Thursday, June 03, 2010
Session 17: RF Packaging, Material, and Charaterization
1:30 p.m. - 5:10 p.m.
Committee: Electronic Components & RF
Champagne 1
Session Co-Chairs:
Amit P. Agrawal
Cisco Systems, Inc.
T +1-408-424-2732
F +1-408-853-2404
amiagra2@cisco.com
|
Mahadevan K. Iyer
Texas Instruments, Inc.
T +1-214-567-3019
F +1-972-917-5112
m.iyer@ti.com
|
Papers:
1. 1:30 PM - Development and Characterisation of a 3D Technology Including TSV and Cu Pillars for High Frequency Applications
J. Charbonnier- CEA LETI-Minatec
R. Hida- CEA LETI-Minatec
D. Henry- CEA LETI-Minatec
S. Cheramy- CEA LETI-Minatec
P. Chausse- CEA LETI-Minatec
M. Neyret- CEA LETI-Minatec
O. Hajji- CEA LETI-Minatec
G. Garnier- CEA LETI-Minatec
C. Brunet-Manquat- CEA LETI-Minatec
P.H. Haumesser- CEA LETI-Minatec
L. Vandroux- CEA LETI-Minatec
R. Anciant- CEA LETI-Minatec
2. 1:55 PM - Enabling 10µm Pitch Hybrid Cu-Cu IC Stacking with Through Silicon Vias
Cedric Huyghebaert- IMEC
Jan Van Olmen- IMEC
Okoro Chukwudi- IMEC
Jens Coenen- IMEC
Anne Jourdain- IMEC
Marc Van Cauwenberghe- IMEC
Rahul Agarwahl- IMEC
Alain Phommahaxay- IMEC
Michele Stucchi- IMEC
Philippe Soussan- IMEC
3. 2:20 PM - Studies on Electrical Performance and Thermal Stress of a Silicon Interposer with TSVs
Masahiro Sunohara- Shinko Electric Industries Co., Ltd.
Hideaki Sakaguchi- Shinko Electric Industries Co., Ltd.
Akihito Takano- Shinko Electric Industries Co., Ltd.
Rie Arai- Shinko Electric Industries Co., Ltd.
Kei Murayama- Shinko Electric Industries Co., Ltd.
Mitsutoshi Higashi- Shinko Electric Industries Co., Ltd.
4. 3:30 PM - Low-Cost TSV Process Using Electroless Ni Plating for 3D Stacked DRAM
Masaya Kawano- NEC Corporation
Nobuaki Takahashi- NEC Corporation
Masahiro Komuro- NEC Corporation
Satoshi Matsui- NEC Corporation
5. 3:55 PM - Electrical Characterization of 3D Through-Silicon-Vias
F. Liu- IBM Corporation
X. Gu- IBM Corporation
K.A. Jenkins- IBM Corporation
E.A. Cartier- IBM Corporation
Y. Liu- IBM Corporation
P. Song- IBM Corporation
S.J. Koester- IBM Corporation
6. 4:20 PM - Adhesion Improvement for Polymer Dielectric to Electrolytic-Plated Copper
Yangyang Sun- Micron Technology, Inc.
Xiao Li- Micron Technology, Inc.
Jaspreet Gandhi- Micron Technology, Inc.
Shijian Luo- Micron Technology, Inc.
Tom Jiang- Micron Technology, Inc.
7. 4:45 PM - Process Characterization Vehicles for 3D Integration
David V. Campbell- Sandia National Laboratories
