Technical Program

Session 16: Innovation on bonding and hybrid bonding materials and processing
Committee: Materials & Processing

Session Co-Chairs:

Yung-Yu Hsu
Apple Inc.
T +1-617-866-3431
yungyu.hsu@gmail.com
Lewis Huang
Senju Electronic
T
lewis@senju.com.tw

Papers:

1. One-Step TSV Process Development for 4-Layer Wafer Stacked DRAM
Masaya Kawano - Institute of Microelectronics, A*STAR
Xiang-Yu Wang - Institute of Microelectronics, A*STAR
Qin Ren - Institute of Microelectronics, A*STAR
Woon-Leng Loh - Institute of Microelectronics, A*STAR
B.S.S. Chandra Rao - Institute of Microelectronics, A*STAR
King-Jien Chui - Institute of Microelectronics, A*STAR

2. A Novel Photosensitive Polyimide Adhesive Material for Hybrid Bonding Processing
Satoshi Yoneda - HD Microsystems, Ltd.
Daisaku Matsukawa - HD Microsystems, Ltd.
Mamoru Sasaki - HD Microsystems, Ltd.
Toshiaki Shirasaka - Showa Denko Materials Co., Ltd.
Tomoaki Shibata - Showa Denko Materials Co., Ltd.
Naoya Suzuki - Showa Denko Materials Co., Ltd.

3. Development of simultaneous transferring and bonding process for ╬╝LED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo - ETRI
Yong-Sung Eom - ETRI
Chanmi Lee - ETRI
Ki-seok Jang - ETRI
Gwang-Mun Choi - ETRI
Kwang-Seong Choi - ETRI

4. Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
Izumi Daido - Sekisui Chemical Co., Ltd.
Ryoichi Watanabe - Sekisui Chemical Co., Ltd.
Toshio Takahashi - Sekisui Chemical Co., Ltd.
Munehiro Hatai - Sekisui Chemical Co., Ltd.

5. Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications
Tzu-Heng Hung - National Chiao Tung University
Ting-Cih Kang - NANYA Technology Corporation
Shan-Yu Mao - National Chiao Tung University
Tzu-Chieh Chou - National Chiao Tung University
Han-Wen Hu - National Chiao Tung University
Hsih-Yang Chiu - NANYA Technology Corporation
Chiang-Lin Shih - NANYA Technology Corporation
Kuan-Neng Chen - National Chiao Tung University

7. A Single Layer Mechanical Debonding Adhesive for Advanced Wafer Level Packaging
Xiao Liu - Brewer Science Inc.
Yubao Wang - Brewer Science Inc.
Debbie Blumenshine - Brewer Science Inc.
Rama Puligadda - Brewer Science Inc.