Technical Program

Session 11: Advanced Chip to Chip/Package Interconnections for 3D and Heterogeneous Integration
Committee: Interconnections

Session Co-Chairs:

Zhang Chaoqi
Qualcomm Inc
T (+1)8588456604
chaoqi.gt.zhang@gmail.com
Seung Yeop Kook
GLOBALFOUNDRIES
T (+1)-518-319-7452
seung-yeop.kook@globalfoundries.com

Papers:

1. Scaling Solder Micro-Bump Interconnect Down to 10 μm Pitch for Advanced 3D IC Packages
Zhaozhi George Li - Intel Corporation
Yoshihiro Tomita - Intel Corporation
Adel Elsherbini - Intel Corporation
Pilin Liu - Intel Corporation
Holly Sawyer - Intel Corporation
Johanna M. Swan - Intel Corporation
Shawna Liff - Intel Corporation

2. Fluxless Bonding of Large Area (≥ 900 mm2) Dies - Opportunities and Challenges.
Adeel Bajwa - Kulicke & Soffa Industries Inc.
Tom Colosimo - Kulicke & Soffa Industries Inc.
Tim Grant - Kulicke & Soffa Industries Inc.
Bob Chylak - Kulicke & Soffa Industries Inc.

3. Laser Assisted Transfer of Solder material from a Solid-state Solder Layer for Mask-less Formation of Micro Solder Depots on Cu-pillars and ENIG Pad Structures
Matthias Fettke - Pac Tech – Packaging Technologies GmbH
Rojhat Baba - Pac Tech – Packaging Technologies GmbH
Timo Kubsch - Pac Tech – Packaging Technologies GmbH
Georg Friedrich - Pac Tech – Packaging Technologies GmbH
Robert Thalmann - Pac Tech – Packaging Technologies GmbH
Vinith Bejugam - Pac Tech – Packaging Technologies GmbH
Kim Hoey Yeoh - Pac Tech – Packaging Technologies GmbH
Thorsten Teutsch - Pac Tech – Packaging Technologies GmbH

4. Towards 5µm Interconnection Pitch with Die-to-Wafer Direct Hybrid Bonding
Emilie Bourjot - CEA-LETI
Clément Castan - CEA-LETI
Noura Nadi - CEA-LETI
Alice Bond - CEA-LETI
Nicolas Bresson - CEA-LETI
Loic Sanchez - CEA-LETI
Frank Fournel - CEA-LETI
Nicolas Raynaud - SET Corporation
Pascal Metzger - SET Corporation
Severine Cheramy - CEA-LETI

5. Development of Hybrid Bonding Process for Embedded Bump Structure with Cu-Sn/BCB Structure
Huang Chen - Tsinghua University
Xiuyu Shi - Tsinghua University
Jin Wang - Tsinghua University
Yang Hu - Tsinghua University
Qian Wang - Tsinghua University
Jian Cai - Tsinghua University

6. Comparison of 3D Packages with 20µm Bump Pitch Using Reflow Soldering and Thermal Compression Bonding
Mu Hsuan Chan - Siliconware Precision Industries Co., Ltd.
Chris Chuang - Siliconware Precision Industries Co., Ltd.
Wei Jhen Chen - Siliconware Precision Industries Co., Ltd.
Don Son Jiang - Siliconware Precision Industries Co., Ltd.
C.M. Huang - Siliconware Precision Industries Co., Ltd.
C. Key Chung - Siliconware Precision Industries Co., Ltd.

7. Copper to Gold Thermal Compression Bonding in Heterogenous Wafer-Scale Systems
Krutikesh Sahoo - University of California, Los Angeles
Saptadeep Pal - University of California, Los Angeles
Niloofar Shakoorzadeh - University of California, Los Angeles
Yu-Tao Yang - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles