Technical Program

Wednesday, May 30, 2018

Session 8: Fan-Out Packaging-Applications and Architectures
1:30 PM - 5:10 PM
Committee: Packaging Technologies
Room: Harbor Island 2

Session Co-Chairs:

Bora Baloglu
Amkor Technology
T +1-480 786 7307
bora.baloglu@amkor.com
Kuo-Chung Yee
TSMC
T +886-3-5636688 Ext. 7222920/7223012
kcyee@tsmc.com

Papers: