Technical Program

Session 3: Advanced Heterogenous Chiplet and Integration for HPC
Committee: Packaging Technologies

Session Co-Chairs:

Ning Ge
Consultant
T +1-650-966-4796
greene.ge@gmail.com
Jaesik Lee

T
jaesikl@google.com

Papers:

1. Analysis on Distortion of Fan-Out Panel Level Packages (FOPLP)
Yongjin Park - Samsung Electronics Company, Ltd.
Bongsoo Kim - Samsung Electronics Company, Ltd.
Tae-Ho Ko - Samsung Electronics Company, Ltd.
Sung-Hoan Kim Seok-Won Lee Tae-Je Cho

2. S-Connect Technology: Multi-chip, Fan-Out Interposer for Next-Generation, Heterogeneous Integration
Jihun Lee - Amkor Technology
Gamhan Yong - Amkor Technology
MinSu Jeong - Amkor Technology
JongHyun Jeon - Amkor Technology
DongHoon Han - Amkor Technology
WonChul Do - Amkor Technology
JinYong Khim - Amkor Technology
MinKeon Lee - Amkor Technology
Mike Kelly - Amkor Technology
Dave Hiner - Amkor Technology
TEunSook Sohn - Amkor Technology

3. Wafer Level System Integration of the Fifth Generation CoWoS-S with High Performance Si Interposer at 2500 mm2
Ping Kang Huang - Taiwan Semiconductor Manufacturing Company, Ltd.
Chung Yu Lu - Taiwan Semiconductor Manufacturing Company, Ltd.
Vincent Wei - Taiwan Semiconductor Manufacturing Company, Ltd.
Christine Chiu - Taiwan Semiconductor Manufacturing Company, Ltd.
K.C. Ting - Taiwan Semiconductor Manufacturing Company, Ltd.
Clark Hu - Taiwan Semiconductor Manufacturing Company, Ltd.
Chung Hao Tsai - Taiwan Semiconductor Manufacturing Company, Ltd.
Shang Y. Hou - Taiwan Semiconductor Manufacturing Company, Ltd.
Wen Chih Chiou - Taiwan Semiconductor Manufacturing Company, Ltd.
Chuei Tang Wang - Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas C. H. Yu - Taiwan Semiconductor Manufacturing Company, Ltd.

4. Advanced System Integration for High Performance Computing with Liquid Cooling
Jeng-Nan Hung - Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Chi Li - Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Fan Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
Terry Ku - Taiwan Semiconductor Manufacturing Company, Ltd.
C. H. Yu - Taiwan Semiconductor Manufacturing Company, Ltd.
KC Yee - Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas C. H. Yu - Taiwan Semiconductor Manufacturing Company, Ltd.

5. A New Semiconductor Package Design Flow and Platform Applied on High Density Fan-out Chip
Chen-Chao Wang - Advanced Semiconductor Engineering, Inc.
Chih-Yi Huang - Advanced Semiconductor Engineering, Inc.
Keng-Tuan Chang - Advanced Semiconductor Engineering, Inc.
Youle Lin - Advanced Semiconductor Engineering, Inc.

6. Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module
Gongyue Tang - Institute of Microelectronics, A*STAR
Leong Ching Wai - Institute of Microelectronics, A*STAR
Siak Boon Lim - Institute of Microelectronics, A*STAR
Yong Liang Ye - Institute of Microelectronics, A*STAR
Boon Long Lau - Institute of Microelectronics, A*STAR
Kazunori Yamamoto - Institute of Microelectronics, A*STAR
Xiaowu Zhang - Institute of Microelectronics, A*STAR

7. Scaling M-Series™ for Chiplets
Clifford Sandstrom - Deca Technologies
Benedict San Jose - Deca Technologies
Tim Olson - Deca Technologies
Craig Bishop - Deca Technologies