Technical Program

Session 31: Thermal Management and Warpage Analysis of Highly Integrated Packages
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Karsten Meier
Technische Universit├Ąt Dresden
T +49 351 463 - 36 594
karsten.meier@tu-dresden.de
Suresh K. Sitaraman
Georgia Institute of Technology
T +1-404-894-3405
suresh.sitaraman@me.gatech.edu

Papers:

1. Thermal Challenges and Design Considerations in Heterogeneous Integrated Through-Silicon-Interposer Platform with Flipped III-V HEMT Chiplets
Haoran Chen - IME A*STAR
Teck Guan Lim - IME A*STAR
Gongyue Tang - IME A*STAR

2. Assessment of Thermal-Aware Floorplans in a 3D IC for Server Applications
Ki Wook Jung - Samsung Electronics
Sungeun Jo - Samsung Electronics
Minwoo Cho - Samsung Electronics
Seunggeol Ryu - Samsung Electronics
Sunggu Kang - Samsung Electronics
Jaechoon Kim - Samsung Electronics
Dan (Kyung Suk) Oh - Samsung Electronics

3. Effect of Storage on Reliability of Thin-Flexible Laminated and Unlaminated Batteries in Wearable Applications
Pradeep Lall - Auburn University
Ved Soni - Auburn University
Scott Miller - NextFlex National Manufacturing Institute

4. Modeling and Design for System-Level Reliability and Warpage Mitigation of Large 2.5D Glass BGA Packages
Vidya Jayaram - Georgia Institute of Technology
Omkar Gupte - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

5. Effective Computational Models for Addressing Asymmetric Warping of Fan-OUT Reconstituted Wafer Packaging
Yu-Chin Lee - National Cheng-Kung University
Chia-Yu Chen - National Cheng-Kung University
Kuo-Shen Chen - National Cheng-Kung University
Jen-Hsien Wong - Advanced Semiconductor Engineering Inc.
Wei-Hong Lai - Advanced Semiconductor Engineering Inc.
Tang-Yuan Chen - Advanced Semiconductor Engineering Inc.
Dao-Long Chen - Advanced Semiconductor Engineering Inc.
David Tarng - Advanced Semiconductor Engineering Inc.

6. Warpage and RDL Stress Analysis in Large Fan-OUT Package with Multi-Chiplet Integration
Jen-Hsien Wong - Advanced Semiconductor Engineering Inc
Chung-Hao Chen - Advanced Semiconductor Engineering Inc
Wei-Hong Lai - Advanced Semiconductor Engineering Inc
Yi-Hsien Wu - Advanced Semiconductor Engineering Inc
Dao-Long Chen - Advanced Semiconductor Engineering Inc
Teck Chong Lee - Advanced Semiconductor Engineering Inc
David Tarng - Advanced Semiconductor Engineering Inc

7. The Optimal Solution of Fan-OUT Embedded Bridge (FO-EB) Package Evaluation during the Process and Reliability Test
David Lai - SPIL
Yu-PO Wang - SPIL