Technical
Program
Friday, June 04, 2010
Session 39: Posters 3
6:00 p.m. - 9:30 p.m.
Committee: Posters
Rivoli B & C
Session Co-Chairs:
Mark Eblen
Kyocera America, Inc.
T +1-858-614-2537
F +1-858-573-0159
mark.eblen@kyocera.com
|
Nam Pham
IBM Corporation
T +1-512-286-8011
F +1-512-973-4240
npham@us.ibm.com
|
Papers:
1. 1:30 PM - Characterization of Encapsulants for High-Voltage, High-Temperature Power Electronic Packaging
Yiying Yao- Virginia Polytechnic Institute and State University
Zheng Chen- Virginia Polytechnic Institute and State University
Guo-Quan Lu- Virginia Polytechnic Institute and State University
Dushan Boroyevich- Virginia Polytechnic Institute and State University
Khai D.T. Ngo- Virginia Polytechnic Institute and State University
2. 1:55 PM - Evaluation of Electromigration (EM) Life of ENEPIG and CuSOP Surface Finishes with Various Solder Bump Materials
Dong Wook Kim- Xilinx, Inc.
J.K. Jerry Lee- Xilinx, Inc.
Myung-June (M.J.) Lee- Xilinx, Inc.
S.Y. Pai- Xilinx, Inc.
Stan Chen- Siliconware Precision Industries Co., Ltd.
Frank Kuo- Siliconware Precision Industries Co., Ltd.
3. 2:20 PM - Influence of Artificial Body Fluids and Medical Sterilization Procedures on Chemical Stability of Parylene C
N. Beshchasna- Technische Universität Dresden
B. Adolphi- Technische Universität Dresden
S. Granovsky- M.V. Lomonosov Moscow State University
M. Braunschweig- Microelectronic Packaging Dresden GmbH
W. Schneider- Microelectronic Packaging Dresden GmbH
J. Uhlemann- Technische Universität Dresden
K.-J. Wolter- Technische Universität Dresden
4. 3:30 PM - NCF for Wafer Lamination Process in Higher Density Electronic Packages
Kazutaka Honda- Hitachi Chemical Co., Ltd.
Tetsuya Enomoto- Hitachi Chemical Co., Ltd.
Akira Nagai- Hitachi Chemical Co., Ltd.
Nozomu Takano- Hitachi Chemical Co., Ltd.
5. 3:55 PM - Lattice Deformation of Sn Nanowires for the Application to Nano-Interconnection Technology
Ho Sun Shin- KAIST
Jae Yong Song- Korea Research Institute of Standards and Science
Jin Yu- KAIST
6. 4:20 PM - Characterization and Management of Wafer Stress for Various Pattern Densities in 3D Integration Technology
X.F. Pang- Institute of Microelectronics, A*STAR
T.T. Chua- Institute of Microelectronics, A*STAR
H.Y. Li- Institute of Microelectronics, A*STAR
E.B. Liao- Institute of Microelectronics, A*STAR
W.S. Lee- Institute of Microelectronics, A*STAR
F.X. Che- Institute of Microelectronics, A*STAR
7. 4:45 PM - Size Effect of Ag Nanoparticles on Laser Sintering and Wire Bondability
Yoshiyuki Tsutsui- Ibaraki University
Kazuhiko Yamasaki- Ibaraki University
Katsuhiro Maekawa- Ibaraki University
Tomotake Niizeki- Ibaraki University
Ahmed Bucheeri- Ibaraki University
Mamoru Mita- Hitachi
Yorishige Matsuba- Harima Chemicals, Inc.
Nobuto Terada- Harima Chemicals, Inc.
Hiroshi Saito- Harima Chemicals, Inc.
