Technical Program

Program Sessions: Thursday June 1st 9:30 AM — 12:35 PM

Session 13: Wafer/Panel-Level and Advanced Substrate Technologies
Committee: Packaging Technologies
Room: Palazzo D

Session Co-Chairs:

Markus Leitgeb
AT&S AG
Email: [email protected]

Dean Malta
Micross Advanced Interconnect Technology
Email: [email protected]

Papers:

1. Supercarrier Redistribution Layer to Realize Ultra High Performance 2.5D Wafer Scale Packaging by CoWoS
S.Y. Hou — Taiwan Semiconductor Manufacturing Company, Ltd.
Chien Hsun Lee — Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung Ding Wang — Taiwan Semiconductor Manufacturing Company, Ltd.
Hao Cheng Hou — Taiwan Semiconductor Manufacturing Company, Ltd.

2. Development of Fine Pitch Backside Redistribution Layer (BRDL) Process in Fan-Out Panel Level Packaging (FOPLP)
Hyunju Lee — Samsung Electronics Co., Ltd.
Sung Keun Park — Samsung Electronics Co., Ltd.
Jaemok Jung — Samsung Electronics Co., Ltd.
Kwangok Jung — Samsung Electronics Co., Ltd.
Ju-il Choi — Samsung Electronics Co., Ltd.
Un-Byoung Kang — Samsung Electronics Co., Ltd.
Dongwoo Kang — Samsung Electronics Co., Ltd.

3. Fabrication of Two-types Full Panel-Sized Interposers With Fine Cu Wirings and Outstanding Electrical Reliability
Masaya Toba — Showa Denko Materials Co., Ltd.
Masashi Minami — Showa Denko Materials Co., Ltd.
Daisuke Yamanaka — Showa Denko Materials Co., Ltd.
Kazuyuki Mitsukura — Showa Denko Materials Co., Ltd.

4. Warpage Modulation for Panel-Level Compression Molding Technology for Heterogenous Integration Packaging Architectures
Liang He — Intel Corporation
Jason Xie — Intel Corporation
Shishir Deshpande — Intel Corporation
Andrew Jimenez — Intel Corporation
Jung Kyu Han — Intel Corporation
Gang Duan — Intel Corporation
Rahul Manepalli — Intel Corporation

5. ASE Fan-Out Panel Level Package Die-Shift Solutions
Ping Ching Shen — Advanced Semiconductor Engineering, Inc.
Sheng Feng Huang — Advanced Semiconductor Engineering, Inc.
Ping Feng Yang — Advanced Semiconductor Engineering, Inc.
Jen Kuang Fang — Advanced Semiconductor Engineering, Inc.

6. Thermal and Mechanical Characterization of Fan-Out Panel Level Packages by Use of Embedded Packaging Test Chips
Gerald Weis — AT&S AG
Vladimir Cherman — imec
Timo Schwarz — AT&S AG
Geert Van der Plas — imec
Johannes Stahr — AT&S AG
Andreas Zluc — AT&S AG

7. Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film™
Channing Yang — Unimicron Technology Corp.
John Lau — Unimicron Technology Corp.
Gary Chen — Unimicron Technology Corp.
Jones Huang — Unimicron Technology Corp.
Ming Li — ASM Pacific Technology, Ltd.
YH Chen — Unimicron Technology Corp.
T. J. Tseng — Unimicron Technology Corp.