Technical Program

Wednesday, May 30, 2018

Session 6: Warpage and Moisture Characterization
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Nautilus 5

Session Co-Chairs:

Przemyslaw Gromala
Robert Bosch GmbH
T +49-162-8514983
Przemyslawjakub.gromala@de.bosch.com
Jiantao Zheng
Qualcomm Technologies, Inc.
T +1-858-658-5738
jiantaoz@qti.qualcomm.com

Papers:

1. 8:00 AM - A Novel Finite Element Technique for Moisture Diffusion Modeling using ANSYS
Cagan Diyaroglu - University of Arizona
Erdogan Madenci - University of Arizona
selda Oterkus - University of Strathclyde
Erkan Oterkus - University of Strathclyde

2. 8:25 AM - Adaptive Curvature Flexure Test to Assess Flexible Electronic Systems
Rui Chen - Georgia Institute of Technology
Justin Chow - Georgia Institute of Technology
Christine Taylor - Georgia Institute of Technology
Suresh Sitaraman - Georgia Institute of Technology

3. 8:50 AM - Parametric Determination and Optimization for Package Warpage and Yield Probability Prediction
Shenghua Huang - Western Digital Corporation
Zhongli Ji - Western Digital Corporation
Ning Ye - Western Digital Corporation
Yangming Liu - Western Digital Corporation
Hem Takiar - Western Digital Corporation

4. 10:00 AM - An Integrated Warpage Prediction Model Based on Characterization of Viscoelasticity and Chemical Shrinkage for Molded Underfill
Shu-Shen Yeh - Taiwan Semiconductor Manufacturing Company
Po-Yao Lin - Taiwan Semiconductor Manufacturing Company
Kuang-Chun Lee - Taiwan Semiconductor Manufacturing Company
Jin-Hua Wang - Taiwan Semiconductor Manufacturing Company
Wen-Yi Lin - Taiwan Semiconductor Manufacturing Company
Ming-Chih Yew - Taiwan Semiconductor Manufacturing Company
Po-Chen Lai - Taiwan Semiconductor Manufacturing Company
Chia-Kuei Hsu - Taiwan Semiconductor Manufacturing Company
Che-Chia Yang - Taiwan Semiconductor Manufacturing Company
Shin-Puu Jeng - Taiwan Semiconductor Manufacturing Company

5. 10:25 AM - Trend Plots for Different Mold-thick Selection on Warpage Design of MUF FCCSP with 4L ETS
Chih-Sung Chen - Siliconware Precision Industries Co. Ltd. (SPIL)
Nicholas Kao - Siliconware Precision Industries Co. Ltd. (SPIL)
Don Son Jiang - Siliconware Precision Industries Co. Ltd. (SPIL)

6. 10:50 AM - Numerical/Experimental Hybrid Approach to Predict Warpage of Thin Advanced Substrates
Byung Kim - University of Maryland
Bongtae Han - University of Maryland

7. 11:15 AM - Warpage and Thermal Stress Under Thermal Cycling Test in SiC and Si Power Device Structures Using Direct Chip-Bonding with Ag Sintered Layer on Cu Plate
Masaki Kanemoto - Keio University
Masaaki Aoki - Keio University
Akihiro Mochizuki - MacDermid Performance Solutions
Yoshio Murakami - MacDermid Performance Solutions
Mutsuharu Tsunoda - MacDermid Performance Solutions
Nobuhiko Nakano - Keio University