Technical Program

Session 31: Analyses on Chip Package Interaction and Thermal Management for Heterointegration
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Pradeep Lall
Auburn University
T +1-334-844-3424
lall@auburn.edu
Karsten Meier
Technische Universit├Ąt Dresden
T +49 351 463 - 36 594
karsten.meier@tu-dresden.de

Papers:

1. 3D Finite Element Simulation Study of the Thermomechanical Behavior and Reliability of High Bandwidth Memory (HBM) Structures Consisting of Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Microjoints
Bing-Xian Yang - South China University of Technology
Jiu-Bin Fei - South China University of Technology
Min-Bo Zho - South China University of Technology
Wei-Lin Hu - South China University of Technology
Hai-Jun Huang - South China University of Technology
Xin-Ping Zhang - South China University of Technology

2. Aluminum Pad Plasticity-Related Bump Failure During Temperature Cycling
Wei Wang - Qualcomm Technologies, Inc
Dongming He - Qualcomm Technologies, Inc
David Rae - Qualcomm Technologies, Inc

3. Optimizing Die Corner and Optical Groove Corner Crackstop Support Structures for Mitigating Dicing and CPI Risks
Mohamed Rabie - GLOBALFOUNDRIES
Nicholas Polomoff - GLOBALFOUNDRIES
Scott Pozder - GLOBALFOUNDRIES

4. A Novel Method for Characterizing Mechanical Properties of Multi-Layer Structure in Integrated Circuits by Nano-Indentation
Chen-Wei Li - Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Che Huang - Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Kuang Yu - Taiwan Semiconductor Manufacturing Company, Ltd.
Yao-Chun Chuang - Taiwan Semiconductor Manufacturing Company, Ltd.

5. Design, Fabrication, and Integration of Monolithic Microfluidic Cooling and 3D Printed Manifolds in Active 2.5D ICs
Sreejith Kochupurackal Rajan - Georgia Institute of Technology
Ankit Kaul - Georgia Institute of Technology
Thomas Sarvey - Georgia Institute of Technology
Gary May - U.C. Davis
Muhannad Bakir - Georgia Institute of Technology

6. Methods for Preparing Pierced Graphite Sheets to Achieve Superior Vertical Thermal Conduction
Ning-Cheng Lee - Indium Corporation
Yanfang Li - Indium Corporation
Fen Chen - Indium Corporation
Guangyu Fan - Indium Corporation

7. Thermal Characterizations of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
Keiji Matsumoto - IBM Corporation
Marc Bergendahl - IBM Corporation
Kamal Sikka - IBM Corporation
Sayuri Kohara - IBM Corporation
Hiroyuki Mori - IBM Corporation
Takashi Hisada - IBM Corporation