Technical Program

Session 16: Innovation on Bonding and Hybrid Bonding Materials and Processing
Committee: Materials & Processing

Session Co-Chairs:

Yung-Yu Hsu
Apple Inc.
T +1-617-866-3431
yungyu.hsu@gmail.com
Lewis Huang
Senju Electronic
T
lewis@senju.com.tw

Papers:

1. One-Step TSV Process Development for 4-Layer Wafer Stacked DRAM
Masaya Kawano - Institute of Microelectronics, A*STAR
Xiang-Yu Wang - Institute of Microelectronics, A*STAR
Qin Ren - Institute of Microelectronics, A*STAR
Woon-Leng Loh - Institute of Microelectronics, A*STAR
B.S.S. Chandra Rao - Institute of Microelectronics, A*STAR
King-Jien Chui - Institute of Microelectronics, A*STAR

2. A Novel Photosensitive Polyimide Adhesive Material for Hybrid Bonding Processing
Satoshi Yoneda - HD Microsystems, Ltd.
Kenya Adach - HD Microsystems, Ltd.
Kaori Kobayashi - HD Microsystems, Ltd.
Daisaku Matsukawa - HD Microsystems, Ltd.
Mamoru Sasaki - HD Microsystems, Ltd.
Toshiaki Itabashi - HD Microsystems, Ltd.
Toshiaki Shirasaka - Showa Denko Materials Co., Ltd.
Tomoaki Shibata - Showa Denko Materials Co., Ltd.

3. Development of Simultaneous Transferring and Bonding (SITRAB) Process for ╬╝LED Arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Chanmi Lee - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
In-seok Kye - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Yong-Sung Eom - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Ki-seok Jang - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Gwang-Mun Choi - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Seok Hwan Moon - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Ho-Gyeong Yun - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong Choi - ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

4. Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
Izumi Daido - Sekisui Chemical Co., Ltd.
Ryoichi Watanabe - Sekisui Chemical Co., Ltd.
Toshio Takahashi - Sekisui Chemical Co., Ltd.
Munehiro Hatai - Sekisui Chemical Co., Ltd.

5. Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications
Tzu-Heng Hung - National Chiao Tung University
Ting-Cih Kang - NANYA Technology Corporation
Shan-Yu Mao - National Chiao Tung University
Tzu-Chieh Chou - National Chiao Tung University
Han-Wen Hu - National Chiao Tung University
Hsih-Yang Chiu - NANYA Technology Corporation
Chiang-Lin Shih - NANYA Technology Corporation
Kuan-Neng Chen - National Chiao Tung University

6. Non Conductive Film Analysis Using Cure Kinetics and Rheokinetics for Gang Bonding Process for 3DIC TSV Packaging
Ji Young Moon - Samsung Electronics Company, Ltd.
Yong Chul Shin - Samsung Electronics Company, Ltd.
Sumin Kim - Samsung Electronics Company, Ltd.
Seung Ho Hahn - Samsung Electronics Company, Ltd.
Kyeongbin Lim - Samsung Electronics Company, Ltd.
Jung Woo Jung - Samsung Electronics Company, Ltd.
Chaemook Lim - Samsung Electronics Company, Ltd.
Youngbum Kim - Samsung Electronics Company, Ltd.
Jihwan Hwang - Samsung Electronics Company, Ltd.
Minwoo Daniel Rhee - Samsung Electronics Company, Ltd.

7. A Single Layer Mechanical Debonding Adhesive for Advanced Wafer Level Packaging
Xiao Liu - Brewer Science, Inc.
Yubao Wang - Brewer Science, Inc.
Debbie Blumenshine - Brewer Science, Inc.
Mei Dong - Brewer Science, Inc.
Rama Puligadda - Brewer Science, Inc.