Technical Program

Session 33: Flexing and Warpage Characterization and Modeling
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Xuejun Fan
Lamar University
T +1-409-880-7792
xuejun.fan@lamar.edu
Erdogan Madenci
University of Arizona
T +1-520-621-6113
madenci@email.arizona.edu

Papers:

1. Microneedle Insertion into Visco-Hyperelastic Model for Skin for Healthcare Application
Davira Widianto - Georgia Institute of Technology
Benjamin Stewart - Georgia Institute of Technology
Juan Lapaix - Georgia Institute of Technology
Richard Shafer - Georgia Institute of Technology
Andrew Burns - General Electric
Azar Alizadeh - General Electric
Mark Prausnitz - Georgia Institute of Technology
Suresh Sitaraman - Georgia Institute of Technology

2. Flexible Encapsulation Process-Property Relationships for Flexible Hybrid Electronics
Pradeep Lall - Auburn University
Padmanava Choudhury - Auburn University
Jinesh Narangaparambil - Auburn University
Scott Miller - NextFlex National Manufacturing Institute

3. Warpage Estimation of Heterogeneous Panel-Level Fan-Out Package with Fine Line RDL and Extreme Thin Laminated Substrate Considering Molding Characteristics
Chang-Chun Lee - National Tsing Hua University
Chi-Wei Wang - National Tsing Hua University
Chia-Chi Lee - National Tsing Hua University
Chin-Yi Chen - National Tsing Hua University
Yu-Hua Chen - Unimicron Technology Corporation
Hung-Chih Lee - Unimicron Technology Corporation
Tsun-Sheng Chou - Unimicron Technology Corporation

4. Why Is It Still Difficult to Make Accurate Prediction of the Warpage after Advanced Molding Processes?
Sukrut Prashant Phansalkar - University of Maryland
Changsu Kim - University of Maryland
Bongtae Han - University of Maryland

5. Investigation of the Factors Affecting the Warpage Prediction of Multi-chip Package
Pavan Rajmane - Qualcomm Technologies, Inc
Karthikeyan Dhandapani - Qualcomm Technologies, Inc
Mark Schwarz - Qualcomm Technologies, Inc
Ahmer Syed - Qualcomm Technologies, Inc

6. Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
Hiroyuki Mori - IBM Corporation
Sayuri Kohara - IBM Corporation

7. Novel Method of Wafer-Level and Package-Level Process Simulation for Warpage Optimization of 2.5D TSV
Suchang Lee - Samsung Electronics Company, Ltd.
Sun woo Han - Samsung Electronics Company, Ltd.
Jong Pa Hong - Samsung Electronics Company, Ltd.
Sang kun O - Samsung Electronics Company, Ltd.
Dong Ok Kwak - Samsung Electronics Company, Ltd.
Soohyun Nam - Samsung Electronics Company, Ltd.
Yukyung Park - Samsung Electronics Company, Ltd.
Jong Ho Lee - Samsung Electronics Company, Ltd.