Technology Program
SESSION SUMMARY BY INTEREST AREA
Advanced Packaging
Session 1: Leading Edge Packaging Technology
Session 9: MEMS, Sensors and Microstructures
Session 13: Flip Chip Packaging
Session 21: Wafer Level and Chip Scale Packaging
Session 26: 3D Packaging Technologies
Components & RF
Session 11: RF Modules and Performance
Session 36: Component Technology
Education
Session 12: Novel Packaging Education Programs
Session 18: Multimedia Packaging Education
Interconnections
Session 2: Pb Free Interconnections I
Session 15: MEMs
Session 20: Pb Free Interconnections II
Session 27: Novel Interconnections
Session 32: Wire Bonding
Manufacturing Technology
Session 6: Application of Statistical Tools in Manufacturing for Inprocess Control, Test and Product Cycle
Session 35: Advancements in Wafer Thinning, Bumping and Interconnect in Support of Wafer Level Packaging Manufacturing
Materials & Processing
Session 4: High Density Substrates and Embedded Components
Session 16: Pb Free Solders
Session 23: Underfills for Flip Chip
Session 29: Interconnect Metallurgies
Session 33: Adhesives
Modeling & Simulation
Session 5: Leaded and Lead Free Solder Characterization and Modeling
Session 10: Thermal and Thermo Mechanical Modeling
Session 17: New Materials and Interface Delamination Modeling and Experiments
Session 24: Electrical Modeling
Session 30: Electrical Characterization and Validation
Session 34: System Design Electrical Issues
Optoelectronics
Session 7: Optoelectronic Modules
Session 19: Devices for Wavelength Division Multiplexing
Session 25: Optical Backplane and Parallel Interconnects
Session 31: Low Cost Manufacturing of Optoelectronics
Poster
All Posters
Quality & Reliability
Session 3: Quality and Reliability Issues of Portable Products
Session 8: Experimental Assessment of Quality and Reliability
Session 14: Analytical Assessment of Reliability
Session 22: Advances in Test Methods
Session 28: Reliability Issues in Polymers and Interfaces
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©2002, ECTC
