Technical Program

Session 40: Materials and Techniques in High Speed Interconnects
Committee: Interactive Presentations

Session Co-Chairs:

Michael Mayer
University of Waterloo
T +1-519-888-4024
Xin Yan
Intel Corporation
T +1-217-299-7363


1. Process Optimization of Micro Bump Pitch Design in 3-Dimensional Package Structure
Hyoeun Kim - Samsung Electronics Company, Ltd.
Jongpa Hong - Samsung Electronics Company, Ltd.
Ohguk Kwon - Samsung Electronics Company, Ltd.
SangSik Park - Samsung Electronics Company, Ltd.

2. Design Benefits of Hybrid Bonding
Theodros Nigussie - NC State University

3. Improvement of Align-Key Recognition Precision by Development of Auto-focus Algorithm
Gwanghee Jo - Samsung Electronics Company, Ltd.
Seoungdae Seok - Samsung Electronics Company, Ltd.
Donggil Shim - Samsung Electronics Company, Ltd.
Joonyoung Kim - Samsung Electronics Company, Ltd.

4. Investigation of a Novel Rolling Mechanical Test for Impact Property of Solder ACF Joints
Shuye Zhang - Harbin Institute of Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

5. Effect of Crystal Anisotropy and IMCs on Electro-Migration Resistivity of Low Temperature Flip Chip Interconnect
Kei Murayama - Shinko Electric Industries Co. Ltd.
Mitsuhiro Aizawa - Shinko Electric Industries Co. Ltd.
Kiyoshi Oi - Shinko Electric Industries Co. Ltd.

6. Cu-Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures
Tobias Bernhard - Atotech
S. Dieter - Atotech
Roger Massey - Atotech
S. Kempa - Atotech
E. Steinhäuser - Atotech
Frank Bruening - Atotech

7. Enabling Continuous Copper Seed Layer in Ultra-High Aspect Ratio Through-Silicon-Vias (TSVs) by Sequential Sputtering and Vacuum-Assisted Electroless Plating
Ziyue Zhang - Beijing Institute of Technology
Yingtao Ding - Beijing Institute of Technology
Ziru Cai - Beijing Institute of Technology
Baoyan Yang - Beijing Institute of Technology
Zhaohu Wu - Beijing Institute of Technology
Yuwen Su - Beijing Institute of Technology
Zhiming Chen - Beijing Institute of Technology

8. Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration
Chih-Cheng Hsiao - ITRI
Huan-Chun Fu - ITRI
Chia-Wen Chiang - ITRI
Ou-Hsiang Lee - ITRI
Tsung-Yu Ou Yang - ITRI
Hsiang-Hung Chang - ITRI

9. Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates
Friedrich-Leonhard Schein - Technische Universität Berlin
Christian Voigt - Technische Universität Berlin
Mohamed Elghazzali - Evatec AG
Ioannis Tsigaras Hirofumi Sawamoto - Evatec AG
Ewald Strolz - Evatec AG
Roland Rettenmeier - Evatec AG
Lars Böttcher - Fraunhofer IZM

10. Laser Lift Off and Multi Dies Collective Bonding for Inorganic uLED with the Newly Developed Material
Nishida Masataka - Showa Denko Materials Co., Ltd.
Honda Kazutaka - Showa Denko Materials Co., Ltd.

11. Towards Cu-Cu Direct Bonding: Controlled Crystal Growth of Copper Deposits for Minimization of Interface Formation During Bonding
Ralf Schmidt - Atotech