Friday, June 04, 2010
Session 33: High-Speed Characterization and Signaling
8:00 a.m. - 11:40 a.m.
Committee: Modeling & Simulation
Versailles 1 & 2
Session Co-Chairs:
Bruce Kim
The University of Alabama
T +1-205-348-4972
F +1-205-348-6959
bruce.kim@ua.edu
|
Zhaoqing Chen
IBM Corporation
T +1-845-435-5595
F +1-845-432-9788
zhaoqing@us.ibm.com
|
Papers:
1. 8:00 AM - Novel Sequential Electro-Chemical and Thermo-Mechanical Simulation Methodology for Annular Through-Silicon-Via (TSV) Design
B. Xie- Hong Kong Applied Science and Technology Research Institute
X.Q. Shi- Hong Kong Applied Science and Technology Research Institute
C.H. Chung- Hong Kong Applied Science and Technology Research Institute
S.W.R. Lee- Hong Kong University of Science and Technology
2. 8:25 AM - Moisture Swelling and Thermal Stress Modeling of Exposed Pad Packages under MSL Test Condition
Jie-Hua Zhao- Texas Instruments, Inc.
Siva Gurrum- Texas Instruments, Inc.
Darvin Edwards- Texas Instruments, Inc.
David Cadge- Dassault Systemes Simulia Corp.
Rob Miller- Dassault Systemes Simulia Corp.
3. 8:50 AM - Predicting Crack Initiation and Propagation Using XFEM, CZM and Peridynamics: A Comparative Study
Abigail Agwai- University of Arizona
Ibrahim Guven- University of Arizona
Erdogan Madenci- University of Arizona
4. 10:00 AM - Board Level Drop Impact Simulation and Test for Development of Wafer Level Chip Scale Package
Yong Liu- Fairchild Semiconductor Corporation
Qiuxiao Qian- Fairchild Semiconductor Corporation
Jihwan Kim- Fairchild Semiconductor Corporation
Stephen Martin- Fairchild Semiconductor Corporation
5. 10:25 AM - Self-Organized Mapping of Failure Modes in Portable Electronics Subjected to Drop and Shock
Pradeep Lall- Auburn University
Prashant Gupta- Auburn University
Dhananjay Panchagade- Auburn University
6. 10:50 AM - Investigation of the Solder Joint Fatigue Life in Combined Vibration and Thermal Cycling Tests
Tilman Eckert- Technische Universität Berlin
Michael Krüger- Technische Universität Berlin
Wolfgang H. Müller- Technische Universität Berlin
Nils F. Nissen- Fraunhofer IZM Berlin
Herbert Reichl- Technische Universität Berlin
7. 11:15 AM - The Effect of Copper Trace Routing on the Drop Test Reliability of BGA Modules
Frank Kraemer- Fraunhofer CSP
Sven Rzepka- Fraunhofer ENAS
Steffen Wiese- Fraunhofer CSP
Jens Lienig- TU Dresden
