Technical Program
Session 41: Student Interactive Presentations
Committee: Interactive Presentations
Session Co-Chairs:
|
Ibrahim Guven Virginia Commonwealth University iguven@vcu.edu |
Alan Huffman SkyWater Technology alan.huffman@ieee.org |
Biao Cai IBM biaocai@us.ibm.com |
Papers:
Machine Learning Assisted Counterfeit IC Detection Through Non-Destructive Infrared (IR) Spectroscopy Material Characterization
Chengjie Xi - University of Florida
John True - University of Florida
Nathan Jessurun - University of Florida
Aslam Khan - University of Florida
Mark Tehranipoor - University of Florida
Navid Asadizanjani - University of Florida
Pressureless and Low Temperature Sintering by Ag Paste for the High Temperature Die-Attachment in Power Device Packaging
Chuncheng Wang - Osaka University
Xu Zhang - Shenzhen Institute of Advanced Electronic Materials
Yudui Zhang - Shenzhen Institute of Advanced Electronic Materials
Tao Zhao - Shenzhen Institute of Advanced Electronic Materials
Pengli Zhu - Shenzhen Institute of Advanced Electronic Materials
Rong Sun - Shenzhen Institute of Advanced Electronic Materials
Hiroshi Nishikawa - Shenzhen Institute of Advanced Electronic Materials
Liang Xu - Shenzhen Institute of Advanced Electronic Materials
Smartphone App-Enabled Flex sEMG Patch using FOWLP
Pragathi Venkatesh - University of California, Los Angeles
Randall Irwin - University of California, Los Angeles
Arsalan Alam - University of California, Los Angeles
Michael Molter - University of California, Los Angeles
Ayush Kapoor - University of California, Los Angeles
Bilwaj Gaonkar - University of California, Los Angeles
Luke Macyszyn - University of California, Los Angeles
M. Selvan Joseph - Calfornia State University, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles
A Deep Learning Approach for Reflow Profile Prediction
Yangyang Lai - Binghamton University
Jun Kataoka - Binghamton University
Ke Pan - Binghamton University
Jonghwan Ha - Binghamton University
Junbo Yang - Binghamton University
Karthik A. Deo - Binghamton University
Jiefeng Xu - Binghamton University
Seungbae Park - Binghamton University
Effects of Temperature on the Adhesive Performance of High Tg Underfill in 2.5D Heterogeneous Integrated Packaging
Guolin Zhao - Chinese Academy of Sciences
Haoliang Lin - Chinese Academy of Sciences
Houya Wu - Chinese Academy of Sciences
Bin Wang - Chinese Academy of Sciences
Yuanyuan Yang - Chinese Academy of Sciences
Gang Li - Chinese Academy of Sciences
Pengli Zhu - Chinese Academy of Sciences
Rong Sun - Chinese Academy of Sciences
Chingping Wong - Georgia Institute of Technology
Wenhui Zhu - Central South University
Demonstration and Comparison of Vertical Via-less Interconnects in Laminated Glass Panels from 40 -170GHz
Lakshmi Narasimha Vijay Kumar - Georgia Institute of Technology
Kimiyuki Kanno - JSR Corporation
Hirokazu Ito - JSR Corporation
Taku Ogawa - JSR Corporation
Koichi Hasegawa - JSR Corporation
Kyoung-Sik Moon - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Monte Carlo Particle Simulation of Avalanche Breakdown in a Reverse Biased Diode with Full Band Structure
Ze Sun - Missouri University of S&T
Manish Kizhakkeveettil Mathew - Missouri University of S&T
Ryan From - Boeing
DongHyun Kim - Missouri University of S&T
Characterization and Analysis of Moisture Absorption in Embedded System in Packaging
Rongwei Gao - Institute of Microelectronics of Chinese Academy of Science
Rui Ma - Institute of Microelectronics of Chinese Academy of Science
Jun Li - Institute of Microelectronics of Chinese Academy of Science
Qidong Wang - Institute of Microelectronics of Chinese Academy of Science
Liqiang Cao - Institute of Microelectronics of Chinese Academy of Science
Meiying Su - Institute of Microelectronics of Chinese Academy of Science
Methods of Printing Copper for PCB Repair
Dylan Richmond - Binghamton University
Emuobosan Enakerakpo - Binghamton University
Mohammed Alhendi - Binghamton University
Peter McClure - Universal Instruments Corp.
Jim Wilcox - Universal Instruments Corp.
Mark Poliks - Binghamton University
Novel Sn–Cu Based Composite Solder Preforms Capable of Low Temperature Reflow for Die Attachment of High Temperature Power Electronics and the Transient Liquid Phase Bonding Process
Ru-Zeng Shi - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology
Trust Validation of Chiplets Using a Physical Inspection Based Certificate Authority
Nidish Vashistha - University of Florida
Md Mahfuz Al Hasan - University of Florida
Fahim Rahman - University of Florida
Navid Asadizanjani - University of Florida
Mark Tehranipoor - University of Florida
Security Challenges of MEMS Devices in HI Packaging
Aslam Khan - University of Florida
Keon Sahebkar - University of Florida
Chengjie Xi - University of Florida
Mark Tehranipoor - University of Florida
Ryan F. Need - University of Florida
Navid Asadizanjani - University of Florida
Influence of Height Difference Between Chip and Substrate on RDL in Silicon-Based Fan-Out Package
Xiao Han - Peking University
Wei Wang - Peking University
Yufeng Jin - Peking University
Symmetric-Cell EBG Theory and Its Applications to Vias Daisy Chain for Residual Stub Detection
Yu-Kuang Wang - National Taiwan University
Ming-Tsun Lu - Unimicron Technology Corporation
Jun-Rui Huang - Unimicron Technology Corporation
Ching-Sheng Chen - Unimicron Technology Corporation
Ruey-Beei Wu - National Taiwan University
Millimeter-Wave Antenna Design and Performance Analysis for Automotive Applications
Mohammad Pervez - Oakland University
Amanpreet Kaur - Oakland University
Md Mamun Ur Rashid - Oakland University
