Friday, May 29, 2009
Session 13: Advanced Substrates and Assembly Technology
8:00 a.m. - 11:40 a.m.
Committee: Advanced Packaging
Spinnaker
Session Co-Chairs:
Sam Karikalan
Broadcom Corporation
T +1-480-753-2267
F +1-480-753-2380
samk@broadcom.com
|
James Jian Zhang
Numonyx Corporation
T +1-916-377-8893
F +1-916-356-2119
james.jian.zhang@numonyx.com
|
Papers:
1. 8:00 AM - Field Use Environment for a FCBGA in a Laptop Computer Application
Robert Darveaux- Amkor Technology, Incorporated
Corey Reichman- Amkor Technology, Incorporated
Christopher J. Berry- Amkor Technology, Incorporated
2. 8:25 AM - Crack Growth Rate of Thermally-Induced Underfill Fatigue
Soojae Park- T.J. Watson Research Center, IBM Corporation
Claudius Feger- T.J. Watson Research Center, IBM Corporation
3. 8:50 AM - Resistance Spectroscopy-Based Condition Monitoring for Prognostication of High Reliability Electronics under Shock-Impact
Pradeep Lall- Auburn University
Ryan Lowe- Auburn University
Kai Goebel- NASA Ames Research Center
4. 10:00 AM - Effect of Damping and Air Cushion on Dynamic Responses of PCB under Product Level Free Drop Impact
Seungbae Park- State University of New York, Binghamton
Da Yu- State University of New York, Binghamton
Abdullah Al-Yafawi- State University of New York, Binghamton
Jae Kwak- State University of New York, Binghamton
John Lee- State University of New York, Binghamton
5. 10:25 AM - Capacitors on Organic Modules: A New THB Failure Mode and Method of Detection
Wolfgang Sauter- IBM Corporation
Jennifer Muncy- IBM Corporation
Joseph Ross- IBM Corporation
Jeffrey Coffin- IBM Corporation
Charles Arvin- IBM Corporation
Sylvain Ouimet- IBM Corporation
Michael Triplett- IBM Corporation
6. 10:50 AM - A New Method to Measure the Moisture Expansion in Plastic Packaging Materials
Xiaosong Ma- Delft University of Technology
K.M.B. Jansen- Delft University of Technology
L.J. Ernst- Delft University of Technology
W.D. van Driel- Delft University of Technology, NXP
O. van der Sluis- Delft University of Technology, Philips Applied Technologies
G.Q. Zhang- Delft University of Technology, NXP
7. 11:15 AM - Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Michael Krüger- Technical University Berlin
Andreas Middendorf- Technical University Berlin
Ivan Ndip- Fraunhofer IZM
Nils F. Nissen- Fraunhofer IZM
Herbert Reichl- Technical University Berlin
