Technical Program
Wednesday, May 29, 2013
Session 8: 3D Reliability and Packaging Challenges
1:30 PM - 5:10 PM
Committee: Applied Reliability
Room: Mont-Royal 2
Session Co-Chairs:
|
Toni Mattila Aalto University T +358-405009909 toni.mattila@aalto.fi |
Jeffrey Suhling Auburn University T +1-334-844-3332 jsuhling@auburn.edu |
Papers:
1. 1:30 PM - Thermomechanical and Electrochemical Reliability of Fine-Pitch Through- Package-Copper Vias (TPV) in Thin Glass Interposers and Packages
Kaya Demir - Georgia Institute of Technology
Koushik Ramachandran - Georgia Institute of Technology
Yoichiro Sato - Asahi Glass Co., Ltd.
Qiao Chen - Georgia Institute of Technology
Vijay Sukumaran - Georgia Institute of Technology
Raghu Pucha - Georgia Institute of Technology
Venkatesh Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
2. 1:55 PM - Impacts of Static and Dynamic Local Bending of Thinned Si Chip on MOSFET Performance in 3-D Stacked LSI
H. Kino - Tohoku University
J.C. Bea - Tohoku University
M. Murugesan - Tohoku University
K.W. Lee - Tohoku University
T. Fukushima - Tohoku University
M. Koyanagi - Tohoku University
T. Tanaka - Tohoku University
3. 2:20 PM - Reliability Characterization of Chip-on-Wafer-on-Substrate (CoWoS) 3D IC Integration Technology
Larry Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
Tung-Chin Yeh - Taiwan Semiconductor Manufacturing Company, Ltd.
Jyun-Lin Wu - Taiwan Semiconductor Manufacturing Company, Ltd.
Gary Lu - Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Fu Tsai - Taiwan Semiconductor Manufacturing Company, Ltd.
Larry Chen - Taiwan Semiconductor Manufacturing Company, Ltd.
An-Tai Xu - Taiwan Semiconductor Manufacturing Company, Ltd.
4. 3:30 PM - Accelerated Reliability Testing and Modeling of Cu-Plated Through Encapsulant Vias (TEVs) for 3D-Integration
B. Wunderle - TU Chemnitz
Jens Heilmann - TU Chemnitz
Sridhar Ganesh Kumar - TU Chemnitz
Ole Hoelck - TU Chemnitz, Fraunhofer IZM
Hans Walter - Fraunhofer IZM
Olaf Wittler - Fraunhofer IZM
Gunter Engelmann - Fraunhofer IZM
M. Jürgen Wolf - Fraunhofer IZM
Gottfried Beer - Infineon Technologies AG
Klaus Pressel - Infineon Technologies AG
5. 3:55 PM - Reliability Study for Large Silicon Interposers Report on Board
C. Ferrandon - CEA-LETI
S. Joblot - STMicroelectronics
Y. Lamy - CEA-LETI
P. Coudrain - STMicroelectronics
P. Bar - STMicroelectronics
D. Yap - STMicroelectronics
F. De Crecy - CEA-LETI
R. Coffy - STMicroelectronics
J.F. Carpentier - STMicroelectronics
G. Simon - CEA-LETI
6. 4:20 PM - Fracture Mechanics Lifetime Modeling of Low Temperature Si Fusion Bonded Interfaces Used for 3D MEMS Device Integration
Falk Naumann - Fraunhofer IWM
Michael Bernasch - Fraunhofer IWM
Joerg Siegert - ams AG
Sara Camiello - ams AG
Matthias Petzold - Fraunhofer IWM
7. 4:45 PM - Extension of Micro-Raman Spectroscopy for Full-Component Stress Characterization of TSV Structures
Qiu Zhao - University of Texas, Austin
J. Im - University of Texas, Austin
R. Huang - University of Texas, Austin
P.S. Ho - University of Texas, Austin
