Technology Program
SESSION SUMMARY BY INTEREST AREA
Advanced Packaging
Session 1: Advances in Flip Chip Packaging
Session 7: Wafer Level Packaging and Processing
Session 13: Advanced Packaging Technologies
Session 19: Embedded Device and MEMS Technology
Session 25: TSV Processing, Characterization and Integration
Session 31: Processes for 3D Integration
Electronic Components & RF
Session 12: Filters and TSV-based RF Devices
Session 17: RF Packaging, Material, and Charaterization
Session 35: Embedded RF Devices and Modules
Connectors & Contacts
Education
Interconnections
Session 2: 3D/TSV Innovation and Characterization
Session 8: Wirebond and Alternative Interconnect
Session 14: 2nd-Level Interconnect
Session 20: Interconnection and Bonding for 3D/TSV
Session 32: Fine Pitch Flip Chip
Assembly & Manufacturing Technology
Session 24: Manufacturing Aspects of 3D
Session 26: Assembly Challenges and Solutions
Session 36: Chip Package Interaction: Low-k, ULK, BGA
Materials & Processing
Session 4: Pb-Free Solder and Intermetallic Compounds
Session 10: Bonding Interconnects
Session 18: Materials and Processing for 3D Packaging
Session 22: Nanotechnology and Advanced Packaging
Session 28: Adhesives, Underfill and Encapsulants
Modeling & Simulation
Session 3: Interface and Warpage
Session 9: Electrical, Thermal and Reliability Modeling
Session 15: High-Speed, Circuit, and 3D Simulation
Session 27: Modeling Time-Dependent Phenomena
Session 33: High-Speed Characterization and Signaling
Optoelectronics
Session 6: Optical Interconnects/Fiber Optics to the Board
Session 16: High-Power Lasers and LEDs
Posters
Session: Posters 1
Session: Posters 2
Applied Reliability
Session 5: Advances in Predictive Reliability
Session 11: Thermal Mechanical Characterization of Solders
Session 21: Solder Joint Reliability Characterization
Session 29: Innovations in Reliability Characterization
Session 34: Solder and Interconnect Enhancement
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