Technical
Program
Friday, June 04, 2010
Session 33: High-Speed Characterization and Signaling
1:30 p.m. - 5:10 p.m.
Committee: Modeling & Simulation
Versailles 3 & 4
Session Co-Chairs:
Bruce Kim
The University of Alabama
T +1-205-348-4972
F +1-205-348-6959
bruce.kim@ua.edu
|
Zhaoqing Chen
IBM Corporation
T +1-845-435-5595
F +1-845-432-9788
zhaoqing@us.ibm.com
|
Papers:
1. 1:30 PM - Extending Lower-Cost Packaging Technology into Next Generation Signaling: Techniques and Considerations
Matt Doyle- IBM Corporation
Jerry Bartley- IBM Corporation
Richard Ericson- IBM Corporation
Mark Bailey- IBM Corporation
Phil Germann- IBM Corporation
George Zettles- IBM Corporation
2. 1:55 PM - Low-Impedance Evaluation of Power Distribution Network for Decoupling Capacitor Embedded Interposers of 3-D Integrated LSI System
Katsuya Kikuchi- National Institute of AIST
Chihiro Ueda- Meisei University
Koichi Takemura- ASET
Osamu Shimada- ASET
Toshio Gomyo- ASET
Yukiharu Takeuchi- ASET
Toshikazu Ookubo- ASET
Kazuhiro Baba- ASET
Masahiro Aoyagi- National Institute of AIST
Toshio Sudo- Shibaura Institute of Technology
Kanji Otsuka- Meisei University
3. 2:20 PM - Electrical Characterization of Wafer Level Fan-Out (WLFO) Using Film Substrate for Low Cost Millimeter Wave Application
Seung Jae Lee- Amkor Technology, Korea
Sang Won Kim- Amkor Technology, Korea
Nozad Karim- Amkor Technology, Korea
Brett Dunlap- Amkor Technology, Korea
Boo Yang Jung- Amkor Technology, Korea
Ki Cheol Bae- Amkor Technology, Korea
Ji Heon Yu- Amkor Technology, Korea
Young Suk Chung- Amkor Technology, Korea
Chan Ha Hwang- Amkor Technology, Korea
Jin Young Kim- Amkor Technology, Korea
Choon Heung Lee- Amkor Technology, Korea
4. 3:30 PM - Reduce Simultaneous Switching Jitter in Number, Spatial, Time, and Frequency Dimensions
Hui Liu- Altera Corporation
Hong Shi- Altera Corporation
John Xie- Altera Corporation
5. 3:55 PM - Spiral Via Structure in a BGA Package to Mitigate Discontinuities in Multi-Gigabit SERDES System
Namhoon Kim- Xilinx, Inc.
Hongsik Ahn- Xilinx, Inc.
Chris Wyland- Xilinx, Inc.
Ray Anderson- Xilinx, Inc.
Paul Wu- Xilinx, Inc.
6. 4:20 PM - A Low-Cost QFP Design for over 8Gbps SerDes Applications with Inductive Return Path Co-Planar Waveguide Built into the Lead Frame
Ryuichi Oikawa- NEC Corporation
7. 4:45 PM - In-Situ Characterization of 3D Package Systems with On Chip Measurements
Dan Oh- Rambus, Inc.
Hai Lan- Rambus, Inc.
Chris Madden- Rambus, Inc.
Sam Chang- Rambus, Inc.
Ling Yang- Rambus, Inc.
Ralf Schmitt- Rambus, Inc.
