Committee: Posters 1
Papers:

A Compact 4x10-Gb/s CWDM ROSA Module for 40G Ethernet Optical Transceiver
Sae-Kyoung Kang- Electronics and Telecommunications Research Institute
Joon Ki Lee- Electronics and Telecommunications Research Institute
Jyung Chan Lee- Electronics and Telecommunications Research Institute
Kwangjoon Kim- Electronics and Telecommunications Research Institute

An Electrical Design and Fabrication of a 12-Channel Optical Transceiver with SiP Packaging Technology
Wei Gao- Institute of Microelectronics, Chinese Academy of Sciences
Zhihua Li- Institute of Microelectronics, Chinese Academy of Sciences
Jian Song- Institute of Microelectronics, Chinese Academy of Sciences
Xu Zhang- Institute of Microelectronics, Chinese Academy of Sciences
Feng Chen- Institute of Microelectronics, Chinese Academy of Sciences
Fengman Liu- Institute of Microelectronics, Chinese Academy of Sciences
Yunyan Zhou- Institute of Microelectronics, Chinese Academy of Sciences
Jun Li- Institute of Microelectronics, Chinese Academy of Sciences
Haifei Xiang- Institute of Microelectronics, Chinese Academy of Sciences
Jing Zhou- Institute of Microelectronics, Chinese Academy of Sciences
Shuhua Liu- Institute of Microelectronics, Chinese Academy of Sciences
Yu Wang- Institute of Microelectronics, Chinese Academy of Sciences

Analysis of the Laser Transmission Rate of Silicon (Si) Applied to Flip-Chip Bonding
Chun-Sam Song- Seoul National University of Technology
Jong-Hyeong Kim- Seoul National University of Technology
Joo Han Kim- Seoul National University of Technology
Joon Hyun Kim- Seoul National University of Technology
Joo-Hyun Kim- Seoul National University of Technology

Comparison of Advanced PoP Package Configurations
Hamid Eslampour- STATS ChipPAC, Inc.
SeongMin Lee- STATS ChipPAC, Inc.
SeongWon Park- STATS ChipPAC, Inc.
TaeKeun Lee- STATS ChipPAC, Inc.
InSang Yoon- STATS ChipPAC, Inc.
YoungChul Kim- STATS ChipPAC, Inc.

Development of a New Package-on-Package (PoP) Structure for Next-Generation Portable Electronics
Peng Sun- ASTRI
Vincent Leung- ASTRI
Debbie Yang- ASTRI
Robin Lou- ASTRI
Daniel Shi- ASTRI
Tom Chung- ASTRI

Electrical Characterization of Embedded Polymer/Ceramic Capacitors from 500 MHz to 12 GHz
Ann Trippe- Georgia Institute of Technology
Swapan K. Bhattacharya- Georgia Institute of Technology
John Papapolymerou- Georgia Institute of Technology
Jason Ferguson- NSWC Crane

Fabrication and Characterization of Embedded Active and Passive Device for Wireless Application
Se-Hoon Park- Korea Electronics Technology Institute
Jong-In Ryu- Korea Electronics Technology Institute
Jun Chul Kim- Korea Electronics Technology Institute
Nam Kee Kang- Korea Electronics Technology Institute
Jong Chul Park- Korea Electronics Technology Institute
Young-Ho Kim- Hanyang University

Fabrication of a Switch Module by Embedding Chip Capacitors and an Active IC in Organic Substrate
Jong-In Ryu- Korea Electronics Technology Institute
Jong-Won Moon- Korea Electronics Technology Institute
Se-Hoon Park- Korea Electronics Technology Institute
Dongsu Kim- Korea Electronics Technology Institute
Jun-Chul Kim- Korea Electronics Technology Institute
Jong-Chul Park- Korea Electronics Technology Institute

Generalized Efficiency Measure for an Above-IC Multifilar Transformer Applied to Multiport Integrated Passive Devices
C.H. Chen- National Sun Yat-Sen University
C.H. Huang- National Sun Yat-Sen University
T.S. Horng- National Sun Yat-Sen University
J.Y. Li- Industrial Technology Research Institute (ITRI)
C.C. Chen- Industrial Technology Research Institute (ITRI)
C.C. Wang - Advanced Semiconductor Engineering, Inc.
C.T. Chiu - Advanced Semiconductor Engineering, Inc.
C.P. Hung - Advanced Semiconductor Engineering, Inc.

High Rejection Low-Pass-Filter Design Using Integrated Passive Device Technology for Chip Scale Module Package
Yong-Taek Lee- STATSChipPAC, Inc.
Kai Liu- STATSChipPAC, Inc.
Robert Frye- RF Design Consulting
Hyun-Tai Kim- STATSChipPAC, Inc.
Gwang Kim- STATSChipPAC, Inc.
Billy Ahn- STATSChipPAC, Inc.

High Speed Touch Screen Panels (TSPs) Assembly Using Anisotropic Conductive Adhesives (ACAs) Vertical Ultrasonic Bonding Method
Seung-Ho Kim- KAIST
Kiwon Lee- KAIST
Kyung-Wook Paik- KAIST

Joint Properties of Solder Capped Copper Pillars for 3D Packaging
Yoon-Ki Sa- Korea Institute of Industrial Technology
Sehoon Yoo- Korea Institute of Industrial Technology
Yue-Seon Shin- Korea Institute of Industrial Technology
Min-Kyu Han- Korea Institute of Industrial Technology
Chang-Woo Lee- Korea Institute of Industrial Technology

New Methodology for Enhancing Electrical Conductivity and Strength of Copper Alloy Using Combined Structure
Hyo-Soo Lee- Korea Institute of Industrial Technology
Hai-Joong Lee- Korea Institute of Industrial Technology
Hyuk-Chon Kwon- Korea Institute of Industrial Technology

Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures
Yuhki Sato- Tohoku University
Naokazu Murata- Tohoku University
Kinji Tamakawa- Tohoku University
Ken Suzuki- Tohoku University
Hideo Miura- Tohoku University

Novel Low Loss Thin Film Materials For Wireless 60 GHz Applications
Aida L. Vera López- Georgia Institute of Technology
Swapan K. Bhattacharya- Georgia Institute of Technology
Carlos A. Donado Morcillo- Georgia Institute of Technology
John Papapolymerou- Georgia Institute of Technology
Debabani Choudhury- Intel Corporation
Allen Horn- Rogers Corporation

Organic Optical Waveguide Fabrication in a Manufacturing Environment
Benson Chan- Endicott Interconnect Technologies, Inc.
How Lin- Endicott Interconnect Technologies, Inc.
Chase Carver- Endicott Interconnect Technologies, Inc.
Jianzhuang Huang- Endicott Interconnect Technologies, Inc.
Jessie Berry- Endicott Interconnect Technologies, Inc.

RF MEMS Wafer-Level Packaging Using Solder Paste by Via Filling Process
Sunghae Jung- Electronics and Telecommunications Research Institute
Myunglae Lee- Electronics and Telecommunications Research Institute
Jong-Tae Moon- Electronics and Telecommunications Research Institute

Study of Warpage Characteristics of Molded Stacked-Die MCP Using Shadow Moiré and Micro Moiré Techniques
David W. Wang- ChipMOS Technologies, Inc.
Hsiang-Ming Huang- ChipMOS Technologies, Inc.
Shu-Ching Ho- ChipMOS Technologies, Inc.
An-Hong Liu- ChipMOS Technologies, Inc.
De-Shin Liu- ChipMOS Technologies, Inc.