Technical Program

Session 20: Reliability of Automotive Electrification and Autonomous Electronic Components
Committee: Applied Reliability

Session Co-Chairs:

Tz-Cheng Chiu
National Cheng Kung University
T +886-6-2757575
tcchiu@mail.ncku.edu.tw
Vikas Gupta
ASE US, Inc
T +1-214-554-1152
Gvikas.Gupta@outlook.com

Papers:

1. Hardware Reliability in Robo-Taxi
Hualiang Shi - Lyft
Hannah Talisse - Lyft
Steven Khau - Lyft
Marco Marroquín - Lyft

2. Mechanical Property and Microstructure Evolution in SAC and SAC+X Lead Free Solders Exposed to Various Thermal Cycling Profiles
SM Kamrul Hasan - Auburn University
Mohammad Al Ahsan - Auburn University
Abdullah Fahim - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University

3. Deep Learning Assisted Quantitative Assessment of the Porosity in Ag-Sinter Joints Based on Non-destructive Acoustic Inspection
Sebastian Brand - Fraunhofer IMWS
Michael Kögel - Fraunhofer IMWS
Linh Bach - Fraunhofer IISB
Frank Altmann - Fraunhofer IMWS

4. Reliability of 6-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)
John Lau - Unimicron Technology
CT Ko - Unimicron Technology
Tony Peng - Unimicron Technology
TJ Tseng - Unimicron Technology
Henry Yang - Unimicron Technology
Tim Xia - Unimicron Technology
Bruce Lin - Unimicron Technology
Eagle Lin - Unimicron Technology
Leo Chang - Unimicron Technology
Hsing Ning Liu - Unimicron Technology
Curry Lin - Unimicron Technology

5. In Situ Degradation Monitoring Methods During Lifetime Testing of Power Electronic Modules
Alexander Schiffmacher - IMTEK-University of Freiburg
David Strahringer - IMTEK-University of Freiburg
Shreyas Malasani - IMTEK-University of Freiburg
Carsten Kempiak - Otto-von Guericke-University Magdeburg, IESY
Andreas Lindemann - Otto-von Guericke-University Magdeburg, IESY
Juergen Wilde - IMTEK-University of Freiburg

6. Data-Driven Remaining Useful Life Prediction of QFN Packages on Board Level with On-Chip Stress Sensors
Daniel Riegel - Robert Bosch GmbH
Przemyslaw Jakub Gromala - Robert Bosch GmbH
Bongtae Han - University of Maryland
Sven Rzepka - Fraunhofer Institute for Electronic Nano Systems

7. Board Level Temperature Cycling Reliability of mmWave Modules on Hybrid Substrates
Laura Wambera - TU Dresden
Karsten Meier - TU Dresden
Karlheinz Bock - TU Dresden
Christian Götze - GLOBALFOUNDRIES
Marcel Wieland - GLOBALFOUNDRIES