Technical Program

Wednesday, May 30, 2018

Session 6: Warpage and Moisture Characterization
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Nautilus 5

Session Co-Chairs:

Przemyslaw Gromala
Robert Bosch GmbH
T +49-162-8514983
Przemyslawjakub.gromala@de.bosch.com
Jiantao Zheng
Qualcomm Technologies, Inc.
T +1-858-658-5738
jiantaoz@qti.qualcomm.com

Papers: