Testing Technique for Early Evaluation of Compression or Land Grid Array Connectors
William Brodsky - IBM Corporation

Design of RF and Wireless Packages Using Fast Hybrid Electromagnetic/Statistical Methods
Nathan Bushyager and Manos Tentzeris - Georgia Institute of Technology; Lara Martin - Motorola, Inc.

Test Structure Free Modeling Method for De embedding the Effects of Pads on Device Modeling
Cheolung Cha, Zhaoran Huang, Nan M. Jokerst, and Martin A. Brooke - Georgia Institute of Technology

Microwave Curing of Anisotropic Conductive Film Effects of Principal Parameters on Curing Situation
Kai Kay Chan, Nin Hong Yeung, Yan Cheong Chan, Sai Choo Tan, and Ka Ka Lee - City University of Hong Kong

Innovative Method of Resolving Adhesion Issues on Between Molding Compound and Substrate
Dennis Prem Kumar Chandran and Mohd Jaffri Razai - Intel Technology Sdn. Bhd.; Fwei Keat Yap - Intel Technology

RF Evaluation of Low cost Leadless Packages and Development of Distributed Electrical Models
Arun Chandrasekhar, Eric Beyne, and Walter De Raedt - IMEC vzw; Bart Nauwelaers - Katholieke Universiteit Leuven

Electronics and the Environment
Harry Charles - The Johns Hopkins University

Fracture Toughness of Cu Sn Intermetallic Compounds in Electronic Packages
Zhong Chen and Tommy Cahyadi - Nanyang Technological University; Bavani Balakrisnan and Chan Choy Chum - Institute of Materials

Research and Engineering; Ming Li - Photonic Packaging Lab, Chinese University of Hong Kong
Study of IMC Morphologies and Phase Characteristics Affected by the Reactions of Ni and Cu Metallurgies with Pb Free Solder Joints
Won Kyoung Choi, Sung K Kang, Yoon C Sohn, and Da Yuan Shih - IBM Corporation

Intermittency Study of a Stressed Metal Micro Spring Sliding Electrical Contact
Eugene Chow, Kevin Klein, David K. Fork, and Thomas Hantschel - Palo Alto Research Center (PARC)

Microwave Bonding of Silicon Dies with Thin Metal Films for MEMS Applications
Jason Clendenin and Steve Tung - University of Arkansas

Characterisation of Intermetallic Ageing in Fine Pitch Lead Free Flip Chip Joints
Paul Conway, Dezhi Li, and Paul Conway - Loughborough University

Optimization of Variable Frequency Microwave Curing Using Neural Networks and Genetic Algorithms
Cleon Davis, T. Sung, and Ravi Tanikella - Georgia Institute of Technology

RLC Effects in Fine Pitch Anisotropic Conductive FIlm Connections
Guang Bin Dou, Yan Cheong Chan, and Nin Hong Yeung - City University of Hong Kong; James E. Morris - Portlad State University

Optimization of Stencil Printing Wafer Bumping for Fine Pitch Flip Chip Applications
Jing Feng Gong, Esther Yau, Philip Chan, Ricky Lee, and Matthew Yuen - Hong Kong University of Science and Technology

A High Throughput OEO Switch Implemented in a Single BGA Package
Ichiro Hatakeyama, Takashi Yoshikawa, Kazunori Miyoshi, Kei Tanaka, Junich Sasaki, Takara Sugimoto, and Kazuhiko Kurata - NEC Corporation; Hideki Tanaka - NEC Engineering, Ltd.

Investigations of Void forming and Shear Strength of Sn42Bi58 Solder Joints for Low Cost Applications
Thomas Herzog, Klaus Jürgen Wolter, and Frank Poetzsch - Dresden University of Technology

Variations in Package Radiation Due to Changes in On Die and On Package Capacitance
Michael J. Hill and Jiangqi He - Intel Corporation

Optical Solder Effects of Self Written Waveguides in Optical Circuit Devices Coupling
Naohiro Hirose and Osamu Ibaragi - Association of Super Advanced Electronics Technologies (ASET)

Spinning and Shocking SMT Devices; Results of Centrifuge and Hi G Testing for Military Applications
Terri Houston, Jim Mills, Jonathan Carter, and Emad Zidan - ATK

A Limiting Amplifier Module using Wafer Level Package for 10Gbps Optical Transmission System
Chul Won Ju, Kyu Ha Pack, Hee Tae Lee, Eun Su Nam, and Kyoung Ik Joe - ETRI

Crack Length and Orientation Analysis of SnPb and SnAg Solder Joints in Plastic Ball Grid Array Packages from Dye Penetration Studies
Donghyun Kim, Changyoung Park, Glenn Masada, and Tess Moon - University of Texas at Austin; Jose Dias - Universite Federal de Minas Gerais Brazil; Andrew Mawer - Semiconductpr Products Sector, Motorola Inc.

