Technical Program

Thursday, June 02, 2022

Session 22: AI, Quantum Computing and Novel 3D Packaging Solutions
1:30 PM - 5:10 PM
Committee: Emerging Technologies
Room: Coral 1&2

Session Co-Chairs:

Yang Liu
Nokia Bell Labs
yang3d@gmail.com
Vaidyanathan Chelakara
Acacia Communications
cvaidyanathan@acacia-inc.com

Papers:

1. RF Characterization on Nb-Based Superconducting Silicon Interconnect Fabric for Future Large-Scale Quantum Applications
Yu-Tao Yang - University of California, Los Angeles
Haoxiang Ren - University of California, Los Angeles
Su Kong Chong - University of California, Los Angeles
Gang Qiu - University of California, Los Angeles
Shu-Yun Ku - University of California, Los Angeles
Yang Cheng - University of California, Los Angeles
Chaowei Hu - University of California, Los Angeles
Tiema Qian - University of California, Los Angeles
Kuan-Neng Chen - University of California, Los Angeles
Ni Ni - University of California, Los Angeles
Kang L. Wang - University of California, Los Angeles

2. Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
Yu-An Chen - National Taiwan University
Po-Shao Shih - National Taiwan University
Fu-Ling Chang - National Taiwan University
Simon Johannes Gräfner - National Taiwan University
Jeng-Hau Huang - National Taiwan University
Ching-Han Huang - National Taiwan University
Yung-Sheng Lin - ASE Group
Yun-Ching Hung - ASE Group
Chin-Li Kao - ASE Group
David Tarng - ASE Group
CR Kao - National Taiwan University

3. Design of Compact Microwave Multiplexer for RF Reflectometry Characterization of Silicon-Based Spin Qubits
Vignesh Shanmugam Bhaskar - Institute of Microelectronics (IME), A*STAR
Mihai Dragos Rotaru - Institute of Microelectronics (IME), A*STAR

4. Small Package Size Low Power CMOS Image Sensor Using Two Different Type Small Through Silicon Vias Technology for 3D Packaging
Hoi-Jin Lee - Samsung Electronics Co., Ltd.
Heeseok Lee - Samsung Electronics Co., Ltd.
Kyunghwan Lee - Samsung Electronics Co., Ltd.

5. Stability Analysis of Nanoscale Copper-Carbon Hybrid Interconnects
Bhawana Kumari - Indian Institute of Technology Dhanbad
Rohit Sharma - Indian Institute of Technology Ropar
Manodipan Sahoo - Indian Institute of Technology Dhanbad

6. Functional Testing of AI Cores Through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
Mukta Farooq - IBM Corporation
Arvind Kumar - IBM Corporation
Saekyu Lee - IBM Corporation
Ravi Bonam - IBM Corporation
Juan Gomez - IBM Corporation
James Kelly - IBM Corporation
Kohji Hosokawa - IBM Corporation
Akiyo Nomura - IBM Corporation
Yasuteru Kohda - IBM Corporation
Timothy Dickson - IBM Corporation
Katsuyuki Sakuma - IBM Corporation

7. Exploring the Impact of Parametric Variability on Eye Diagram of On-Chip Multi-Walled Carbon Nanotube Interconnects Using Fast Machine Learning Techniques
Km Dimple - Indian Institute of Technology Roorkee
Surila Guglani - Indian Institute of Technology Roorkee
Suyash Kushwaha - Indian Institute of Technology Ropar
Rahul Kumar - Indian Institute of Technology Roorkee
Sourajeet Roy - Indian Institute of Technology Roorkee
Rohit Sharma - Indian Institute of Technology Ropar
Brajesh Kumar Kaushik - Indian Institute of Technology Roorkee