Technical Program

Session 22: Advanced Package Modeling & Reliability
Committee: Applied Reliability
joint with Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Wei Wang
Qualcomm Technologies, Inc.
T +1-858-651-5933
wwang@g.clemson.edu
Sandy Klengel
Fraunhofer Institute for Microstructure of Materials and Systems
T +49 1733592438
sandy.klengel@imws.fraunhofer.de

Papers:

1. Fracture Modeling and Characterization of Underfill/Polymer Interfacial Adhesion in RDL Interposer Package
Shu-Shen Yeh - Taiwan Semiconductor Manufacturing Company, Ltd.
P. Y. Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
C. K. Hsu - Taiwan Semiconductor Manufacturing Company, Ltd.
Y. S. Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
J. H. Wang - Taiwan Semiconductor Manufacturing Company, Ltd.
P. C. Lai - Taiwan Semiconductor Manufacturing Company, Ltd.
C. H. Chen - Taiwan Semiconductor Manufacturing Company, Ltd.
Y. C. Lee - Taiwan Semiconductor Manufacturing Company, Ltd.
M. C. Yew - Taiwan Semiconductor Manufacturing Company, Ltd.
S. K. Cheng - Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng - Taiwan Semiconductor Manufacturing Company, Ltd.

2. Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year
Pradeep Lall - Auburn University
Yunli Zhang - Auburn University
Vishal Mehta - Auburn University
Madhu Kasturi - Auburn University
Padmanava Choudhury - Auburn University
Haotian Wu - Auburn University
Ed Davis - Auburn University
Jeff Suhling - Auburn University

3. Reliability Modeling of Micro-vias in High-Density Redistribution Layers
Pratik Nimbalkar - 3D Systems Packaging Research Center, Georgia Institute of Technology
Mohanalingam Kathaperumal - 3D Systems Packaging Research Center, Georgia Institute of Technology
Fuhan Liu - 3D Systems Packaging Research Center, Georgia Institute of Technology
Madhavan Swaminathan - 3D Systems Packaging Research Center, Georgia Institute of Technology
Rao Tummala - 3D Systems Packaging Research Center, Georgia Institute of Technology

4. Simulation of Moisture-Induced Plasticization in Transfer-Molded Optical Sensor Packages Using a Time – Temperature – Moisture Concentration Superposition
Fabian Huber - ams AG
Harald Etschmaier - ams AG
Peter Hadley - Graz University of Technology

5. Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding
Kai-Cheng Shie - National Chiao Tung University
Po-Ning Hsu - National Chiao Tung University
Yu-Jin Li - National Chiao Tung University
K.N. Tu - National Chiao Tung University
Benson Tzu-Hung Lin - MediaTek Inc
Chia-Cheng Chang - MediaTek Inc
Chih Chen - National Chiao Tung University

6. Effects of Heatsink Pressure and PCB Design Variations on BGA Solder Joint Reliability
Omar Ahmed - Juniper Networks
Leif Hutchinson - Juniper Networks
Peng Su - Juniper Networks
Travis Dale - Purdue University
Ganesh Subbarayan - Purdue University
Carol Handwerker - Purdue University
John Blendell - Purdue University
Tengfei Jiang - University of Central Florida

7. A Systematic Study and Lifetime Modeling on the Board Level Reliability of SSD after Temperature Cycling Test
Choongpyo Jeon - Samsung Electronics Company, Ltd.
Youngsung Choi - Samsung Electronics Company, Ltd.
Keunho Rhew - Samsung Electronics Company, Ltd.
Jinsoo Bae - Samsung Electronics Company, Ltd.
Yeungjung Cho - Hanyang University
Sangwoo Pae - Samsung Electronics Company, Ltd.