Technical Program

Session 38: Interactive Presentations 2
Committee: Interactive Presentations

Session Co-Chairs:

Pavel Roy Paladhi
IBM Corporation
rpaladhi01@gmail.com
Amanpreet Kaur
Oakland University
kaur4@oakland.edu
Saikat Mondal
Intel Corporation
saikat.mondal@intel.com

Papers:

Multi-layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and Its Potential Applications for Power-Via technologies
Bo-Zhou Liao - National Taiwan University
Yi-Ting Tsai - National Taiwan University
Liang-Hsi Chen - National Taiwan University
Ting-Wei Chen - National Taiwan University
Kai-Cheng Chen - National Taiwan University
Yi-Cheng Chan - National Taiwan University
Hong-Yi Lin - National Taiwan University
Min-Hung Lee Ming-Han Liao

A De-Embedding and Embedding Procedure for High-Speed Channel Eye Diagram Oscilloscope Measurement
Zhaoqing Chen - IBM Corporation

Physics-Based Nested-ANN Approach for Fan-Out Wafer Level Package Reliability Prediction
Peilun Yao - Hong Kong University of Science and Technology
Jun Yang - Hong Kong University of Science and Technology
Yonglin Zhang - Hong Kong University of Science and Technology
Xiaoshun Fan - Hong Kong University of Science and Technology
Haibin Chen - Hong Kong University of Science and Technology
Jinglei Yang - Hong Kong University of Science and Technology
Jingshen Wu - Hong Kong University of Science and Technology

A Fully Additive Approach for the Fabrication of Split-Ring Resonator Metasurfaces
Roghayeh Imani - Luleå University of Technology
Sarthak Acharya - Luleå University of Technology
Shailesh Chouhan - Luleå University of Technology
Jerker Delsing - Luleå University of Technology

60 GHz 0-360˚ Passive Analog Delay Line in Liquid Crystal Technology Based on a Novel Conductor-Backed Fully-Enclosed Coplanar Waveguide
Jinfeng Li - Imperial College London

Development of Smart Sensor Array Mat for Retail Inventory Management
Ruiqi Lim - Institute of Microelectronics (IME), A*STAR
Musafargani Sikkandhar - Institute of Microelectronics (IME), A*STAR
Ming-Yuan Cheng - Institute of Microelectronics (IME), A*STAR

Modeling and Mitigating Fiber Weave Effect Using Layer Equivalent Model and Monte Carlo Method
Chin-Hsun Wang - National Taiwan University
Ming-Tsun Lu - Unimicron Technology Corporation
Jun-Rui Huang - Unimicron Technology Corporation
Ching-Sheng Chen - Unimicron Technology Corporation
Ruey-Beei Wu - National Taiwan University

Die Floorplan and PKG Design Impacts on Power Integrity Performances of Multiple Blocks in a Single Power Domain
Jun So Pak - Samsung Electronics Co., Ltd.
James Jeong - Samsung Electronics Co., Ltd.
Taehoon Kim - Samsung Electronics Co., Ltd.
Byung-Su Kim - Samsung Electronics Co., Ltd.
Minkyu Kim - Samsung Electronics Co., Ltd.
Jisoo Hwang - Samsung Electronics Co., Ltd.
Serhoon Lee - Samsung Electronics Co., Ltd.
Heeseok Lee - Samsung Electronics Co., Ltd.

System Level Power Supply Induced Jitter Suppression for Multi-lane High Speed Serial Links
Goeun Kim - Samsung Electronics Co., Ltd.
Doohee Lim - Samsung Electronics Co., Ltd.
Tamal Das - Samsung Electronics Co., Ltd.
Eunjung Lee - Samsung Electronics Co., Ltd.
Sangin You - Samsung Electronics Co., Ltd.

