Technical Program

Friday, June 03, 2022

Session 28: Packaging Assembly: Solder, Sintering, and Thermal Interface Materials
8:00 AM - 11:40 AM
Committee: Materials & Processing
joint with Assembly & Manufacturing Technology
Room: Coral 1&2

Session Co-Chairs:

Zia Karim
Yield Engineering Systems
zkarim@yieldengineering.com
Mark Poliks
Binghamton University
mpoliks@binghamton.edu

Papers:

1. High Thermal Graphite Thermal Interface Material (TIM) Solution Applied to Fan-Out Platform
Pin-Jing Su - Siliconware Precision Industries Co., Ltd.
Dan Lin - Siliconware Precision Industries Co., Ltd.
Shane Lin - Siliconware Precision Industries Co., Ltd.
Xi-Zhang Xu - Siliconware Precision Industries Co., Ltd.
Rung Jeng Lin - Siliconware Precision Industries Co., Ltd.
Liang-Yih Hung - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.

2. Optimizing Reflowed Solder Thermal Interface Material (sTIMs) Processes for Emerging Heterogeneous Integrated Packages
DaeWoon Lee - Heller Industries, Inc.
Ryan Mayberry - Indium Corporation
Andy Mackie - Indium Corporation
Bret Hable - Heller Industries, Inc.
David Heller - Heller Industries, Inc.
Robert Jarrett - Heller Industries, Inc.
Xike Zhao - Heller Industries, Inc.
Thomas Nash - Heller Industries, Inc.

3. Large, High Conductivity Direct-Fill Copper Thermal Vias for High Power Devices
Alfred Zinn - Kuprion, Inc.
Alex Capanzana - Kuprion, Inc.
Nhi Ngo - Kuprion, Inc.
Hannah Zinn - Kuprion, Inc.
Khanh Nguyen - Kuprion, Inc.
Randall Stoltenberg - Kuprion, Inc.

4. Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect (FLI) Bumping Applications
Yue Deng - Intel Corporation
Xike Zhao - Heller Industries, Inc.
Liang He - Intel Corporation
David Wright - Heller Industries, Inc.
Hossein Madanipour - Intel Corporation
Bret Halbe - Heller Industries, Inc.
Jung Kyu Han - Intel Corporation
Fred Tarazi - Heller Industries, Inc.
Gang Duan - Intel Corporation
Dror Trifon - Heller Industries, Inc.
Rahul Manepalli - Intel Corporation

5. Thermal Performance of Advanced Thermal Interface Materials for High Power Flip Chip Lidded Ball Grid Array (FCLBGA)
YoungJoon Koh - Amkor Technology
SangHyuk Kim - Amkor Technology
EunSook Sohn - Amkor Technology
JinYoung Khim - Amkor Technology

6. Non-Oil Bleed Thermal Gap Fillers for Long-Term Reliability of Solid State Drive
Vigneshwarram Kumaresan - Western Digital
Mutharasu Devarajan - Western Digital

7. Printed Silver Micro-Pillars Embedded in a Phase Change Material Matrix for Thermal Management Applications
Roberto Aga - KBR/AFRL
Laura Davidson - KBR/AFRL
Carrie Bartsch - Air Force Research Laboratories
Emily Heckman - Air Force Research Laboratories