Friday, June 04, 2010

Session 36: Chip Package Interaction: Low-k, ULK, BGA
1:30 p.m. - 5:10 p.m.
Committee: Assembly & Manufacturing Technology
Champagne 4

Session Co-Chairs:

Mali Mahalingam Freescale Semiconductor, Inc. T +1-480-413-5368 F +1-480-413-4385 mali.mahalingam@freescale.com

Sharad Bhatt Shanta Systems, Inc. T +1-814-362-6996 F +1-814-362-9922 sharad_bhatt@ieee.org

Papers:

1. 1:30 PM - Embedded RF Passives Technology Using a Combination of Multilayer Organic Package Substrate and Silicon-Based Integrated Passive Devices
Telesphor Kamgaing- Intel Corporation
Reed Vilhauer- Intel Corporation
Vijay Nair- Intel Corporation
Debabani Choudhury- Intel Corporation

2. 1:55 PM - Inkjet-Printed System-on-Paper/Polymer “Green” RFID and Wireless Sensors
M.M. Tentzeris- Georgia Institute of Technology
R. Vyas- Georgia Institute of Technology
V. Lakafosis- Georgia Institute of Technology
A. Traille- Georgia Institute of Technology
A. Rida- Georgia Institute of Technology
G. Shaker- University of Waterloo

3. 2:20 PM - Die Thickness Effects in RF Front-End Module Stack-Die Assemblies
Kai Liu- STATS ChipPAC, Inc.
Yong Taek Lee- STATS ChipPAC, Inc.
Hyun Tai Kim- STATS ChipPAC, Inc.
Gwang Kim- STATS ChipPAC, Inc.
Robert Frye- RF Design Consulting, LLC
Hlaing Ma Phoo Pwint- STATS ChipPAC, Inc.
Billy Ahn- STATS ChipPAC, Inc.

4. 3:30 PM - Integrated AlGaN/GaN HEMTs in MCM-D Technology
Rui Liu- IMEC, K.U. Leuven
Dominique Schreurs- K.U. Leuven
Walter De Raedt- IMEC
Frederik Vanaverbeke- IMEC
Jo Das- IMEC
Marianne Germain- IMEC
Robert Mertens- K.U. Leuven

5. 3:55 PM - A Low-Cost High-Density Substrate Technology for Wireless-Related Applications
Ruonan Wang- ASTRI
Robin Lou- ASTRI
Kevin Cheng- ASTRI
Yeung Yeung- ASTRI
Lydia Leung- ASTRI
Jyh-Rong Lin- ASTRI
Tom Chung- ASTRI

6. 4:20 PM - Ultra Thin Die Embedding Technology with 20µm-Pitch Interconnection
T. Funaya- NEC Corporation
T. Buisson- IMEC
I. De Preter- IMEC
E. Beyne- IMEC
F. Iker- IMEC

7. 4:45 PM - Compact Dual-Band LTCC UWB Bandpass Filter Using Independent Transmission Zeros Technology
Seong J. Cheon- Kwangwoon University
Jun H. Park- Kwangwoon University
Sung P. Lim- Kwangwoon University
Jae Y. Park- Kwangwoon University
Yeong G. Cho- Device Design