Technical Program

Session 28: High-Speed Signal Integrity and Interconnections
Committee: RF, High-Speed Components & Systems

Session Co-Chairs:

Jaemin Shin
Apple Inc.
T +1-858-207-0336
Chuei-Tang Wang
Taiwan Semiconductor Manufacturing Company (TSMC)
T +886 933 580 009


1. Machine Learning Based Design Space Exploration and Applications to Signal Integrity Analysis of 112Gb SerDes Systems
Alex Manukovsky - Intel Corporation
Yuri Shlepnev - Simberian Inc.
Zurab Khasidashvili - Intel Corporation

2. Line Coupling, Ground Defect, Port Termination, and Line Parameters Extraction for Coupled Lines with Mixed-mode Stimuli
Lih-Tyng Hwang - NSYSU
Ming Yuan Huang - NSYSU
Hung-Chih Lin - NSYSU
Chien-Chang Huang - Yuan Ze University

3. Broadband Permittivity Characterization of Polymers up to 110GHz using Coplanar Waveguides
Nicolas Pantano - IMEC
John Slabbekoorn - IMEC
Fabrice Duval - IMEC
Eric Beyne - IMEC

4. Design and Development of High Density Fan-Out Wafer Level Package (HD-FOWLP) for Deep Neural Network (DNN) Chiplet Accelerators using Advanced Interface Bus (AIB)
Mihai Rotaru - Institute of Microelectronics, A*STAR
Wei Tang Dutta Rahul Zhengya Zhang

5. Signal and Power Integrity Analysis of A 0.38 pJ/bit 12Gb/s Parallel Interface for Die-to-Die Link Applications
Po-Hao Chang - MediaTek
Chih-Lun Chung - MediaTek
Ying-Yu Hsu - MediaTek
Chen-Feng Chiang - MediaTek

6. Signal Integrity(SI) Aware HBM2e/3 Interposer Design Approach Considering Y-Axis Offset Between Logic and HBM Die for HPC/AI/Network Applications
Taeyun Kim - Samsung Electronics Company, Ltd.
Chanmin Jo - Samsung Electronics Company, Ltd.
Sungwook Moon - Samsung Electronics Company, Ltd.

7. Differential DIMM OpenCAPI Memory Interface High Speed Channel Robustness and Scalability Study
Biao Cai - IBM Corporation
Kevin Mcilvain - IBM Corporation
Junyan Tang - IBM Corporation
Kyle Giesen - IBM Corporation
Zhaoqing Chen - IBM Corporation
Hongqing Zhang - IBM Corporation
Chris Steffen - IBM Corporation
Victor Mahran - Smart Modular Technologies
Zhineng Fan - Amphenol ICC
Luis Fukazawa - SMART Modular Technologies
Roc Lv - Unimicron