Friday, June 04, 2010
Session 22: Nanotechnology and Advanced Packaging
8:00 a.m. - 11:40 a.m.
Committee: Materials & Processing
Champagne 2
Session Co-Chairs:
Diptarka Majumdar
Sun Chemical Corporation
T +1-201-933-4500 x1258
F
diptarka.majumdar@sunchemical.com
|
Daniel D. Lu
Henkel Corporation
T +86-21-2891-8576
F
daniel.lu@cn.henkel.com
|
Papers:
1. 8:00 AM - Extending Lower-Cost Packaging Technology into Next Generation Signaling: Techniques and Considerations
Matt Doyle- IBM Corporation
Jerry Bartley- IBM Corporation
Richard Ericson- IBM Corporation
Mark Bailey- IBM Corporation
Phil Germann- IBM Corporation
George Zettles- IBM Corporation
2. 8:25 AM - Low-Impedance Evaluation of Power Distribution Network for Decoupling Capacitor Embedded Interposers of 3-D Integrated LSI System
Katsuya Kikuchi- National Institute of AIST
Chihiro Ueda- Meisei University
Koichi Takemura- ASET
Osamu Shimada- ASET
Toshio Gomyo- ASET
Yukiharu Takeuchi- ASET
Toshikazu Ookubo- ASET
Kazuhiro Baba- ASET
Masahiro Aoyagi- National Institute of AIST
Toshio Sudo- Shibaura Institute of Technology
Kanji Otsuka- Meisei University
3. 8:50 AM - Electrical Characterization of Wafer Level Fan-Out (WLFO) Using Film Substrate for Low Cost Millimeter Wave Application
Seung Jae Lee- Amkor Technology, Korea
Sang Won Kim- Amkor Technology, Korea
Nozad Karim- Amkor Technology, Korea
Brett Dunlap- Amkor Technology, Korea
Boo Yang Jung- Amkor Technology, Korea
Ki Cheol Bae- Amkor Technology, Korea
Ji Heon Yu- Amkor Technology, Korea
Young Suk Chung- Amkor Technology, Korea
Chan Ha Hwang- Amkor Technology, Korea
Jin Young Kim- Amkor Technology, Korea
Choon Heung Lee- Amkor Technology, Korea
4. 10:00 AM - Reduce Simultaneous Switching Jitter in Number, Spatial, Time, and Frequency Dimensions
Hui Liu- Altera Corporation
Hong Shi- Altera Corporation
John Xie- Altera Corporation
5. 10:25 AM - Spiral Via Structure in a BGA Package to Mitigate Discontinuities in Multi-Gigabit SERDES System
Namhoon Kim- Xilinx, Inc.
Hongsik Ahn- Xilinx, Inc.
Chris Wyland- Xilinx, Inc.
Ray Anderson- Xilinx, Inc.
Paul Wu- Xilinx, Inc.
6. 10:50 AM - A Low-Cost QFP Design for over 8Gbps SerDes Applications with Inductive Return Path Co-Planar Waveguide Built into the Lead Frame
Ryuichi Oikawa- NEC Corporation
7. 11:15 AM - In-Situ Characterization of 3D Package Systems with On Chip Measurements
Dan Oh- Rambus, Inc.
Hai Lan- Rambus, Inc.
Chris Madden- Rambus, Inc.
Sam Chang- Rambus, Inc.
Ling Yang- Rambus, Inc.
Ralf Schmitt- Rambus, Inc.
