Technical Program
Friday, June 03, 2022
Session 27: Interconnection Reliability
8:00 AM - 11:40 AM
Committee: Applied Reliability
Room: Silver Pearl 3
Session Co-Chairs:
|
René Rongen NXP Semiconductors rene.rongen@nxp.com |
Seung-Hyun Chae SK Hynix seunghyun1.chae@sk.com |
Papers:
1. Thermal Cycling Induced Interconnect Stability Degradation Mechanism in Low Melting Temperature Solder Joints
Kendra Young - Portland State University
Raiyo Aspandiar - Intel Corporation
Nilesh Badwe - Indian Institute of Technology Kanpur
Satyajit Walwadkar - Intel Corporation
Young-Woo Lee - MK Electron
Tae-Kyu Lee - Cisco Systems, Inc.
2. Interconnection Reliability of Mini LEDs for Display Applications
In-Seok Kye - Electronics and Telecommunications Research Institute
Jiho Joo - Electronics and Telecommunications Research Institute
Gwang-Mun Choi - Electronics and Telecommunications Research Institute
Chanmi Lee - Electronics and Telecommunications Research Institute
Ki-Seok Jang - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Yong-Jun Oh - Hanbat National University
3. Study of Long-Term Solder Joint and Board-Level Reliability Performance of Thin Nickel Plating ENEPIG Laminate LGA Package
Seok Phyo Tchun - Analog Devices
Joo Yeop Kim - Analog Devices
Arun Raj - Analog Devices
4. Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications
Pradeep Lall - Auburn University
Jinesh Narangaparambil - Auburn University
Scott Miller - NextFlex National Manufacturing Institute
5. Fabrication and Reliability Analysis of Quasi-Single Crystalline Cu Joints by Using Highly <111>-Oriented Nanotwinned Cu
Jia-Juen Ong - National Yang Ming Chiao Tung University
Dinh-Phuc Tran - National Yang Ming Chiao Tung University
You-Yi Lin - National Yang Ming Chiao Tung University
Po-Ning Hsu - National Yang Ming Chiao Tung University
Chih Chen - National Yang Ming Chiao Tung University
6. A Comparative Study of the Thermomechanical Reliability of Fully Filled and Conformal Through Glass Via (TGV)
Ke Pan - Binghamton University
Yangyang Lai - Binghamton University
Seungbae Park - Binghamton University
Chukwudi Okoro - Corning Corporation
Dhananjay Joshi - Corning Corporation
Scott Pollard - Corning Corporation
7. Broadband Characterization of Polymers Under Reliability Stresses and Impact of Capping Layer
Nicolas Pantano - Imec
Emmanuel Chery - Imec
Maaike Op de Beeck - Imec
John Slabbekoorn - Imec
Eric Beyne - Imec
