Technical Program

Session 32: Novel Approaches for Reliability and Process Modeling
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Nancy Iwamoto

T
niwamoto@prodigy.net
Yong Liu
ON Semiconductor
T +1-207-761-3155
Yong.Liu@onsemi.com

Papers:

1. Study on an Artificial Intelligence Based Kernel Ridge Regression Algorithm for Wafer Level Package Reliability Prediction
Sunil Panigrahy - National Tsing Hua University
K. N. Chiang - National Tsing Hua University

2. Artificial Neural Networks and Bayesian Techniques for Flip-Chip Package Thermo-Mechanical Analysis
Tuhin Sinha - IBM Corporation
Kamal Sikka - IBM Corporation
Rahul Lall - Stanford University

3. Development of Artificial Neuro Network and Topology Reconstruction Schemes for Fan-Out Wafer Warpage Analysis
Wen-Chun Wu - Advanced Semiconductor Engineering, Inc.
Kuo-Shen Chen - National Cheng Kung University
Tang-Yuan Chen - Advanced Semiconductor Engineering, Inc.
Dao-Long Chen - Advanced Semiconductor Engineering, Inc.
Yu-Chin Lee - National Cheng Kung University
Chia-Yu Chen - National Cheng Kung University
David Tarng - Advanced Semiconductor Engineering, Inc.

4. Prediction of Thermal Oxidation Damage in Polymers by Using Peridynamics
Deepak Behera - University of Arizona
Pranesh Roy - University of Arizona
Erdogan Madenci - University of Arizona
Selda Oterkus - University of Strathclyde

5. Fluid Structure Interaction Modeling for Dynamic Wire Sweep
Shenghua Huang - Western Digital Corporation
Yangming Liu - Western Digital Corporation
Ning Ye - Western Digital Corporation
Bo Yang - Western Digital Corporation

6. Phase-Field Simulation of Microstructure Changes and Crack Propagation at Cu-Al Wire Bonding Interface Under High Temperature Circumstance
Takuo Funaya - Renesas Electronics Corporation
Toshiyuki Koyama - Nagoya University

7. A Development of Finite Element Analysis Model of 3DIC TSV Package Warpage Considering Viscoelasticity with Cure-Kinetics
Minsoo Han - Samsung Electronics Company, Ltd.
Yongchul Shin - Samsung Electronics Company, Ltd.
Kyeongbin Lim - Samsung Electronics Company, Ltd.
Minwoo Rhee - Samsung Electronics Company, Ltd.