Technical Program

Session 12: Flexible Interconnects and Low-Temperature Sintering
Committee: Interconnections

Session Co-Chairs:

Jean-Charles Souriau
CEA Leti
T +33 4 38 78 98 13
jcsouriau@cea.fr
Takafumi Fukushima
Tohoku University
T +81-22-795-6978
fukushima@lbc.mech.tohoku.ac.jp

Papers:

1. Wafer-Level Flexible 3D Corrugated Interconnect Formation for Scalable In-Mold Electronics with Embedded Chiplets
Tomo Odashima - Tohoku University
Shuta Nagata - Tohoku University
Yuki Susumago - Tohoku University
Noriyuki Takahashi - Tohoku University
Hisashi Kino - Tohoku University
Tetsu Tanaka - Tohoku University
Takafumi Fukushima - Tohoku University

2. Printed Stretchable Conductors for Smart Clothing: The Effect of Conductor Geometry and Substrate Properties on Electromechanical Behaviors
Udara Somarathna - Binghamton University
Gurvinder Khinda - Binghamton University
Behnam Garakani - Binghamton University
El Mehdi Abbara - Binghamton University
Nancy Stoffel - GE Global Research
Peter Borgesen - Binghamton University
Mark Poliks - Binghamton University

3. Flexible Connectors and Segmented Printed Circuit Boards for I/O and Power Delivery in Wafer-Scale Systems
Randall Irwin - University of California, Los Angeles
Kannan Thankappan - University of California, Los Angeles
Krutikesh Sahoo - University of California, Los Angeles
Saptadeep Pal - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles

4. Novel Connector Mechanism Using Anisotropic Conductive Rubber for Trillion-Node Engine as an IoT Edge Platform
Kenichi Agawa - Toshiba Electronic Devices & Storage Corporation
Tokihiko Mori - The University of Tokyo
Ryoji Ninomiya - Toshiba Electronic Devices & Storage Corporation
Minoru Takizawa - Toshiba Electronic Devices & Storage Corporation
Takayasu Sakurai - The University of Tokyo

5. TLP Bonding Process Using in Coated Cu Sheet for High-Temperature Die Attach
Hiroshi Nishikawa - Osaka University
Jianhao Wang - Nanjing University of Aeronautics and Astronautics
Kento Kariya - ROHM Co., Ltd.
Noriyuki Masago - ROHM Co., Ltd.

6. Low Temperature and Low Pressure Sintering of High Power Light Emitting Diodes with Self Reducing Copper Complex Based Paste
Sri Krishna Bhogaraju - IIMo, Technsiche Hochschule Ingolstadt
Maximilian Schmid - IIMo, Technsiche Hochschule Ingolstadt
Elias Hufnagel - IIMo, Technische Hoschshule Ingolstadt
Fosca Conti - Department of Chemical Sciences, University of Padova
Hiren R Kotadia - Warwick Manufacturing Group, Warwick University
Gordon Elger - Fraunhofer IVI, Applied Research Center “Connected Mobility and Infrastructure

7. Low-Temperature MOD Assisted Sintering of Ag Nanoparticles for Power Device Die-Attach
Xun Liu - Shenzhen Institutes of Advanced Technology
Junjie Li - Shenzhen Institutes of Advanced Technology
Li Liu - Wuhan University of Technology
Pengli Zhu - Shenzhen Institutes of Advanced Technology
Tao Zhao - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology