Technical Program

Session 38: Reliability Analysis of New Materials in Modern Packaging
Committee: Interactive Presentations

Session Co-Chairs:

Jeffrey Lee
iST-Integrated Service Technology Inc.
T +886-3-5799909 ext 3000
jeffrey_lee@istgroup.com
Mark Eblen
Kyocera International SC
T +1-858-614-2537
mark.eblen@kyocera.com

Papers:

1. Reliability Testing by Mechanical and Electrical Characterization of Flexible and Stretchable Interconnect Materials
Mayukh Nandy - Arizona State University
Yanze Wu - Arizona State University
Todd Houghton - Arizona State University
Hongbin Yu - Arizona State University

2. Small Feature Size, Large Impact: How Advanced Packaging will Reinvent Radar Manufacturing
Catherine Farnum - Northrop Grumman Corporation
Md Kaysar Rahim - Northrop Grumman Corporation

3. Novel Characterization Method of Chip level Hybrid Bonding Strength
Juno Kim - Samsung Electronics Company, Ltd.
Kyeongbin Lim - Samsung Electronics Company, Ltd.
Seung Ho Hahn - Samsung Electronics Company, Ltd.
Mingu Lee - Samsung Electronics Company, Ltd.
Minwoo Rhee - Samsung Electronics Company, Ltd.

4. Electrochemical Reliability of NTV Sintered Flexible Substrates
Robert Klengel - Fraunhofer IMWS
Sandy Klengel - Fraunhofer IMWS
Carola Klute - Fraunhofer IMWS
Bolko Mühs-Portius - Fraunhofer IMWS

5. In-Situ Determination of Specimen Temperature During Electromigration Testing of Solder Joint
Mostafa AbdelAziz - University of Waterloo
Michael Mayer - University of Waterloo

6. Mechanical Characterization of Benzene cyclobutene (BCB) Used in Cu/polymer Hybrid Bonding
Sukrut Prashant Phansalkar - University of Maryland
Yu-Hsiang Yang - University of Maryland
Changsu Kim - University of Maryland
Bongtae Han - University of Maryland
Young Kun Jee - Samsung Electronics Company, Ltd.
Choong Seon Lee - Samsung Electronics Company, Ltd.
Un Byung Kang - Samsung Electronics Company, Ltd.
Jong Ho Lee - Samsung Electronics Company, Ltd.
Sang Cheon Park - Samsung Electronics Company, Ltd.

7. Reliability of Fan-Out Wafer Level Packaging for III-V RF Power MMICs
Ariane Tomas - IMS, University of Bordeaux/United Monolithic Semiconductors
Laurent Marechal - United Monolithic Semiconductors
Rodrigo Almeida - United Monolithic Semiconductors
Mehdy Neffati - United Monolithic Semiconductors
Nathalie Malbert - IMS, University of Bordeaux
Hélène Fremont - IMS, University of Bordeaux
Nathalie Labat - IMS, University of Bordeaux
Arnaud Garnier - Univ. Grenoble Alpes, CEA, LETI

8. Ultrasonic Thick Wire Bonding Process Simulation and Validation for Silicon Carbide Power Devices
Pan Liu - Fudan University
Liangtao Li - Fudan University
Zejun Zeng - Fudan University
Guoqi Zhang - Delft University of Technology
Pengfei Liu - Huada Semiconductor Co., LTD
Jon Qingchun Zhang - Fudan University
Jing Zhang - Heraeus Holding

9. Reliability of Printed Microwave Electronics
Simone Neermann - Institute for Factory Automation and Production Systems
Joerg Franke - Institute for Factory Automation and Production Systems
Mark Sippel - Institute of Microwaves and Photonics
Konstantin Lomakin - Institute of Microwaves and Photonics
Klaus Helmreich - Institute of Microwaves and Photonics
Gerald Gold - Institute of Microwaves and Photonics

10. Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders
Mohammad Ashraful Haq - Auburn University
Mohd Aminul Hoque - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University