Electrical Analysis and Simulation Solution for RF SAW Filter Package
Dongyoung Kim, Sungkil Hwang, and Heuisung Jang - LG innotek

Characteristics of the Pb free Solder Bump on Electroless Ni Under Bump Metallurgies
Namseog Kim, Jangwon Han, and Seyong Oh - Samsung Electronics Co. Ltd.

Model Based Alignment of Waveguide Arrays
Sue Law and Leon Poladian - University of Sydney

Electrical Effects of Floating Plane in Multiple Power Planes
Dong Ju Lee, Yong Ju Kim, Jong Ho Jang, Kun Woo Park, Young Suk Suh, Hwa Jung Kim, and Kwang yoo Byun - Hynix Semiconductor

A New Efficient Equivalent Circuit Extraction Method for Multi port High Speed Package using Multi Input Multi Output Transmission Matrix and Polynomial Curve Fitting
Heeseok Lee, Kiwon Choi, Kyoung Lae Jang, and Taeje Cho - Samsung Electronics Co. Ltd.

Characterization of High Frequency Plane to Plane Coupling through Cutout in Multi Layer Packages
Junwoo Lee and Joungho Kim - Korea Advanced Institute of Science and Technology (KAIST); Mui Seng Yeo, Mihai Dragos Rotaru, and Mahadevan K Iyer - Institute of Microelectronics (IME)

Accurate Predictions of Flip Chip BGA Warpage
Yuan Li - Altera Corporation

Intelligent Network Communicator: Highly Integrated System On Package (SOP) Testbed for RF/Digital/Opto Applications
Kyutae Lim, Mekita F. Davis, Moonkyun Maeng, Stephane Pinel, Lixi Wan, Joy Laskar, Venky Sundatam, George E. White, Madhavan Swaminathan, and Rao R. Tummala - Georgia Institute of Technology

Prediction of Interfacial Delamination Failures of a Stacked IC Structure using Combined Experimental and Simulation Methods
Chuanjun Liu and L. J. Ernst - Delft University of Technology; Guoqi Zhang, M. Van Gils, and R. Van Silfhout - CFT Philips; W. Van Driel - Philips Semiconductors

Delamination Modeling for IC Package with Multiple Initial Cracks
Yong Liu, Scott Irving, Mark Rioux, Andrew Schoenberg, and Ewe Lim - Fairchild Semiconductor Corporation

Analysis of Flip Chip Packaging Challenges on Copper Low k Interconnects
Lei Mercado, Cindy Goldberg, Shun Meen Kuo, Tien Yu Lee, and Scott Pozder - Motorola, Inc.

Adhesion of Thermoplastic Conductive Adhesives Under Humid Environment By Incorporating Self Assembled Monolayer Molecule
Kyoung sik Moon, Chris Rockett, and C. P. Wong - Georgia Institute of Technology; William Burgoyne and Christine Kretz - Air Products and Chemicals, Inc.

Unique White LED Packaging Systems
Atsushi Okuno - a; Yoshiteru Miyawaki and Noritaka Oyama - Sanyu Rec Co., Ltd.

Degradation Factors for Eye Diagrams using FDTD SPICE
Neven Orhanovic, Dileep Divekar, and Norio Matsui - Applied Simulation Technology

Digital Speckle Correlation Method For Thermal Deformation Analysis Of A Flip Chip Assembly
John H. L. Pang and X. R. Zhang - Nanyang Technological University; X. Q. Shi - Singapore Institute of Manufacturing Technology

Microwave Measurements on Dielectric Constants
Jeong Park - University of California, Irvine; Chin Lee - Univeristy of California, Irvine

Multilayer Power Delivery Network Design for High Speed Microprocessor System
Seong Geun Park, Jong Gwan Yook, and Han Kyu Park - Yonsei University; JiSeong Kim - Samsung Electronics Co. Ltd.

