Technical Program

Session 25: Advances in Assembly Methods
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Jae-Woong Nah
IBM Corporation
T +1-914-945-1875
jnah@us.ibm.com

Papers:

1. Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
Yu Lung Huang - Siliconware Precision Industries Co., Ltd
Key Chung - Siliconware Precision Industries Co., Ltd
Chang Fu Lin - Siliconware Precision Industries Co., Ltd
Kuo Haw Yu - Siliconware Precision Industries Co., Ltd
Rung Jeng Lin - Siliconware Precision Industries Co., Ltd
Wilson Hong - Siliconware Precision Industries Co., Ltd

2. Cold Spray: A Disruptive Technology for Enabling Novel Packaging Thermomechanical Solutions
Feras Eid - Intel Corporation
Aastha Uppal - Intel Corporation
Johanna Swan - Intel Corporation

3. CoW Package Solution for Improving Thermal Characteristic of 3D TSV-SiP for AI-Inference
Sun-Kyoung Seo - Samsung Electronics Company, Ltd.
Chajea Jo - Samsung Electronics Company, Ltd.
Mina Choi - Samsung Electronics Company, Ltd.
Taehwan Kim - Samsung Electronics Company, Ltd.
Hyo-eun Kim - Samsung Electronics Company, Ltd.

4. A Study on IMC Morphology and Integration Flow for Low Temperature and High Throughput TCB down to 10um Pitch Microbumps
Jaber Derakhshandeh - IMEC
Carine Gerets - IMEC
Fumihiro Inoue - IMEC
Giovanni Capuz - IMEC
Vladimir Cherman - IMEC
Melina Lofrano - IMEC
Lin Hou - IMEC
Tom Cochet - IMEC
Inge De Preter - IMEC
Tomas Webers - IMEC
Pieter Bex - IMEC

5. Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
Aakrati Jain - IBM Corporation
Kamal Sikka - IBM Corporation
Juan-Manuel Gomez - IBM Corporation
Dishit Parekh - IBM Corporation
Marc Bergendahl - IBM Corporation
Jeroen van Borkulo - ASM Laser Separation International B.V.
Kees Biesheuvel - ASM Laser Separation International B.V.
Roman Doll - ASM Laser Separation International B.V.
Mark Mueller - ASM Laser Separation International B.V.

6. Ultra-Thinning of 20-nm Node DRAMs down to 3 μm for Wafer-on-Wafer (WOW) Applications
Zhiwen Chen - Tokyo Institute of Technology
Naoko Araki - Tokyo Institute of Technology
Youngsuk Kim - Tokyo Institute of Technology
Tadashi Fukuda - Tokyo Institute of Technology
Koji Sakui - Tokyo Institute of Technology
Tomoji Nakamura - Tokyo Institute of Technology
Tatsuji Kobayashi - Micron Memory Japan
Takashi Obara - Micron Memory Japan
Takayuki Ohba - Tokyo Institute of Technology

7. Fully Additive Manufacturing of Passive Circuit Elements using Aerosol Jet Printing
Emuobosan Enakerakpo - Binghamton University
Mohammed Alhendi - Binghamton University
Gurvinder Singh Khinda - Binghamton University
Behnam Garakani - Binghamton University
K. Udara Sandekelum Somarathna - Binghamton University
Mark Poliks - Binghamton University
Stephen Gonya - Lockheed Martin Corporation
Venugopala Basava - Lockheed Martin Corporation