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Thursday, June 03, 2010

Session 1: Advances in Flip Chip Packaging
8:00 a.m. - 11:40 a.m.
Committee: Advanced Packaging
Concorde A

Session Co-Chairs:

Raj N. Master
Microsoft Corporation
T +1-650-693-0849
F
rajm@microsoft.com
Paul M. Harvey
IBM Corporation
T +1-512-286-6554
F +1-512-838-1272
PMHarvey@us.ibm.com

Papers:

1. 8:00 AM - Temperature Dependence of Thin Film Spiral Inductors on Alumina over a Temperature Range of 25º to 475º C
George E. Ponchak- NASA Glenn Reseach Center
Jennifer L. Jordan- NASA Glenn Reseach Center
Maximilian C. Scardelletti- NASA Glenn Research Center

2. 8:25 AM - Integrated Power Electronics Using a Ferrite-Based Low-Temperature Co-Fired Ceramic Materials System
Alex Roesler- Sandia National Laboratories
Josh Schare- Sandia National Laboratories
Chad Hettler- Sandia National Laboratories
Dave Abel- NASCENTechnology
George Slama- NASCENTechnology
Daryl Schofield- NASCENTechnology

3. 8:50 AM - Conductor Surface-Roughness Effect in the Loss Tangent Measurement of Low-Loss Organic Substrates from 30 GHz to 70 GHz
Carlos Donado Morcillo- Georgia Institute of Technology
Swapan K. Bhattacharya- Georgia Institute of Technology
Allen Horn- Rogers Corporation
John Papapolymerou- Georgia Institute of Technology

4. 10:00 AM - A Minimally Invasive Wideband Mixed-Mode Detector for mm-Wave BIST Applications
Said Rami- University of Florida
Andrea Paganini- IBM Corporation
William R. Eisenstadt- University of Florida

5. 10:25 AM - Terahertz Packaging: Study of Substrates for Novel Componenet Designs
Jose A. Hejase- Michigan State University
Pavel R. Paladhi- Michigan State University
Prem Chahal- Michigan State University

6. 10:50 AM - Degradation of Leakage Currents in Solid Tantalum Capacitors under Steady-State Bias Conditions
Alexander Teverovsky- Dell Perot Systems

7. 11:15 AM - Chip-Last Embedded Actives and Passives in Thin Organic Package for 1-110 GHz Multi-Band Applications
Fuhan Liu- Georgia Institute of Technology
Venky Sundaram- Georgia Institute of Technology
Sunghwan Min- Georgia Institute of Technology
Vivek Sridharan- Georgia Institute of Technology
Hunter Chan- Georgia Institute of Technology
Nitesh Kumbhat- Georgia Institute of Technology
Baik-Woo Lee- Georgia Institute of Technology
Rao Tummala- Georgia Institute of Technology
Dirk Baars- Rogers Corporation
Scott Kennedy- Rogers Corporation
Sankar Paul- Rogers Corporation


Sponsors:


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