Technical
Program
Thursday, June 03, 2010
Session 22: Nanotechnology and Advanced Packaging
1:30 p.m. - 5:10 p.m.
Committee: Materials & Processing
Champagne 2
Session Co-Chairs:
Diptarka Majumdar
Sun Chemical Corporation
T +1-201-933-4500 x1258
F
diptarka.majumdar@sunchemical.com
|
Daniel D. Lu
Henkel Corporation
T +86-21-2891-8576
F
daniel.lu@cn.henkel.com
|
Papers:
1. 1:30 PM - Integration of Horizontal Carbon Nanotube Devices on Silicon Substrate Using Liquid Evaporation
Zhiyong Xiao- Hong Kong University of Science and Technology
Yang Chai- Hong Kong University of Science and Technology
Yuan Li- Hong Kong University of Science and Technology
Minghui Sun- Hong Kong University of Science and Technology
Philip C.H. Chan- Hong Kong University of Science and Technology
2. 1:55 PM - Precision Material Deposition for SiP Manufacturing Using Jetting Processes
K.-F. Becker- Technische Universität Berlin
A. Kurz- Technische Universität Berlin
H. Reichl- Technische Universität Berlin
M. Koch- Fraunhofer IZM
J. Bauer- Fraunhofer IZM
T. Braun- Fraunhofer IZM
3. 2:20 PM - Electroplating of Cu-NT onto Metallic Substrates
Mary Sullivan- Tyco Electronics
Min Zheng- Tyco Electronics
Bob Hilty- Tyco Electronics
4. 3:30 PM - Nano-Integrated Adhesive for Cryogenic Packaging (4K) of Harsh Environment Electronics
Ranjith Samuel E. John- University of Arkansas
Ajay P. Malshe- University of Arkansas
Vladimir Dotsenko- Hypres, Inc.
Jean Delmas- Hypres, Inc.
Robert Webber- Hypres, Inc.
Deepnarayan Gupta- Hypres, Inc.
5. 3:55 PM - Vertically Aligned Carbon Nanotubes for Thermal Interface Materials: Quality Control, Alignment Improvement and Laser Flash Measurement
Wei Lin- Georgia Institute of Technology
C.P. Wong- Georgia Institute of Technology
6. 4:20 PM - Sintered Conductive Adhesives for High-Temperature Packaging
Matt Wrosch- Creative Electron, Inc
Arsenia Soriano- Creative Electron, Inc
7. 4:45 PM - Effect of Ni-Coated Carbon Nanotubes on the Microstructure and Properties of a Sn-Ag-Cu Solder
Y.D. Han- Tianjin University
C.M. Tan- Nanyang Technological University, Singapore Institute of Manufacturing Technology
S.M.L. Nai- Singapore Institute of Manufacturing Technology
L.Y. Xu- Tianjin University
H.Y. Jing- Tianjin University
J. Wei- Singapore Institute of Manufacturing Technology
