About ECTC
Calendar
Technical Program
Technology Corner
Short Courses
Author Info
Advance Program
Committees
Conference Registration
Hotel Registration
Sheraton New Orleans
City of New Orleans
Contact ECTC
Press Information
Photo Gallery
2003 Program-at-a-glance
2002 Conference Final Program
2002 Conference Proceedings
ECTC Home
Friday, June 04, 2010

Session 13: Advanced Packaging Technologies
8:00 a.m. - 11:40 a.m.
Committee: Advanced Packaging
Concorde A

Session Co-Chairs:

Sam Karikalan
Broadcom Corporation
T +1-949-926-7296
F +1-949-926-9261
samk@broadcom.com 		Jeffrey A. Knight
Endicott Interconnect Technologies, Inc.
T +1-607-755-1105
F +1-607-755-6400
jeff.knight@eitny.com

Papers:

1. 8:00 AM - Reliability of Cu Pillar Bumps for Flip-Chip Packages with Ultra Low-k Dielectrics
Yiwei Wang- University of Texas, Austin
Kuan H. Lu- University of Texas, Austin
Jay Im- University of Texas, Austin
Paul S. Ho- University of Texas, Austin

2. 8:25 AM - Compliant, Copper Based Chip to Substrate Connections
Hyo-Chol Koo- Georgia Institute of Technology
C. Hunter Lightsey- Georgia Institute of Technology
Ping An- Georgia Institute of Technology
Paul A. Kohl- Georgia Institute of Technology

3. 8:50 AM - Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials
Kiyokazu Yasuda- Nagoya University

4. 10:00 AM - Cu Pillars on Substrates - A Low-Cost Alternative for the Next Generation of Flip Chip Packaging Technology
D. Gupta- Tessera, Inc.
H. Sato- Tessera, Inc.
Y. Nakadaira- Tessera, Inc.

5. 10:25 AM - A Package Demonstration with Solder Free Compliant Flexible Interconnects.
I. Shubin- Oracle
A. Chow- Oracle
J. Cunningham- Oracle
M. Giere- Oracle
N. Nettleton- Oracle
N. Pinckney- Oracle
J. Shi- Oracle
J. Simons- Oracle
R. Hopkins- Oracle
J. Mitchell- Oracle
D. Douglas- Oracle
E.M. Chow- Palo Alto Research Center (PARC)

6. 10:50 AM - Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint Reliability
Yong-Sung Park- KAIST
Yong-Min Kwon- KAIST
Jeong-Tak Moon- MK Electron Co., Ltd.
Young-Woo Lee- MK Electron Co., Ltd.
Jae-Hong Lee- MK Electron Co., Ltd.
Kyung-Wook Paik- MK Electron Co., Ltd.

7. 11:15 AM - Solidification Behavior of Lead Free and Tin Lead Solder Bumps
Robert Darveaux- Amkor Technology, Inc.
Corey Reichman- Amkor Technology, Inc.
Parul Agrawal- Amkor Technology, Inc.

Sponsors:

©2003, ECTC