Technical Program

Session 27: Millimeter-Wave RF Components and Modules for 5G
Committee: RF, High-Speed Components & Systems

Session Co-Chairs:

Craig Gaw
NXP Semiconductor
T +1-480-814-5142
c.a.gaw@ieee.org
Jaemin Shin
Apple Inc.
T +1-858-207-0336
sjm1218@gmail.com

Papers:

1. Metaconductor Based Highly Energy Efficient Differential Striplines for 112 Gbps Data Bus with Sub 0.1 dB/mm Package Insertion Loss
Hae-in Kim - University of Florida
Saeyeong Jeon - University of Florida
Rockwell Hsu - Cisco Systems, Inc.
Brice Achkir - Cisco Systems, Inc.
Yong-Kyu Yoon - University of Florida

2. Multi-Terminal Ultra-Thin 3D Nanoporous Silicon Capacitor Technology for High-Speed Circuits Decoupling
Mohamed Mehdi Jatlaoui - Murata Integrated Passive Solutions, SAS, Caen, France
Charles Muller - Murata Integrated Passive Solutions, SAS, Caen, France
Florent lallemand - Murata Integrated Passive Solutions, SAS, Caen, France
Shunsuke Abe - Murata Manufacturing Co., Ltd., Kyoto, Japan
Seiji Hidaka - Murata Manufacturing Co., Ltd., Kyoto, Japan
Hitoshi Matsuno - Murata Manufacturing Co., Ltd., Kyoto, Japan
Ryo Kasai - Murata Manufacturing Co., Ltd., Kyoto, Japan
Takashi Takeuchi - Murata Manufacturing Co., Ltd., Kyoto, Japan
Sho Kubota - Murata Manufacturing Co., Ltd., Kyoto, Japan

3. Mechanical and Ka-Band Electrical Reliability Testing of Interconnects in 5G Wearable System-on-Package Designs Under Bending
Yi Zhou - Georgia Institute of Technology
Kexin Hu - Georgia Institute of Technology
Manos M. Tentzeris - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology

4. Millimeter Wave Circuits Using Reduced Height 3D Printed Air Waveguides for Automotive Applications
Yihang Chu - Michigan State University
Yamini Kotriwar - Michigan State University
Premjeet Chahal - Michigan State University

5. A Novel Methodology for DDR5 System Power Integrity Simulation using a Markov-Chain-Based Stochastic DRAM Power Model
Woo-Jin Na - SAMSUNG Electronics / Semiconductor division

6. Mass Production of Air Filled Substrate Integrated Waveguides (AFSIW) for Ultra-Low Loss, Broadband Radar Applications
Heinrich Trischler - AT&S AG
Siddhartha Sinha - IMEC
Erich Schlaffer - AT&S AG
Ilja Ocket - IMEC

7. Characterisation of RF Components and Connectors for Advanced 5G Applications
Kimmo Rasilainen - University of Oulu
Marko E. Leinonen - University of Oulu
Olli Kursu - University of Oulu
Klaus Nevala - University of Oulu
Juha-Matti Ojakoski - University of Oulu
Markus Berg - University of Oulu & ExcellAnt Oy
Aarno Pärssinen - University of Oulu