Technical Program
Thursday, June 02, 2022
Session 13: Technologies for Heterogeneous Integration, Automotive and Power Electronics
8:00 AM - 11:40 AM
Committee: Packaging Technologies
Room: Silver Pearl 1
Session Co-Chairs:
|
Dean Malta Micross Advanced Interconnect Technology Dean.Malta@micross.com |
Peng Su Juniper Networks pensu@juniper.net |
Papers:
1. A Novel 3D Driver-Integrated Silicon Carbide Half-Bridge Power Module with Low Stray Inductance
Chun-Kit Cheung - Hong Kong Applied Science & Technology Research Institute
Ziyang Gao - Hong Kong Applied Science & Technology Research Institute
2. Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module
Gongyue Tang - Institute of Microelectronics (IME), A*STAR
Kazunori Yamamoto - Institute of Microelectronics (IME), A*STAR
3. Impact of Reliability Tests on the Adhesion of the Epoxy Mold Compound
David Guillon - Hitachi Energy
Andris Avots - Hitachi Energy
Katrin Schlegel - Hitachi Energy
Milad Maleki - Hitachi Energy
Isabell Ehrler - Hitachi Energy
4. Advanced Thermal Integration for HPC Packages with Two-Phase Immersion Cooling
Po-Yao Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Liang Kuo - Taiwan Semiconductor Manufacturing Company, Ltd.
Kathy Yan - Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Ming Chen - Taiwan Semiconductor Manufacturing Company, Ltd.
Marvin De-Dui Liao - Taiwan Semiconductor Manufacturing Company, Ltd.
5. Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package
Heeseok Lee - Samsung Electronics Co., Ltd.
Kyoung Min Lee - Samsung Electronics Co., Ltd.
Daehan Youn - Samsung Electronics Co., Ltd.
Kyojin Hwang - Samsung Electronics Co., Ltd.
Junghwa Kim - Samsung Electronics Co., Ltd.
6. Thermo-Mechanical Analysis of Thermal Compression Bonding Chip-Join Process
Prabudhya Roy Chowdhury - IBM Corporation
Katsuyuki Sakuma - IBM Corporation
Sathya Raghavan - IBM Corporation
Marc Bergendahl - IBM Corporation
Kamal Sikka - IBM Corporation
Sayuri Kohara - IBM Corporation
Takashi Hisada - IBM Corporation
Hiroyuki Mori - IBM Corporation
Divya Taneja - IBM Corporation
Isabel De Sousa - IBM Corporation
7. Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-Bridge Package
Chinami Marushima - IBM Corporation
Toyohiro Aoki - IBM Corporation
Koki Nakamura - IBM Corporation
Risa Miyazawa - IBM Corporation
Akihiro Horibe - IBM Corporation
Isabel De Sousa - IBM Corporation
Takashi Hisada - IBM Corporation
Kamal Sikka - IBM Corporation
