Wednesday, June 02, 2010
Session 8: Wirebond and Alternative Interconnect
1:30 p.m. - 5:10 p.m.
Committee: Interconnections
Versailles 1 & 2
Session Co-Chairs:
William Chen
ASE-US, Inc.
T +1-408-986-6505
F +1-408-565-0289
william.chen@aseus.com
|
Matthew Yao
Rockwell Collins
T +1-319-295-0147
F
myao@rockwellcollins.com
|
Papers:
1. 1:30 PM - Effects of Pre-Stressing on Solder Joint Failure by Pad Cratering
Venkatesh Raghavan- Binghamton University
Brian Roggeman- Universal Instruments Corporation
Michael Meilunas- Universal Instruments Corporation
Peter Borgesen- Binghamton University
2. 1:55 PM - Comparative Study of PWB Pad Cratering Subject to Reflow Soldering and Thermal Impact
Chaoran Yang- Hong Kong University of Science and Technology
Fubin Song- Hong Kong University of Science and Technology
S.W. Ricky Lee- Hong Kong University of Science and Technology
Keith Newman- Oracle
3. 2:20 PM - Failure Mechanism and Mitigation of PCB Pad Cratering
Dongji Xie- Flextronics
David Geiger- Flextronics
Dongkai Shangguan- Flextronics
Charles Cai- Flextronics
Boyi Wu- Flextronics
Billy Hu- Flextronics
Hans Liu- Multek Industries. Ltd.
Ivan Martin- Flextronics
4. 3:30 PM - Intermodulation Distortion as Indicator for Interconnect Degradation
Michael Krüger- Technische Universität Berlin
Nils F. Nissen- Fraunhofer IZM
Herbert Reichl- Technische Universität Berlin
5. 3:55 PM - Fracture Mechanics of Lead-Free Solder Joints under Cyclic Shear Load
Huili Xu- University of Texas, Arlington
Woong Ho Bang- University of Texas, Arlington
Hong-Tao Ma- Cisco Systems, Inc.
Tae-Kyu Lee- Cisco Systems, Inc.
Kuo-Chuan Liu- Cisco Systems, Inc.
Choong-Un Kim- University of Texas, Arlington
6. 4:20 PM - Underfill Acceleration Factor Based on Thermal Fatigue Crack Growth Rate
Soojae Park- IBM Corporation
Claudius Feger- IBM Corporation
Ijeoma Nnebe- IBM Corporation
7. 4:45 PM - Green Initiative-Power Management and Its Effects on Electronics Packaging
Jennifer Muncy- IBM Corporation
Roger Weekly- IBM Corporation
Jon Casey- IBM Corporation
