Technical
Program
Thursday, June 03, 2010
Session 19: Embedded Device and MEMS Technology
1:30 p.m. - 5:10 p.m.
Committee: Advanced Packaging
Concorde A
Session Co-Chairs:
Joseph W. Soucy
Draper Laboratory
T +1-617-258-2953
F +1-617-258-1779
Jsoucy@draper.com
|
Charles Banda
Laboratory for Physical Sciences
T +1-410-854-0887
F
cvbanda@lps.umd.edu
|
Papers:
1. 1:30 PM - Chip Embedding Technology Developments Leading to the Emergence of Miniaturized System-in-Packages
Dionysios Manessis- Technische Universität Berlin
Lars Boettcher- Fraunhofer IZM
Andreas Ostmann- Fraunhofer IZM
Rolf Aschenbrenner- Fraunhofer IZM
Herbert Reichl- Technische Universität Berlin
2. 1:55 PM - Three Dimensional Air-Gap Structures for MEMS Packaging
Rajarshi Saha- Georgia Institute of Technology
Nathan Fritz- Georgia Institute of Technology
Sue Ann Bidstrup-Allen- Georgia Institute of Technology
Paul A. Kohl- Georgia Institute of Technology
3. 2:20 PM - Demonstration of a Novel Hybrid Silicon-Resin High Density Interconnect (HDI) Substrate
B. Smith- Draper Laboratory
P. Kwok- Draper Laboratory
J. Thompson- Draper Laboratory
A. Mueller- Draper Laboratory
L. Racz- Draper Laboratory
4. 3:30 PM - 3D Integration of CMOS and MEMS Using Mechanically Flexible Interconnects (MFI) and Through Silicon Vias (TSV)
Hyung Suk Yang- Georgia Institute of Technology
Muhannad S. Bakir- Georgia Institute of Technology
5. 3:55 PM - A Novel Die to Wafer (D2W) Collective Bonding Method for MEMS and Electronics Heterogeneous 3D Integration
Won Kyoung Choi- Institute of Microelectronics, A*STAR
C.S. Premachandran- Institute of Microelectronics, A*STAR
Ling Xie- Institute of Microelectronics, A*STAR
Siong Chiew Ong- Institute of Microelectronics, A*STAR
Johnny Han He- Institute of Microelectronics, A*STAR
Guan Jie Yap- Institute of Microelectronics, A*STAR
Aibin Yu- Institute of Microelectronics, A*STAR
6. 4:20 PM - DC/DC Converter 3D Assembly for Autonomous Sensor Nodes
Thierry Hilt- CEA-LETI
Hervé Boutry- CEA-LETI
Rémi Franiatte- CEA-LETI
Frédéric Rothan- CEA-LETI
Nicolas Sillon- CEA-LETI
Frank Stam- Tyndall National Institute
Alan Mathewson- Tyndall National Institute
Ningning Wang- Tyndall National Institute
Cian O-Mathuna- Tyndall National Institute
Kenneth Rodgers- Tyndall National Institute
7. 4:45 PM - Hot Forming of Micro Glass Cavities for MEMS Wafer Level Hermetic Packaging
Jintang Shang- Southeast University
Junwen Liu- Southeast University
Chao Xu- Southeast University
Di Zhang- Southeast University
Boying Chen- Southeast University
Qing-An Huang- Southeast University
Jieying Tang- Southeast University
