axel Navarrete Gonzalez - University of Waterloo
Eric Brace - University of Waterloo
Patricia Nieva - University of Waterloo

A Study on the Curing properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly
HanMin Lee - KAIST
SeYong Lee - KAIST
JongHo Park - KAIST
Chang-kyu Chung - Samsung Electronics Company, Ltd.
Kyung-Woon Jang - Samsung Electronics Company, Ltd.
Il Kim - Samsung Electronics Company, Ltd.
SeongWoo Choi - Samsung Electronics Company, Ltd.
Kyung-Wook Paik - KAIST

Suspended Microstrip Low-Pass Filter Realized Using FDM Type 3D Printing with Conductive Copper-Based Filament
Jakub Sorocki - AGH University of Science and Technology
Ilona Piekarz - AGH University of Science and Technology
John Papapolymerou - Michigan State University
Slawomir Gruszczynski - AGH University of Science and Technology
Krzysztof Wincza - AGH University of Science and Technology

Modeling and design of 2.5D package with mitigated warpage and enhanced thermo-mechanical reliability
Jing Wang - State University of New York at Binghamton
Alexander Yatskov - Juniper Networks
Yuling Niu - State University of New York at Binghamton
Seungbae Park - State University of New York at Binghamton

Piezoelectric Ceramics and Flexible Printed Circuits (FPCs) Interconnection using Anisotropic Conductive Films (ACFs) for Ultrasound Transducers Assembly
Jae-Hyeong Park - KAIST
Kyung-Wook Paik - KAIST

Warpage Simulation for Fan-Out Wafer Level Packaging Investigation
Chun-Wei Hsiao - National Sun Yat-sen University
Mei-Ling Wu - National Sun Yat-sen University

Design, fabrication and characterization of a novel TSV interposed integrated inductor for RF applications
Yunheng Sun - Peking University Shenzhen Graduate School
Han Cai - Xiamen University
Jiwei Li - Xiamen University
Shenglin Ma - Xiamen University
Yufeng Jin - Peking University
Wei Wang - Peking University
Jing Chen - Peking University
Min Miao - Beijing Information Science and Technology University
Liulin Hu - Chengdu Ganide Technology
Shuwei He - Chengdu Ganide Technology