Technical Program

Wednesday, May 30, 2018

Session 8: Fan-Out packaging-Applications and Architectures
1:30 PM - 5:10 PM
Committee: Advanced Packaging
Room: Harbor Island 2

Session Co-Chairs:

Bora Baloglu
Amkor Technology
T +1-480 786 7307
bora.baloglu@amkor.com
Raj Pendse
Qualcomm Technologies, Inc.
T +1-(510)709-8076
rpendse@qti.qualcomm.com

Papers:

1. 1:30 PM - Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application
Zihao Chen - Institute of Microelectronics, A*STAR, Singapore
Teck Guan Lim - Institute of Microelectronics, A*STAR, Singapore
David Ho Soon Wee - Institute of Microelectronics, A*STAR, Singapore
Tai Chong Chai - Institute of Microelectronics, A*STAR, Singapore
Surya Bhattacharya - Institute of Microelectronics, A*STAR, Singapore

2. 1:55 PM - 3D Heterogeneous Integration with Multiple Stacking Fan-Out Package
Feng-Cheng Hsu - Taiwan Semiconductor Manufacturing Company
Jackson Lin - Taiwan Semiconductor Manufacturing Company
Shuo-Mao Chen - Taiwan Semiconductor Manufacturing Company
Po-Yao Lin - Taiwan Semiconductor Manufacturing Company
Jerry Fang - Taiwan Semiconductor Manufacturing Company
Jin-Hua Wang - Taiwan Semiconductor Manufacturing Company
Shin-Puu Jeng - Taiwan Semiconductor Manufacturing Company

3. 2:20 PM - New Mobile Application Processor Package Platform for High-Performance Low Power Applications
TAEJOO HWANG - Samsung Electronics Company, Ltd.
Dan (Kyung Suk) Oh - Samsung Electronics Company, Ltd.
Eunseok Song - Samsung Electronics Company, Ltd.
KILSOO KIM - Samsung Electronics Company, Ltd.
YONGHOON KIM - Samsung Electronics Company, Ltd.
Seok Won Lee - Samsung Electronics Company, Ltd.
JAECHOON KIM - Samsung Electronics Company, Ltd.

4. 3:30 PM - An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications
Yu-Min Lin - Industrial Technology Research Institute (ITRI)
Wen-Wei Shen - Industrial Technology Research Institute (ITRI)
Shin-Yi Huang - Industrial Technology Research Institute (ITRI)
Sheng-Tsai Wu - Industrial Technology Research Institute (ITRI)
Ang-Ying Lin - Industrial Technology Research Institute (ITRI)
Tao-Chih Chang - Industrial Technology Research Institute (ITRI)
Hsiang-Hung Chang - Industrial Technology Research Institute (ITRI)
Shu-Man Lee - Industrial Technology Research Institute (ITRI)
Chia-Hsin Lee - Brewer Science Taiwan/Brewer Science, Inc.
Jay Su - Brewer Science Taiwan/Brewer Science, Inc.

5. 3:55 PM - Chip-First Fan-Out Panel Level Packaging for Heterogeneous Integration
Cheng-Ta Ko - Unimicron Technology Corp.
Kai-Ming Yang - Unimicron Technology Corp.
Chen-Hao Lin - Unimicron Technology Corp.
Yu-Hua Chen - Unimicron Technology Corp.
John Lau - ASM Pacific Technology
Ming Li - ASM Pacific Technology
Marc Lin - The Dow Chemical Company

6. 4:20 PM - 3D Integration for Silicon Photonics Based on Fan-out Packaging
Fengman Liu - Istitute of Microelectronics, Chinese Academy of Science

7. 4:45 PM - A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-┬Ám pitch
Arnita Podpod - IMEC
John Slabbekoorn - IMEC
Alain Phommahaxay - IMEC
Fabrice Duval - IMEC
Abdellah Salahouelhadj - IMEC
Mario Gonzalez - IMEC
Kenneth Rebibis - IMEC
Andy Miller - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC