1. 8:00 AM - Wiring Optimization for Propagation Delay and Power Consumption of Multichip Modules with Free Space Optical Interconnect
Chung Seok Seo, Abhijit Chatterjee, and Timothy J. Drabik - Georgia Institute of Technology

2. 8:25 a.m. - An Advanced Packaging Solution for OC 768, 40 Gb/s Utilizing IBM Standard Alumina MLC Technology
Warren D. Dyckman and Edward R. Pillai - IBM

3. 8:50 a.m. - Electrical Repair of Multilayer Ceramic (MCL) Substrates
Jon Casey, Brian Sundlof, Thomas Wassick, Richard Surprenant, Harvey Hamel, Herb Stoller, Kathleen Wiley, Jerome Cohen, Michael Berger, Donald Scheider, Mark LaPlante, and William Infantolino - IBM

Refreshment Break: 9:15-10:00 a.m.

4. 10:00 a.m. - Microwave Bonding of Silicon Dies with Thin Metal Films for MEMS Applications
Jason Clendenin and Steve Tung - University of Arkansas; Nasser Budraa and John Mai - Microwave Bonding Instruments

5. 10:25 a.m. - Embedded IC Packaging Technology for Ultra Thin and Highly Compact RF Module
Stephane Pinel, Chang Ho Lee, Sangwoong Yoon, S. Nuttinck, Kyutae Lim, and Joy Laskar - Georgia Institute of Technology

6. 10:50 a.m. - Constrained Sintered, Low Temperature Co Fired Ceramic for IC Packaging Applications
Christopher R. Needes, Michael F. Barker, PatriciaT. Ollivier, Kenneth W. Hang, Kenneth E. Souders, Carl B. ChoWang, and Michael A. Smith - DuPont

7. 11:15 a.m. - Testing Technique for Early Evaluation of Compression Land Grid Array Connectors
William L. Brodsky - IBM

1. 8:00 a.m. - Lead Free Solder Assembly: Impact and Opportunity
Edwin Bradley - Motorola

2. 8:25 a.m. - Lead Free Solders: Issues of Toxicity, Availability, and Impacts of Extraction
Anna Ku - SOMA Environmental Engineering; Oladele Ogunseitan and Jean Daniel Saphores - UC Irvine; Andrew Shapiro - Jet Propulsion Laboratory, UC Irvine; Julie M. Schoenung - UC Davis

3. 8:50 a.m. - Creep Properties of Sn Rich Solder Joints
John Morris and Ho Geon Song - University of California, Berkeley; Fay Hua - Intel

Refreshment Break: 9:15 - 10:00 a.m.

4. 10:00 a.m. - Pb Free Solder Challenges in Electronic Packaging and Assembly
Fay Hua - Intel

5. 10:25 a.m. - Formation of Ag3Sn Plates in Sn Ag Cu Alloys and Optimization of their Alloy Composition
Sung K. Kang, Won Kyoung Choi, Da Yuan Shih, Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Charles Goldsmith, and Karl J. Puttlitz - IBM

6. 10:50 a.m. - Unique Phase Changes Induced by Electromigration (EM) in Solder Joints
Hua Gan, G. Xu, and K.N. Tu - University of California, Los Angeles

7. 11:15 a.m. - Reliability of the Pb Free Solder Bump on Electroless Ni Under Bump Metallurgies
Namseog Kim, S.Y. Jung, and Seyong Oh - Samsung Electronics

1. 8:00 a.m. - Solder Joint Fatigue Life Model Methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu Material Package Structures
Bret A. Zahn - ChipPAC

2. 8:25 a.m. - Study of Microvia Failure under PCB Flexing Loads
S. Kah Woon Seah, Chwee Teck Lim, and Vincent B.C. Tan - National University of Singapore; Siew Eng Quah - Motorola

3. 8:50 a.m. - Modeling Technique for Reliability Assessment of Portable Electronic Product Subject to Drop Impact Loads
Liping Zhu - Sony Ericsson Mobile Communication

Refreshment Break: 9:15 - 10:00 a.m.

4. 10:00 a.m. - Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build up Layer and Chip Scale Package Structure
Sridhar Canumalla, Hee Dong Yang, and Puligandla Viswanadham - Nokia Mobile Phones

5. 10:25 a.m. - Drop Impact Survey of Portable Electronic Products
Chwee Teck Lim, C.W. Ang, L.B. Tan, and S.K.W. Seah - National University of Singapore; Ee Hua Wong - Institute of Microelectronics

6. 10:50 a.m. - Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications
Tong Yan Tee and Hun Shen Ng - STMicroelectronics; Chwee Teck Lim and Eric Pek - National University of Singapore; Zhaowei Zhong - Nanyang Technological University

7. 11:15 a.m. - Solder Joint Behavior of Area Array Packages in Board Level Drop for Handheld Devices
Dongji Xie, Minna Arra, Sammy Yi, and Dan Rooney - Flextronics

1. 8:00 a.m. - Evaluation of Low Stress Dielectrics for Board Application
Kellee Brownlee, P. Markondeya Raj, Swapan Bhattacharya, C.P. Wong, and Rao R. Tummala - Georgia Institute of Technology; Ken ichi Shinotani - Georgia Institute of Technology, Matsushita Electric

2. 8:25 a.m. - Laser Processing of Polymer Layers of Laminated and Flexible Substrates
Zsolt Illyefalvi Vitéz - Budapest University of Technology and Economics; Richard Berenyi, Peter Gordon, Janos Pinkola, and Miklos Ruszinko - Budapest University of Technology and Economics (BUTE)

3. 8:50 a.m. - In Situ Stress and Warpage Measurements to Investigate Reliability of Flip Chip on Board Assembly without Underfill
Shubhra Bansal, P. Markondeya Raj, Swapan Bhattacharya, and Rao R. Tummala - Georgia Institute of Technology; Ken ichi Shinotani - Matsushita Electric; Michael J. Lance - Oak Ridge National Laboratory

Refreshment Break: 9:15 - 10:00 a.m.

4. 10:00 a.m. - Quantitative Analysis of Resistance Variations in As Deposited Nickel Phosphorus (NiP) Embedded Resistors
P.L. Cheng, S.Y.Y. Leung, T.W. Law, C.K. Liu, I.T. Chong, and D.C.C. Lam - Hong Kong University of Science and Technology

5. 10:25 a.m. - Characterizations of (SiOxCr1 x)yN1 y Thin Film Resistors For Integrated Passive Application
Fan Wu - Medtronic; James E. Morris - Portland State University

6. 10:50 a.m. - Integral Capacitor Dielectrics Based on Polymer Composites with Specialty Conductive Fillers
Lianhua Fan and C.P. Wong - Georgia Institute of Technology; Yasushi Kumashiro - Georgia Institute of Technology, Hitachi

7. 11:15 a.m. - Development of a Novel Aluminum Filled Composite for Embedded Passive Applications
Jianwen Xu and C.P. Wong - Georgia Institute of Technology

1. 8:00 a.m. - Field Use Conditions vs. Thermal Cycles A Physics Based Mapping Study
Krishna Tunga, James Pyland, Raghuram V. Pucha, and Suresh K. Sitaraman - Georgia Institute of Technology

2. 8:25 a.m. - Model for BGA and CSP Reliability in Automotive Underhood Applications
Pradeep Lall, Nokibul Islam, and Jeffrey C. Suhling - Auburn University; Robert Darveaux - Amkor Technology

3. 8:50 a.m. - Microstructural Dependence of Constitutive Properties of Eutectic SnAg and SnAgCu Solders
Steffen Wiese, Ekkehard Meusel, and Klaus Juergen Wolter - Dresden University of Technology

Refreshment Break: 9:15 - 10:00 a.m.

4. 10:00 a.m. - Reliability Assessment of a High Performance Flip Chip BGA Package (organic substrate based) using Finite Element Analysis
Desmond Y.R. Chong, Rahul Kapoor, and Anthony Y.S. Sun - United Test & Assembly Center

5. 10:25 a.m. - Solder Joint Life Prediction Model based on the Strain Energy Density Criterion
I. Guven, V. Kradinov, Erdogan Madenci, and Joshua L. Tor - University of Arizona

6. 10:50 a.m. - Finite Element Analysis to Develop a New Accelerating Test Method for Board Level Solder Joints for High Temperature Electronics
Wolfgang Neher - Daimler Chrysler; Wolfgang Kempe and Wolgang Wondrak - DaimlerChrysler; Wilfried Sauer - Dresden University of Technology

7. 11:15 a.m. - Acceleration Models, Constitutive Equations, and Reliability of Lead Free Solders and Joints
John H. Lau and Walter Dauksher - Agilent Technologies; Paul Vianco - Sandia National Laboratories

1. 8:00 a.m. - In Process Stress Characterization of Flip Chip Assembly on Warped Organic Substrate
Jian Zhang, Hai Ding, Daniel F. Baldwin, and I. Charles Ume - Georgia Institute of Technology

2. 8:25 a.m. - Flip Chip Assembly on PCB Substrates with Coined Solder Bumps
Jae Woong Nah and Kyung Wook Paik - Korea Advanced Institute of Science and Technology (KAIST); Soon Jin Cho and Won Hoe Kim - Samsung Electro Mechanics

3. 8:50 a.m. - Solder Shear Strength for Process Control
Krishna N. Nair, Nat Perkinson, and Glenn A. Rinne - Unitive

Refreshment Break: 9:15 - 10:00 a.m.

4. 10:00 a.m. - A Novel Algorithm for Fiber Optic Alignment Automation
Rong Zhang and Frank Shi - University of California, Irvine

5. 10:25 a.m. - Multiport Optical Filter Packages for DWDM Applications
Heinrich G. Muller, Paul Townley Smith, and Scott Hellman - Corning

5. 10:25 a.m. - Multiport Optical Filter Packages for DWDM Applications
Heinrich G. Muller, Paul Townley Smith, and Scott Hellman - Corning

7. 11:15 a.m. - Forecasting Supply Chain Components with Time Series Analysis
Lara J. Martin and John Frei - Motorola

1. 1:30 p.m. - A Bidirectional Single Fiber 1.25 Gb/s Optical Transceiver Module with SFP Package using PLC
T. Hashimoto, A. Kanda, R. Kasahara, I. Ogawa, Y. Shuto, M. Yanagisawa, A. Ohki, Shinji Mino, M. Ishii, Y. Suzuki, R. Nagase, and T. Kitagawa - Nippon Telegraph and Telephone

2. 1:55 p.m. - High Reliability 2.5 Gbit/s Modules using Silicon Platform Technology
Jean Noël Reygrobellet, Patricia Volto, Yves Hernandez, Philippe Berthier, Yannick Samson, Agnès Viala, André Coquelin, Alain Tournereau, Vincent Lecocq, Laurent Lièvre, and Dominique Laffitte - Alcatel Optronics

3. 2:20 p.m. - Receptacle Transceiver Module using Silica Waveguide for Bi Directional Transmission over a Single Fiber
Naoki Kimura, Koji Shinozaki, Naoki Kitamura, Yasuhiro Fukutomi, Yuji Minota, and Haruyasu Ando - NEC; Hideki Tanaka - NEC Engineering; Atsushi Sato - NEC Yamanashi

Refreshment Break: 2:45 - 3:30 p.m.

4. 3:30 p.m. - Process Development for 10 Gb/s Small Footprint Butterfly Transmitter
Delin Li, Tieyu Zheng, Eric Zbinden, Siva Yegnanarayanan, Jimmy Chen, Jeff Bennett, Marc Finot, Emmett Askew, Jay Walker, Hat Nguyen, Marc Epitaux, Jan Peeters Weem, and Jean-Marc Verdiell - Intel

5. 3:55 p.m. - Design Optimization for 10Gbps Electro Absorption Modulator LD Packaging
Krishnamachari Sudharsanam, Ramana Pamidighantam, Mui Seng Yeo, Ling Xie, Yiyi Ma, S. Bryan Lee, Damaruganath Pinjala, and Mahadevan K. Iyer - Institute of Microelectronics

6. 4:20 p.m. - CPW Transmission Lines on Silicon Supporting 10G/40G InP EAM Chip on Carrier Applications
Songsheng Tan, Scott C. Pollard, Lawrence Hughes, Karen I. Matthews, Graeme Maxwell, and Peter Wigley - Corning; Deepukumar Nair - Corning Intellisense

7. 4:45 p.m. - Thin Film Coolers for Localized Temperature Control in Optoelectronic Integrated Circuits
Yan Zhang, James Christofferson, Daryoosh Vashaee, Phuong Nguyen, and Ali Shakouri - University of California Santa Cruz; Gehong Zeng, Chris Labounty, Yae Okuno, Yi Chen Chiu, and John E. Bowers - University of California Santa Barbara

1. 1:30 p.m. - High Solder Joint Reliability with Lead Free Solders
Masazumi Amagai - Texas Instruments; Yoshitaka Toyoda and Takeshi Tajima - Senju Metal Industry

2. 1:55 p.m. - A Reliability Comparison of Lead Free and Eutectic Solder for Stencil Printing based Flip Chip Applications
Esther W.C. Yau, Jing Feng Gong, Benny F.W. Hong, and Philip C.H. Chan - Hong Kong University of Science and Technology

3. 2:20 p.m. - Solder Joint Reliability of Lead Free Solder Balls Assembled with SnPb Solder Paste
Horst Theuss, Thomas Kilger, and Thomas Ort - Infineon Technologies

Refreshment Break: 2:45 - 3:30 p.m.

4. 3:30 p.m. - Copper Doped Eutectic Tin Lead Bump for Power Flip Chip Applications
Shing Yeh - Delphi Delco Electronics Systems

5. 3:55 p.m. - Board Level Reliability of Components with Matte Tin Lead Finish
Luu Nguyen, Randall Walberg, Lin Zhou, and Terence Koh - National Semiconductor

6. 4:20 p.m. - Peel Test Metrology for Solder Joint Reliability of FCBGA Packages
Jinlin Wang - Intel; H.K. Lim, H.S. Lew, Woon Theng Saw, and Chew Hong Tang - Intel Technology

7. 4:45 p.m. - Evaluation of Manufacturing Assembly Process Impact on Long Term Reliability of a High Performance ASIC using Flip Chip HyperBGA Package
Jie Xue, Ken Hubbard, Phillip Li, Jennifer Tang, Jimmy Poon, and Mark Brillhart - Cisco Systems; Dave Alcoe and Robert Kunz - EIT; David Mendez - Solectron

1. 1:30 p.m. - Development of Transfer Molding Technology for Package with Die Active Side Partially Exposed
Eric Kuah, Baozong Zhao, S.G. Lee, S.C. Ho, and N. Srikanth - ASM technology Singapore; Tiao Zhou, Kum Weng Loo, and Michael Hundt - STMicroelectronics

2. 1:55 p.m. - Packaging of an Electronic Microfluidic Hybrid Sensor
Erik Jung, Ralf Assmann, Rolf Aschenbrenner, and Herbert Reichl - Fraunhofer Institute for Reliability and Microintegration IZM

3. 2:20 p.m. - A Mechanical Approach to Overcome RF MEMS Switch Stiction Problem
Lei Mercado, Shun Meen Kuo, Tien Yu Tom Lee, and Lianjun Liu - Motorola

Refreshment Break: 2:45 - 3:30 p.m.

4. 3:30 p.m. - Gold Bump Attachment of MEM Sensor Die using Thermocompression Bonding
Thomas Marinis and Joseph Soucy - Draper Laboratory

5. 3:55 p.m. - Design and Development of a New Thermally Stable High Vacuum IR Bolometer Package
C.S. Premachandran, Navas Khan, Xiaowu Zhang, Chong Ser Choong, and T.C. Chai - Institute of Microelectronics (IME)

6. 4:20 p.m. - Homogeneous Integration of Off the Shelf Silicon Based ICs on a Silicon Substrate
Mihaela Balseanu, Jon Duster, and Kevin Kornegay - Cornell University

7. 4:45 p.m. - Silicon Optical Microbench Technology with Integrated Micromachined Interconnects
Swagata Riki Banerjee - University of Minnesota; Rhonda Franklin Drayton - University of Minnesoa

1. 1:30 p.m. - A Finite Element Modeling Methodology for Thermomechanical Analysis of Printed Wiring Board Assemblies
Hai Ding, Reinhard E. Powell, Carl R. Hanna, and I. Charles Ume - Georgia Institute of Technology

2. 1:55 p.m. - Power Cycling Simulation of an IC Package: Considering Electromigration and Thermal Mechanical Failure
Yong Liu and Scott Irving - Fairchild Semiconductor

3. 2:20 p.m. - Thermo Mechanical Failure Comparison and Evaluation of CCGA and CBGA Electronic Packages
Andy Perkins and Suresh K. Sitaraman - Georgia Institute of Technology

Refreshment Break: 2:45 - 3:30 p.m.

4. 3:30 p.m. - Thermal Modeling and Design of Liquid Cooled Heat Sinks Assembled with Flip Chip Ball Grid Array Packages
Hengyun Y. Zhang and Damaruganath Pinjala - Institute of Microelectronics; Yogendra K. Joshi - Georgia Institute of Technology; Teck Neng Wong and Kok Chuan Toh - Nanyang Technological University

5. 3:55 p.m. - Thermal Modeling and Measurement of AlGaN/GaN HFETs built on Sapphire and SiC Substrates
Jeong Park, Dimitri Kakovitch, and Chin C. Lee - University of California, Irvine; Moo Whan Shin - Myong Ji University

6. 4:20 p.m. - Time Evolution of Temperature Distribution of a Flip Chip No Flow Underfill Package during Solder Reflow Process
Zhuqing Zhang, Suresh Sitaraman, and C.P. Wong - Georgia Institute of Technology; Adisak Vorakunpinij - Institute of Paper Science and Technology

7. 4:45 p.m. - Electronic Components in Cell Phone Handsets: Thermal Simulations and Evaluation of Modeling Assumptions
Awad Elie and John Ferrario - IBM

1. 1:30 p.m. - Design of Multilayer Spiral Inductor Resonator Filter
Gye An Lee and Franco De Flaviis - University of California, Irvine; Mohamed Megahed - Skyworks Solution

2. 1:55 p.m. - High Frequency SAW Correlator Module
Robert Brocato, Edwin Heller, Glenn Omdahl, Joel Wendt, and Stephanie Jones - Sandia National Laboratories; David Palmer - Sandia National Laboratiories

3. 2:20 p.m. - Embedded Passives in Organic Substrate for Bluetooth (TM) Transceiver Module
Li Li, Phil Bowles, Lih Tyng Hwang, and Steve Plager - Motorola

Refreshment Break: 2:45 - 3:30 p.m.

4. 3:30 p.m. - A Novel Integrated Dielectric Resonator Antenna for Circular Polarization
Alexandre P. Popov and Mihai Dragos Rotaru - Institute of Microelectronics

5. 3:55 p.m. - Integration of Miniaturized Patch Antennas with High Dielectric Constant Multilayer Packages and Soft and Hard Surfaces (SHS)
Rong Lin Li, Gerald DeJean, Manos M. Tentzeris, and Joy Laskar - Georgia Institute of Technology

6. 4:20 p.m. - An Investigation of the Materials and Process Parameters for Thin film MCM D and MCM L Technologies up to 100GHz
Janusz Grzyb, Didier Cottet, Ivan Ruiz, and Gerhard Troester - ETH, Electronics Labs

7. 4:45 p.m. - RF Circuit Integration using High Q Copper Inductors on Organic Substrate and Solder Bumped Flip Chip Technology
Guo Wei Xiao, Xiao Huo, and Philip C.H. Chan - Hong Kong University of Science and Technology