Measurement and Prediction of Reliability for Double Sided Area Array Assemblies
James Pitarresi and Satish Parupalli - State University of New York at Binghamton; Anthony Primavera and Mike Meilunas - Universal Instruments Corp; Shiva Kalyan Mandepudi - Binghamton University

Use of Dendrimers to Control Nanoparticle Size in Polymer Metal Nanocomposites for Embedded Capacitor Application
Suresh Pothukuchi and C. P. Wong - Georgia Institute of Technology

Comparison of the Adhesion Strength of Epoxy and Silicone Based Thermal Interface Materials
Ananth Prabhakumar and K. Srihari - State University of New York at Binghamton; Annita Zhong, Sandeep Tonapi, Donna Sherman, Herbert Cole, and Florian Schattenmann - GE Global Research

A Neural Network Model for Sensitivity Analysis of Circuit Parameters for Flip Chip Interconnects
Rana Pratap, Stephane Pinel, Daniela Staiculescu, and Joy Laskar - Georgia Institute of Technology

Copper Foils for High Density IC Packages Starting from Foil/Dielectric Adhesion
Shichun Qu - 3M
Optimization and Stochastic Procedures for Robust Design of Photonic Packages with Applications to a Generic Optoelectronic Package
Satish Radhakrishnan and Ganesh Subbarayan - Purdue University; Luu Nguyen and William Mazotti - National Semiconductor Corporation

Design and Electrical Characterization of a Novel Wafer Level Package for RF MEMS Applications
Mihai Rotaru, C. S. Premachandran, and Iyer Mahadevan - Institute of Microelectronics (IME)

Viscoelastic Properties of Underfill For Numerical Analysis of Flip Chip Packages
Man Lung Sham and Jang Kyo Kim - Hong Kong University of Science and Technology; Joo Hyuk Park - Sejong University

Thermal Electrical Simulations for Two Node Optoelectronics Modules
Lei Shan - IBM Corporation

Comparison of Electrical Interconnect and Optical Interconnect
Jaemin Shin, Chung Seok Seo, Ananthasayana Chellappa, Martin Brooke, Abhijit Chatterjee, and Nan M. Jokerst - Georgia Institute of Technology

Impact of Ingressed Moisture and High Temperature Warpage Behavior on the Robust Assembly Capability for Large Footprint PBGAs
Richard Shook, Jeff Gilbert, Ebyson Thomas, Adesoji Dairo, Brian Vaccaro, and Dave Crouthamel - Agere Systems

Electrical and Mechanical Properties of Carbon Black Filled Ethylene Propylene Rubber during Thermo Oxidation Aging
Yangyang Sun - Georgia Institute of Technology; Shijian Luo - Micron Technology, Inc.

Lead free Wave Soldering Development for PCB Assembly
Vasudivan Sunappan and Peter Collier - Singapore Institute of Manufacturing Technology (SIMTech)

Thermal Limits in Reflow Soldering Process
Paul Svasta, Daniel Simion Zanescu, and Pablo Reyes Turcu - Politehnica University of Bucharest

Demonstration of a Microwave Analogue to a Subwavelength All Optical Switch
Luke Sweatlock and Harry Atwater - Harvard University; Stefan Maier - California Institute of Technology

A Study on Epoxy Based High K Composite for Embedded Capacitor with Silver Fillers Coated Self Assemly Monolayer Insulating Materials
Ke Tang, Yang Rao, Lianhua Fan, and C. P. Wong - Georgia Institute of Technology

Lead Free Solder Bumping Process for High Temperature Automotive Application
Thorsten Teutsch and Ronald G. Blankenhorn - Packaging Technologies, Inc.; Elke Zakel - Packaging Technologies, Inc., GmbH

Development of Microwave Devices and Modules on Liquid Crystal Polymer (LCP) Substrates for SOP Applications
Dane Thompson, John Papapolymerou, and Manos Tentzeris - Georgia Institute of Technology

Interfacial Interactions of Lead Free Solder Alloys and the Effect of PCB Finish on Mechanical Properties
Chee Meng Thong and Guoyuan Li - Nanyang Technological University; Andrew Spowage - SIMTech; Peter Collier - Singapore Institute of Manufacturing Technology (SIMTech)

Development of Low Stress Materials For Low k Copper Integrated Circuit Packaging
Michael Todd, Larry Crane, George Carson, Jack Zhang, Vincent Villeda, and Kathy Costello - Henkel Loctite Corporation

Interfacial Adhesion Analysis of BCB / TiW / Cu / PbSn Technology in Wafer Level Packaging
Michael Toepper and Herbert Reichl - Fraunhofer Institute for Reliability and Microintegration IZM; Albert Achen - Dow Deutschland GmbH & Co OHG, Rheinmünster, Germany

A Thermal Aging Study on Both Au Cu and Au Al Wire Bonded Interfaces
Tu Anh Tran, Tu Anh Tran, Lois Yong, Fuaida Harun, and C. C. Yong - Motorola, Inc.

