Technical Program

Program Sessions: Friday June 2nd 2:00 PM — 5:05 PM

Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration
Committee: Interconnections
Room: Mediterranean 2 & 3

Session Co-Chairs:

Takafumi Fukushima
Tohoku University
Email: [email protected]

Bernd Ebersberger
Infineon Technologies AG
Email: [email protected]

Papers:

1. 3D Silicon Interposer for Terabit/s Transcievers Based on High-Speed TSVs
Bogdan Sirbu — Fraunhofer IZM
Kai Zoschke — Fraunhofer IZM
Ukyo Suzuki — CEA-LETI
Quentin Wilmart — CEA-LETI
Tolga Tekin — Fraunhofer IZM

2. Creative Design and Structure Applied to Chiplets Packaging
Chen-Chao Wang — Advanced Semiconductor Engineering, Inc.
Chih-Yi Huang — Advanced Semiconductor Engineering, Inc.
Chih-Pin Hung — Advanced Semiconductor Engineering, Inc.
Chung-Hung Lai — Advanced Semiconductor Engineering, Inc.
Hung-Hsien Huang — Advanced Semiconductor Engineering, Inc.
Hung-Chun Kuo — Advanced Semiconductor Engineering, Inc.
Ming-Fong Jhong — Advanced Semiconductor Engineering, Inc.
Fu-Chen Chu — Advanced Semiconductor Engineering, Inc.

3. TSV-Based Stacked Silicon Capacitor With Embedded Package Platform
Kyojin Hwang — Samsung Electronics Co., Ltd.
Heeseok Lee — Samsung Electronics Co., Ltd.
Junso Pak — Samsung Electronics Co., Ltd.

4. Ultra-Fine Pitch RDL (UFPRDL) Using Polymer Dual Damascene Processing
Nelson Pinho — imec
Emmanuel Chery — imec
Nicolas Pantano — imec
John Slabbekoorn — imec
Andy Miller — imec
Eric Beyne — imec

5. Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
Juliano Borges — University of Sherbrooke
Maxime Darnon — University of Sherbrooke
Yann Beilliard — University of Sherbrooke
Serge Ecoffey — University of Sherbrooke
Isabel De Sousa — IBM Canada, Ltd.
Dominique Drouin — University of Sherbrooke

6. On the Path to AI Hardware Via Chiplet Integration Enabled by High Density Organic Substrates
Griselda Bonilla — IBM Research
Brian Quinlan — IBM Systems
Tom Wassick — IBM Systems
Russell Kastberg — IBM Systems
Shidong Li — IBM Systems
Monali Basutkar — IBM Systems

7. Fine Pitch Microvia Interconnection With Reliable Electroless/Electric Cu Plating Layers Combined With High Power DUV Picosecond Pulse Laser for Organic Substrates
Ming-chun Hsieh — Osaka University
Zheng Zhang — Osaka University
Masahiko Nishijima — Osaka University
Aiji Suetake — Osaka University
Chuantong Chen — Osaka University
Hiroyoshi Yoshida — Osaka University
Wanyun Li — Osaka University
Reiko Okumura — Osaka University
Hidekazu Homma — Okuno Chemical Industries Co., Ltd.
Koji Kita — Okuno Chemical Industries Co., Ltd.
George Okada — Spextronix Corp., Ltd.
Katsuaki Suganuma — Osaka University