Technical Program

Session 32: Novel Approaches for Reliability and Process Modeling
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Nancy Iwamoto

Yong Liu
ON Semiconductor
T +1-207-761-3155


1. 1:30 PM - Study on an Artificial Intelligence Based Kernel Ridge Regression Algorithm for Wafer Level Package Reliability Prediction
Sunil Panigrahy - National Tsing Hua University
K. N. Chiang - National Tsing Hua University

2. 1:55 PM - Artificial Neural Networks and Bayesian Techniques for Flip-Chip Package Thermo-Mechanical Analysis
Tuhin Sinha - IBM Corporation
Kamal Sikka - IBM Corporation
Rahul Lall - Stanford University

3. 2:20 PM - Development of Artificial Neuro Network and Topology Reconstruction Schemes for Fan-Out Wafer Warpage Analysis
Wen-Chun Wu - Advanced Semiconductor Engineering, Inc.
Kuo-Shen Chen - National Cheng-Kung University
Tang-Yuan Chen - Advanced Semiconductor Engineering, Inc.
Dao-Long Chen - Advanced Semiconductor Engineering, Inc.
Yu-Chin Lee - National Cheng-Kung University
Chia-Yu Chen - National Cheng-Kung University
David Tarng - Advanced Semiconductor Engineering, Inc.

4. 3:30 PM - Prediction of Thermal Oxidation Damage in Polymers by Using Peridynamics
Deepak Behera - University of Arizona
Pranesh Roy - University of Arizona
Erdogan Madenci - University of Arizona
Selda Oterkus - University of Strathclyde

5. 3:55 PM - Fluid Structure Interaction Modeling for Dynamic Wire Sweep
Shenghua Huang - Western Digital Corporation
Yangming Liu - Western Digital Corporation
Ning Ye - Western Digital Corporation
Bo Yang - Western Digital Corporation

6. 4:20 PM - Phase-Field Simulation of Microstructure Changes and Crack Propagation at Cu-Al Wire Bonding Interface Under High Temperature Circumstance
Takuo Funaya - Renesas Electronics Corporation
Toshiyuki Koyama - Nagoya University

7. 4:45 PM - A Development of Finite Element Analysis Model of 3DIC TSV Package Warpage Considering Viscoelasticity with Cure-Kinetics
Minsoo Han - Samsung Electronics Company, Ltd.
Yongchul Shin - Samsung Electronics Company, Ltd.
Jiyoung Moon - Samsung Electronics Company, Ltd.
Kyeongbin Lim - Samsung Electronics Company, Ltd.
Minwoo Rhee - Samsung Electronics Company, Ltd.