Technical Program

Wednesday, May 30, 2018

Session 5: Antenna-in-Package for RF and mm-Wave Systems
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components
Room: Nautilus 3

Session Co-Chairs:

Maciej Wojnowski
Infineon Technologies AG
T +49 89 234 26531
Prem Chahal
Michigan State University
T +1-517-355-0248


1. 8:00 AM - Small Shielded Bluetooth Module Equipped with Slot Antenna Patterned on the Surface
Keiju Yamada - Toshiba Corporation
Makoto Sano - Toshiba Corporation
Makoto Higaki - Toshiba Corporation
Akihiko Happoya - Toshiba Corporation

2. 8:25 AM - A 77GHz Antenna-in-Package with Low-Cost Solution for Automotive Radar Applications
Cheng Yu Ho - Advanced Semiconductor Engineering (ASE)
Sheng-Chi Hsieh - Advanced Semiconductor Engineering (ASE)
Chen-Chao Wang - Advanced Semiconductor Engineering (ASE)
Chun-Yen Ting - Advanced Semiconductor Engineering (ASE)

3. 8:50 AM - An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-band Communication and Imaging Applications
Xiaoxiong Gu - IBM Corporation
Duixian Liu - IIBM Corporation
Christian Baks - IBM Corporation
Jean-Oliver Plouchart - IBM Corporation
Wooram Lee - IBM Corporation
Alberto Valdes-Garcia - IBM Corporation

4. 10:00 AM - InFO_AIP technology for High Performance and Compact Millimeter-Wave and 5G Mobile System Integration
Chuei-Tang Wang - Taiwan Semiconductor Manufacturing Company
Tzu-Chun Tang - Taiwan Semiconductor Manufacturing Company
Chun-Wen Lin - Taiwan Semiconductor Manufacturing Company
Che-Wei Hsu - Taiwan Semiconductor Manufacturing Company
Jeng-Shien Hsieh - Taiwan Semiconductor Manufacturing Company
Chung-Hao Tsai - Taiwan Semiconductor Manufacturing Company
Kai-Chiang Wu - Taiwan Semiconductor Manufacturing Company
Han-Ping Pu - Taiwan Semiconductor Manufacturing Company
Douglas Yu - Taiwan Semiconductor Manufacturing Company

5. 10:25 AM - Mm-Wave Antenna in Package (AiP) Design Applied to 5th Generation (5G) Cellular User Equipment Using Unbalanced Substrate
YING-WEI LU - Siliconware Precision Industries Co., Ltd.
BO-SIANG FANG - Siliconware Precision Industries Co., Ltd.
HSUAN-HAO MI - Siliconware Precision Industries Co., Ltd.
KUAN-TA CHEN - Siliconware Precision Industries Co., Ltd.

6. 10:50 AM - Novel 3D-/Inkjet-Printed Flexible On-Package Antennas, Packaging Structures, and Modules for Broadband 5G Applications
Tong-Hong Lin - Georgia Institute of Technology
Markondeya Raj Pulugurtha - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
Manos Tentzeris - Georgia Institute of Technology

7. 11:15 AM - A compact 27 GHz Antenna-in-Package (AiP) with RF front-end module and passive phased antenna array
Qidong Wang - Institute of Microelectronics of Chinese Academy of Sciences
Mei Xue - University of Chinese Academy of Sciences
Liqiang Cao - National Center for Advanced Packaging
Delong Qiu - Institute of Microelectronics of Chinese Academy of Sciences