Technical Program

Session 36: Packaging, Machine Learning, and Integration Technologies
Committee: Emerging Technologies

Session Co-Chairs:

Santosh Kudtarkar
Analog Devices
T +1-781-9372462
santosh.kudtarkar@analog.com
Hongqing Zhang
IBM Corporation
T 484-896-8709
zhangh@us.ibm.com

Papers:

1. Fabrication of Ultra-Thin Solid-State Battery and the Flexible Integration on FlexTrateTM for Powering Wearable Devices
Guangqi Ouyang - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles

2. Reliability, Solderability and Electrical Performance of High Density Ultra Thin Capacitors Based on Carbon Nanofibers
Rickard Andersson - Smoltek AB
Maria Bylund - Smoltek AB
A.M. Saleem - Smoltek AB
Elisa Passalacqua - Smoltek AB
Victor Marknäs - Smoltek AB
Qi Li - Smoltek AB
Shafiq Kabir - Smoltek AB
Sascha Krause - Smoltek AB
Vincent Desmaris - Smoltek AB

3. Low Cost Grounding Integration for Surface Ion-trap Device
Hongyu Li - Institute of Microelectronics, A*STAR
Wen Wei Seit - Institute of Microelectronics, A*STAR
Gilho Hwang - Institute of Microelectronics, A*STAR
Jing Tao - Nanyang Technological University
Peng Zhao - Institute of Microelectronics, A*STAR
Chuan Seng Tan - Nanyang Technological University

4. Flexible and Ultra-Thin 30 μm Glass Substrates for RF Applications
Sridhar Sivapurapu - Georgia Institute of Technology
Rui Chen - Georgia Institute of Technology
Mutee ur Rehman - Georgia Institute of Technology
Takenori Kakutani - Taiyo America
Kimiyuki Kanno - JSR Corp
Martin Letz - Schott AG
Fuhan Liu - Georgia Institute of Technology
Suresh Sitaraman - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology

5. Analog Synaptic Behaviors in Carbon-Based Self-Selective RRAM for In-Memory Supervised Learning
Ying-Chen Chen - Northern Arizona University
Jason K. Eshraghian - The University of Michigan
Isaiah Shipley - Northern Arizona University
Maxwell Weiss - Northern Arizona University

6. Application of Machine Learning in Recognition and Analysis of TSV Extrusion Profiles with Multiple Morphology
Golareh Jalilvand - University of South Carolina
Brendan Reidy - University of South Carolina
Joseph Lindsay - University of South Carolina
Vishnu Shukla - University of Central Florida
Ramtin Zand - University of South Carolina
Tengfei Jiang - University of Central Florida

7. Investigation of Copper and Glass Interaction in Through Glass Via (TGV) during thermal cycling
Ke Pan - Binghamton University
Jiefeng Xu - Binghamton University
Yangyang Lai - Binghamton University
Seungbae Park - Binghamton University
Scott Pollard - Corning
Chukwudi Okoro - Corning
Dhanankay Joshi - Corning