06/02/2010
Session 10: Bonding Interconnects
8:00 a.m. - 11:40 a.m.
Committee: Materials & Processing
Champagne 2
Session Co-Chairs:
Dong Wook Kim
Xilinx Corporation
T +1-408-626-6374
F +1-408-559-9237
dongk@xilinx.com
|
Kyung-Wook Paik
KAIST
T +82-42-350-3335
F +82-42-350-8124
kwpaik@kaist.ac.kr
|
Papers:
1. 08:00 AM - Near-Eutectic Sn-Ag-Cu Solder Bumps Formation for Flip-Chip Interconnection by Electrodeposition
Yi Qin- Loughborough University
Changqing Liu- Loughborough University
G.D. Wilcox- Loughborough University
Kun Zhao- Heriot-Watt University
Changhai Wang- Heriot-Watt University
2. 08:25 AM - A New Ni-Zn Under Bump Metallurgy for Pb-Free Solder Bump Flip Chip Application
Hae-Yonng Cho- Hanyang University
Tae-Jin Kim- Hanyang University
Young Min Kim- Hanyang University
Sun-Chul Kim- Hanyang University
Jin-Young Park- Hanyang University
Young-Ho Kim- Hanyang University
3. 08:50 AM - Low Temperature Bonding to 304 Stainless Steel for High Temperature Electronic Packages
Chu-Hsuan Sha- University of California, Irvine
Chin C. Lee- University of California, Irvine
4. 10:00 AM - A Synchrotron Micro-Diffraction Investigation of Crystallographic Texture of High-Sn Alloy Films and Its Effects on Whisker Growth
Pylin Sarobol- Purdue University
Aaron Pedigo- Purdue University
John Blendell- Purdue University
Carol Handwerker- Purdue University
Peng Su- Cisco Systems, Inc.
Li Li- Cisco Systems, Inc.
Jie Xue- Cisco Systems, Inc.
5. 10:25 AM - Effect of Ag on Ripening Growth of Cu6Sn5 Grains Formed between Molten Sn-xAg-0.5Cu Solders and Cu
Moon Gi Cho- KAIST, Samsung Electronics
Yong Sung Park- KAIST
Sun-Kyoung Seo- KAIST
Kyung-Wook Paik- KAIST
Hyuck Mo Lee- KAIST
6. 10:50 AM - Effect of Electromigration on Intermetallic Compound Formation in Line-Type Cu/Sn/Cu and Cu/Sn/Ni Interconnects
L.D. Chen- Dalian University of Technology
M.L. Huang- Dalian University of Technology
S.M. Zhou- Dalian University of Technology
7. 11:15 AM - Acceptance Testing of BGA Ball Alloys
Aileen Allen- Hewlett Packard
Gregory Henshall- Hewlett Packard
Kris Troxel- Hewlett Packard
Jian Miremadi- Hewlett Packard
Elizabeth Benedetto- Hewlett Packard
Helen Holder- Hewlett Packard
Michael Roesch- Hewlett Packard