Qualitative Analysis of Coupled Transmission Lines
Wenliang Tseng, Sonfu Yeh, and Huang Pojen - National Central University; Chauchin Su - National Chiao Tung University

Application of Embedded Edge Terminations to Reduce the Edge Radiation and Noise in High Speed Printed Circuit Boards
Sujeet Vaidya - SUNY Binghamton/Georgia Insitute of Technology; Virendra Adsure - SUNY Binghamton/Eastman Kodak; Madhavan Swaminathan - Georgia Insitute of Technology; Harry Kroger - State University of New York at Binghamton

Optimal Choice of the FEM Damage Volumes for Estimation of the Solder Joint Reliability for Electronic Package Assemblies
Bart Vandevelde, Mario Gonzalez, and Eric Beyne - IMEC; Kouchi Zhang and Jo Caers - Philips CFT

Advanced Equipment Control (AEC) Use knowledge Management Concept in Semiconductor Equipment
Jong Wang and Min Liang Huang - Yuan Ze University

Technique and Equipment for a Rework of Flip Chip with No Flow Underfiller
Klaus Wolter and Gunter Kuerbis - Dresden University of Technology

Optimization of Electroplating, Stencil Printing, Ball Placement Solder Bumping Flip Chip Process Technologies
Guo Wei Xiao, Jing Feng Gong, Esther Yau, Philip Chan, Ricky Lee, and Matthew Yuen - Hong Kong University of Science and Technology

A New Low Cost Optical Transmitter Package with Uncooled Thermal Solution and J down Assembly
Ling Xie, Damaruganath Pinjala, Krishnamachari Sudharsanam, and Mahadevan K. Iyer - Institute of Microelectronics (IME); Ramana Pamidighantam - Institute of Microelecttronics (IME); Eitaro Ishimura - Mitsubishi Electric Corporation, Japan

High Precision Adhesives for Free Space Micro Optics Applications
Frank Xu - Chorum Technologies

TopFinder: A New and Efficient Tool for Topology Construction and Parameter Extraction for RF/Microwave Transistors
Mustapha Yagoub and Mustapha Yagoub - University of Ottawa

Evaluation of the Oven Reflow Bonding and the Thermo Compression Bonding of Lead Free Sn0.7Cu Solder Bumps on Low Cost FR 4 Substrate for Flip chip Applications
Esther Yau, Fung Wa Hong, and Philip C. H. Chan - Hong Kong University of Science and Technology

Efficient Inductance Calculation with Ground Plane
Yu Ting Yeh, Jack Ou, and Michael F. Caggiano - Rutgers University

Effect of Void in the Anisotropic Conductive Assemblies
Nin Hong Yeung, Yan Cheong Chan, Sai Choo Tan, Ka Ka Lee, and Kai Kay Chan - City University of Hong Kong

Magnetic/Semiconductor Multilayer Millimeter Wave Bandstop Filter
Hui Jae Yoo, Chin C Lee, Chen S Tsai, and Franco De Flaviis - University of California, Irvine

Lead Free Solder Bump Evaluation on Large Die Flip Chip Application
Leilei Zhang, Lan Hoang, and Abhay Maheshwari - Xilinx

Viscoplastic Constitutive Properties and Energy Partitioning Durability Model of Pb Free Sn3.9Ag0.6Cu Solder Alloy
Qian Zhang, Abhijit Dasgupta, and Peter Haswell - University of Maryland

Design, Material and Process Optimization for a New Thermally Enhanced BGA C2BGA
Tiao Zhou, Claudio Villa, and Haibin Du - STMicroelectronics, Inc.

3D Nonlinear Thermal Stress Analysis of VCSEL Assemblies with Lead Free Solder Flip Chip Interconnects
Yida Zou - Cisco Systems; John H. Lau - Agilent Technologies, Inc.