Technical Program

Session 31: Analyses on Chip Package Interaction and Thermal Management for Heterointegration
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Pradeep Lall
Auburn University
T +1-334-844-3424
lall@auburn.edu
Karsten Meier
Technische Universität Dresden
T +49 351 463 - 36 594
karsten.meier@tu-dresden.de

Papers:

1. Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
Keiji Matsumoto - IBM Corporation
Marc Bergendahl - IBM Corporation
Kamal Sikka - IBM Corporation
Sayuri Kohara - IBM Corporation
Hiroyuki Mori - IBM Corporation
Takashi Hisada - IBM Corporation

2. Optimizing Die Corner and Optical Groove Corner Crackstop Support Structures for Mitigating Dicing and CPI Risks
Mohamed Rabie - GLOBALFOUNDRIES
Nicholas Polomoff - GLOBALFOUNDRIES
Scott Pozder - GLOBALFOUNDRIES

3. Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction
Yanfang Li - Indium Corporation
Meng Li - Indium Corporation
Fen Chen - Indium Corporation
Guangyu Fan - Indium Corporation
Ning-Cheng Lee - Indium Corporation

4. 3D Finite Element Simulation Study of Chip Stacking Structure Considering of Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro-joints
Bing-Xian Yang - South China University of Technology
Jiu-Bin Fei - South China University of Technology
Shui-Bao Liang - South China University of Technology
Min-Bo Zho - South China University of Technology
Wei-Lin Hu - South China University of Technology
Hai-Jun Huang - South China University of Technology
Xin-Ping Zhang - South China University of Technology

5. Aluminum Pad Plasticity-Related Bump Failure During Temperature Cycling
Wei Wang - Qualcomm Technologies, Inc
Dongming He - Qualcomm Technologies, Inc
David Rae - Qualcomm Technologies, Inc

6. Design Considerations, Demonstration, and Benchmarking of Silicon Microcold Plate and Monolithic Microfluidic Cooling for 2.5D ICs
Sreejith Kochupurackal Rajan - Georgia Institute of Technology
Ankit Kaul - Georgia Institute of Technology
Thomas Sarvey - Georgia Institute of Technology
Gary May - University of California, Davis
Muhannad Bakir - Georgia Institute of Technology

7. An Analytical Approach to Thermal Design for Manufacturing in Selective Mini Wave Soldering
Reinhardt Seidel - Institute for Factory Automation and Production Systems
Marcel Sippel - Institute for Factory Automation and Production Systems
Jörg Franke - Institute for Factory Automation and Production Systems