Technical Program

Thursday, June 02, 2022

Session 14: Novel Bonding and and Stacking Technologies
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Silver Pearl 2

Session Co-Chairs:

Bing Dang
IBM Corporation
dangbing@us.ibm.com
Hongbin Yu
Arizona State University
yuhb@asu.edu

Papers:

1. Behavior of Bonding Strength on Wafer-to-Wafer Cu-Cu Hybrid Bonding
Shunsuke Furuse - Sony Semiconductor Solutions Corporation
Nobutoshi Fujii - Sony Semiconductor Solutions Corporation
Kengo Kotoo - Sony Semiconductor Solutions Corporation
Naoki Ogawa - Sony Semiconductor Solutions Corporation
Taichi Yamada - Sony Semiconductor Solutions Corporation
Takaaki Hirano - Sony Semiconductor Solutions Corporation
Suguru Saito - Sony Semiconductor Solutions Corporation
Yoshiya Hagimoto - Sony Semiconductor Solutions Corporation
Hayato Iwamoto - Sony Semiconductor Solutions Corporation

2. Development of Polyimide Base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Process
Satoshi Yoneda - HD Microsystems, Ltd.
Kenya Adachi - HD Microsystems, Ltd.
Daisaku Matsukawa - HD Microsystems, Ltd.
Takahiro Tanabe - HD Microsystems, Ltd.
Kaori Kobayashi - Showa Denko Materials Co., Ltd.
Toshiaki Shirasaka - Showa Denko Materials Co., Ltd.
Shizu Fukuzumi - Showa Denko Materials Co., Ltd.
Tadashi Okuda - Showa Denko Materials Co., Ltd.

3. Direct Bonding Using Low Temperature SiCN Dielectrics
Serena Iacovo - Imec
Fuya Nagano - Imec
Venkat Sunil Kumar Channam - Imec
Edward Walsby - SPTS Technologies
Kath Crook - SPTS Technologies
Keith Buchanan - SPTS Technologies
Anne Jourdain - Imec
Kris Vanstreels - Imec
Alain Phommahaxay - Imec
Eric Beyne - Imec

4. Heterogeneous Integration by the 3D Stacking of Thin Silicon Die
Pavani Vamsi Krishna Nittala - Indian Institute of Science
Karthika Haridas - Indian Institute of Science
Prosenjit Sen - Indian Institute of Science

5. Prolongation of Surface Activation Effect Using Self-Assembled Monolayer for Low Temperature Bonding of Au
Kai Takeuchi - Meisei University
Beomjoon Kim - University of Tokyo
Tadatomo Suga - Meisei University

6. Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic SITRAB Film (ASF)
Jiho Joo - Electronics and Telecommunications Research Institute
Gwang-Mun Choi - Electronics and Telecommunications Research Institute
Chanmi Lee - Electronics and Telecommunications Research Institute
In-Seok Kye - Electronics and Telecommunications Research Institute
Ki-seok Jang - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Jeong Duck Kim - Nexstar Technology Co., Ltd.
Seok Tae Hwang - Nexstar Technology Co., Ltd.

7. Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si-Bridge Package
Akihiro Horibe - IBM Corporation
Takahito Watanabe - IBM Corporation
Chinami Marushima - IBM Corporation
Hiroyuki Mori - IBM Corporation
Sayuri Kohara - IBM Corporation
Roy Yu - IBM Corporation
Marc Bergendahl - IBM Corporation
Teddie Magbitang - IBM Corporation
Rudy Wojtecki - IBM Corporation
Divya Taneja - IBM Corporation
Maxime Godard - IBM Corporation