Technical Program

Session 20: Interconnection Reliability
Committee: Applied Reliability

Session Co-Chairs:

René Rongen
NXP Semiconductors
T +31-(0)6-51171461
rene.rongen@nxp.com
Seung-Hyun Chae
SK Hynix
T +82-31-5184-3108
seunghyun1.chae@sk.com

Papers:

1. Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications
Pradeep Lall - Auburn University
Jinesh Narangaparambil - Auburn University
Scott Miller - NextFlex National Manufacturing Institute

2. Interconnection Reliability of Mini LEDs for Display Applications
In-Seok Kye - Electronics and Telecommunications Research Institute
Jiho Joo - Electronics and Telecommunications Research Institute
Gwang-Mun Choi - Electronics and Telecommunications Research Institute
Chanmi Lee - Electronics and Telecommunications Research Institute
Ki-Seok Jang - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Yong-Jun Oh - Hanbat National University,South Korea

3. Study of Long-Term Solder Joint and Board-Level Reliability Performance of Thin Nickel Plating ENEPIG Laminate LGA Package
SeokPhyo Cheon - Analog Devices
JooYeop Kim - Analog Devices
Arun Raj - Analog Devices

4. Copper Pillar Voids in a Flip Chip Package During High Temperature Application
Sudan Ahmed - NXP Semiconductors
Amar Mavinkurve - NXP Semiconductors
CS Foong - NXP Semiconductors
Wei-En Chen - NXP Semiconductors
Miao Wang - NXP Semiconductors
Trent Uehling - NXP Semiconductors
Nishant Lakhera - NXP Semiconductors

5. Fabrication and Reliability Analysis of Quasi-Single Crystalline Cu Joints by Using Highly <111>-Oriented Nanotwinned Cu
Jia-Juen Ong - National Yang Ming Chiao Tung University
Chih Chen - National Yang Ming Chiao Tung University

6. A Comparative Study of the Thermomechanical Reliability of Fully Filled and Conformal Through Glass Via (TGV)
Ke Pan - Binghamton University

7. Broadband Characterization of Polymers Under Reliability Stresses and Impact of Capping Layer
Nicolas Pantano - IMEC
Emmanuel Chery - IMEC
Maaike Op de Beeck - IMEC
John Slabbekoorn - IMEC
Eric Beyne - IMEC