Heterogeneously Integrated Quantum Chip Interposer Packaging
Ramesh Kudalippalliyalil - University of Southern California
Sujith Chandran - University of Southern California
Akhilesh Jaiswal - University of Southern California
Kang L. Wang - University of Los Angeles
Ajey P. Jacob - University of Southern California

System-Level Verification of a Packaged Silicon Photonics-Based Transceiver
Yao Sun - II-VI
Po Dong - II-VI
Minhua Chen - II-VI
Kejia Zheng - II-VI
Changyi Li - II-VI
Shihuan Ran - Shanghai Jiaotong University
Li Zhang - II-VI
Wei Si - II-VI
Shanshan Zeng - II-VI
Linjie Zhou - Shanghai Jiaotong University

A Novel Frequency Mixing Based Beam-Steering Phased Array for K-Band Applications
Yu Ping Liu - Oakland University
Amanpreet Kaur - Oakland University

Automated Detection and Segmentation of HBMs in 3D X-ray Images Using Semi-Supervised Deep Learning
Ramanpreet Pahwa - I2R
Richard Chang - I2R
Wang Jie - I2R
David Ho Soon Wee - Institute of Microelectronics (IME), A*STAR
Chong Ser Choong - Institute of Microelectronics (IME), A*STAR
Vempati Srinivasa Rao - Institute of Microelectronics (IME), A*STAR
Xu Xun - I2R
Lile Cai - I2R
Sheng Foo Chuan - I2R

New Packaging Technology for Disruptive 1-and 2-Dimensional VCSEL Arrays and Their Electro-Optical Performance and Applications
Gottfried Rainer Dohle - Micro Systems Engineering GmbH
Gerold Henning - Micro Systems Engineering GmbH
Thomas Friedrich - Micro Systems Engineering GmbH
Maximilian Wallrodt - Micro Systems Engineering GmbH
Christoph Gréus - VERTILAS GmbH
Christian Neumeyr - VERTILAS GmbH
Jürgen Rosskopf - VERTILAS GmbH
Robert Hohenleitner - VERTILAS GmbH

Electrospray Printing of Polyimide Films for Electronics Packaging Applications
Bryce Kingsley - Binghamton University
Emma Pawliczak - Binghamton University
Thomas Hurley - Binghamton University
Paul Chiarot - Binghamton University

Addressing 5G NR Filter Challenges with Hybrid Technologies
Lijun Chen - Xpeedic
Feng Ling - Xpeedic

Hybrid Lithography Approach for Single Mode Polymeric Waveguides and Out of Plane Coupling Mirror
David Weyers - TU Dresden
Akash Mistry - TU Dresden
Krzysztof Nieweglowski - TU Dresden
Karlheinz Bock - TU Dresden

Performance of Flexible Microwave Antenna Under Environmental Stress
Emuobosan Enakerakpo - Binghamton University
Ashraf I. Umar - Binghamton University
Mohammed Alhendi - Binghamton University
Dylan Richmond - Binghamton University
Mark D. Poliks - Binghamton University
Tom Rovere - Lockheed Martin
Stephen Gonya - Lockheed Martin

TSV-less Power Delivery for Wafer-Scale Interposers
Haoxiang Ren - University of California, Los Angeles
Saptadeep Pal - University of California, Los Angeles
Guangqi Ouyang - University of California, Los Angeles
Randall Irwin - University of California, Los Angeles
Yu-Tao Yang - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles

Modeling the Effect of Surface Roughness for Screen-Printed Silver Ink on Flexible Substrates
Mohamed Abdelatty - Binghamton University
Ashraf Umar - Binghamton University
Gurvinder Khinda - Binghamton University
Mohammed Alhendi - Binghamton University
Mark Poliks - Binghamton University

Modeling the Effect Trace Profiles on the RF Performance of Additively Manufactured Microstrip Transmission Lines on Polyimide Substrates
Ashraf Umar - Binghamton University
Mohamed Y. Abdelatty - Binghamton University
Gurvinder S. Khinda - Binghamton University
Mohammed Alhendi - Binghamton University
Mark D. Poliks - Binghamton University

A Broadband High-Efficiency Charge Pump for Ambient RF Energy Harvesting - Powering Underground RFID Based Sensors
Yihang Chu - Michigan State University
Premjeet Chahal - Michigan State University

Modeling of Adaptive Receiver Performance Using Generative Adversarial Networks
Priyank Kashyap - North Carolina State University
Yongjin Choi - Hewlett Packard Enterprise
Sumon Dey - Hewlett Packard Enterprise
Dror Baron - North Carolina State University
Chau-Wai Wong - North Carolina State University
Tianfu Wu - North Carolina State University
Chris Cheng - North Carolina State University
Paul Franzon - North Carolina State University