Technical Program

Session 14: Enhancements in sintering technology and power applications
Committee: Materials & Processing

Session Co-Chairs:

Mark Poliks
Binghamton University
T +1-607-727-7014
mark.poliks@eitny.com
Ivan Shubin
RAM Photonics LLS
T
ishubin@gmail.com

Papers:

1. Shear Stress and Reliability of the Sintered Ag Joints Bonding Ag SiC die on Bare Cu and/or Au Finish DBC and AMB Substrates Sintered in Nitrogen and Air Atmosphere
Guangyu Fan - Indium Corporation
Christine Labarbera - Indium Corporation
Ning-Cheng Lee - Indium Corporation
Evan Willspaugh - Rochester Institute of Technology
Lance Malone - Rochester Institute of Technology
Adam Morgan - SUNY POLY, Albany
Woongje Sung - SUNY POLY, Albany

2. Extraordinarily Enhanced Sintering Performance of Pressureless Sinterable Cu Nanoparticle Paste for Achieving Robust Die-Attach Bonding by Using Reducing Hybrid Solvent
Hai-Jun Huang - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology

3. Effect of Sintering Density on Thermal Reliability by Non-pressure Sintering Die-Attach
Takamichi Mori - OSAKA SODA CO., LTD.
Masatoshi Okuda - OSAKA SODA CO., LTD.
Ryo Katou - OSAKA SODA CO., LTD.
Suguru Hashidate - OSAKA SODA CO., LTD.
Junichirou Minami - OSAKA SODA CO., LTD.
Tetsuo Sakurai - OSAKA SODA CO., LTD.
Taro Fukui - OSAKA SODA CO., LTD.

4. On the Adhesion of a Sintered Ag Joint on a Cu Substrate Using Laser Shocks Influence of Aging
Xavier Milhet - Institut Pprime - CNRS
Thibaut De Resseguier - Insititut Pprime - CNRS
Loic Signor - Insititut Pprime - CNRS
Hadi Bassoum - Insititut Pprime - CNRS
Jacques Baillargeat - Insititut Pprime - CNRS

5. Rapid Enhancement of Thermal Conductivity by Incorporating Oxide-Free Copper Nanoparticle Clusters for Highly Conductive Liquid Metal-Based Thermal Interface Materials
Seokkan Ki - Kyung Hee University
Jaehwan Shim - Kyung Hee University
Seungtae Oh - Kyung Hee University
Seunggeol Ryu - Samsung Electronics Co., Ltd.
Jaechoon Kim - Samsung Electronics Co., Ltd.
Youngsuk Nam - Kyung Hee University

6. Large-Scale and Low-Cost Production of Graphene Nanosheets-Based Epoxy Nanocomposites with Latent Catalyst to Enhance Thermal Conductivity for Electronic Encapsulation
Zhijian Sun - Georgia Institute of Technology
Jiaxiong Li - Georgia Institute of Technology
Mingyue Zhang - Georgia Institute of Technology
Michael Yu - Georgia Institute of Technology
Kyoung-Sik J Moon Ching-ping Wong

7. Metal TIM (Indium alloy & Sn alloy TIM) for Next Generation FCBGA
YunAh Kim - Amkor Technology
HyunHye Jung - Amkor Technology
JoHyun Bae - Amkor Technology
DongSu Ryu - Amkor Technology
DongJoo Park - Amkor Technology
JinYoung Khim - Amkor Technology
MiKyoung Choi - Amkor Technology
Youngdo Kweon - Amkor Technology