Thursday, June 03, 2010

Session 39: Posters 3
8:00 a.m. - 11:40 a.m.
Committee: Posters
Rivoli B & C

Session Co-Chairs:

Mark Eblen Kyocera America, Inc. T +1-858-614-2537 F +1-858-573-0159 mark.eblen@kyocera.com

Nam Pham IBM Corporation T +1-512-286-8011 F +1-512-973-4240 npham@us.ibm.com

Papers:

1. 8:00 AM - Chip Embedding Technology Developments Leading to the Emergence of Miniaturized System-in-Packages
Dionysios Manessis- Technische Universität Berlin
Lars Boettcher- Fraunhofer IZM
Andreas Ostmann- Fraunhofer IZM
Rolf Aschenbrenner- Fraunhofer IZM
Herbert Reichl- Technische Universität Berlin

2. 8:25 AM - Three Dimensional Air-Gap Structures for MEMS Packaging
Rajarshi Saha- Georgia Institute of Technology
Nathan Fritz- Georgia Institute of Technology
Sue Ann Bidstrup-Allen- Georgia Institute of Technology
Paul A. Kohl- Georgia Institute of Technology

3. 8:50 AM - Demonstration of a Novel Hybrid Silicon-Resin High Density Interconnect (HDI) Substrate
B. Smith- Draper Laboratory
P. Kwok- Draper Laboratory
J. Thompson- Draper Laboratory
A. Mueller- Draper Laboratory
L. Racz- Draper Laboratory

4. 10:00 AM - 3D Integration of CMOS and MEMS Using Mechanically Flexible Interconnects (MFI) and Through Silicon Vias (TSV)
Hyung Suk Yang- Georgia Institute of Technology
Muhannad S. Bakir- Georgia Institute of Technology

5. 10:25 AM - A Novel Die to Wafer (D2W) Collective Bonding Method for MEMS and Electronics Heterogeneous 3D Integration
Won Kyoung Choi- Institute of Microelectronics, A*STAR
C.S. Premachandran- Institute of Microelectronics, A*STAR
Ling Xie- Institute of Microelectronics, A*STAR
Siong Chiew Ong- Institute of Microelectronics, A*STAR
Johnny Han He- Institute of Microelectronics, A*STAR
Guan Jie Yap- Institute of Microelectronics, A*STAR
Aibin Yu- Institute of Microelectronics, A*STAR

6. 10:50 AM - DC/DC Converter 3D Assembly for Autonomous Sensor Nodes
Thierry Hilt- CEA-LETI
Hervé Boutry- CEA-LETI
Rémi Franiatte- CEA-LETI
Frédéric Rothan- CEA-LETI
Nicolas Sillon- CEA-LETI
Frank Stam- Tyndall National Institute
Alan Mathewson- Tyndall National Institute
Ningning Wang- Tyndall National Institute
Cian O-Mathuna- Tyndall National Institute
Kenneth Rodgers- Tyndall National Institute

7. 11:15 AM - Hot Forming of Micro Glass Cavities for MEMS Wafer Level Hermetic Packaging
Jintang Shang- Southeast University
Junwen Liu- Southeast University
Chao Xu- Southeast University
Di Zhang- Southeast University
Boying Chen- Southeast University
Qing-An Huang- Southeast University
Jieying Tang- Southeast University