Technical Program
Wednesday, May 30, 2012
Session 9: Sensors and MEMS
1:30 PM - 5:10 PM
Committee: Advanced Packaging
Harbor Island III
Session Co-Chairs:
|
S. W. Ricky Lee Hong Kong University of Science and Technology T +852-2358-7203 F rickylee@ust.hk |
James Jian Zhang Micron Technology, Inc. T +1-916 458 3540 F jamesjianzha@micron.com |
Papers:
1. 1:30 PM - Assembly and Packaging Technologies for High Temperature SiC-Sensors
Roderich Zeiser - University of Freiburg
Phillipp Wagner - University of Freiburg
Jürgen Wilde - University of Freiburg
2. 1:55 PM - Drop Impact Reliability of MEMS Inertial Sensors with Membrane Suspensions for Mobile Phones
Jong Woon Kim - Samsung Electro-Mechanics Company, Limited
Heung Woo Park - Samsung Electro-Mechanics Company, Limited
Min Kyu Choi - Samsung Electro-Mechanics Company, Limited
Won Kyu Jeung - Samsung Electro-Mechanics Company, Limited
Jung Won Lee - Samsung Electro-Mechanics Company, Limited
3. 2:20 PM - Chip on Board Development for a Novel MEMS Accelerometer for Seismic Imaging
Zhuqing Zhang - Hewlett Packard Company
Jennifer Wu - Hewlett Packard Company
Sheldon Bernard - Hewlett Packard Company
Robert G. Walmsley - Hewlett Packard Company
4. 3:30 PM - Failsafe Wafer-Level Packaging of a Piezoelectric MEMS Actuator
M.A. Matin - Toyohashi University of Technology
K. Ozaki - Toyohashi University of Technology
D. Akai - Toyohashi University of Technology
K. Sawada - Toyohashi University of Technology
M. Ishida - Toyohashi University of Technology
5. 3:55 PM - Hermetic Wafer-Level Packaging for RF MEMs: Effects on Resonator Performance
M. David Henry - Sandia National Laboratories
K. Douglas Greth - Sandia National Laboratories
Janet Nguyen - Sandia National Laboratories
Christopher D. Nordquist - Sandia National Laboratories
Randy Shul - Sandia National Laboratories
Mike Wiwi - Sandia National Laboratories
Thomas A. Plut - Sandia National Laboratories
Roy H. Olsson III - Sandia National Laboratories
6. 4:20 PM - 3D MEMS High Vacuum Wafer Level Packaging
S. Nicolas - CEA-LETI
S. Caplet - CEA-LETI
F. Greco - CEA-LETI
M. Audoin - CEA-LETI
X. Baillin - CEA-LETI
S. Fanget - CEA-LETI
7. 4:45 PM - Investigation of a Unified LTCC-Based Micromachining and Packaging Platform for High Density/Multifunctional Microsystem Integration
Min Miao - Peking University, Beijing Information Science and Technology University
Yufeng Jin - Peking University
Hua Gan - Peking University
Jing Zhang - Peking University
Yunsong Qiu - Peking University
Yang Zhang - Beijing Information Science and Technology
Yangfei Zhang - Peking University
Rui Cao - Peking University
Zhensong Li - Beijing Information Science and Technology University
Zhengyi Wang - 43rd Institute of China Electronics Technology Group Corporation
Fangqing Mu - 43rd Institute of China Electronics Technology Group Corporation
Chengchen Gao - Peking University
