Technical Program

Session 41: Characterization and Performance Analysis of Packaging Materials
Committee: Interactive Presentations

Session Co-Chairs:

Mark Poliks
Binghamton University
T +1-607-727-7014
mark.poliks@eitny.com
Qianwen Chen
IBM Research
T +1-914-945-1612
chenq@us.ibm.com

Papers:

1. Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging
Xu Liu - Delft University of Technology
Quan Zhou - The Key Laboratory of Optoelectronic Technology &Systems, Education Ministry of China, Chongqing University and College of Optoelectronic Engineering, Chongqing University
Xu Zhao - Shenzhen Institute of Advanced Technology
Wee Koh Sau - Huawei Technology
Huaiyu Ye - Southern University of Science and Technology
Guoqi Zhang - Delft University of Technology

2. Degradation of Silver Nanowire Transparent Conductors by Module-Level Weathering Under Electrical Stress
Chiao-Chi Lin - Feng Chia University
Hung-Shuo Chang - Feng Chia University

3. Multi-layered Package Substrate Manufactured by Reel to Reel Processes
Jongwoo Park - Haesung DS
Myungki Jung - Haesung DS
Yongnam Kim - Haesung DS
Soon-Chul Kwon - Haesung DS
Sangmin Lee - Haesung DS
Daewook Kim - Haesung DS
Jungsoo Byun - Haesung DS

4. Copper-Graphene Foams: A New High-Performance Material System for Advanced Package-Integrated Cooling Technologies
Ryan Wong - Georgia Institute of Technology
Antonia Antoniou - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

5. Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Dong-Hwan Kim - University of Science and Technology
Ae-Sun Oh - Electronics and Telecommunications Research Institute
Eun-Young Park - Electronics and Telecommunications Research Institute
Kyung-Hyun Kim - Electronics and Telecommunications Research Institute
Sung-Jae Jeon - Korea Institute of Machinery & Materials
Hyun-Cheol Bae - University of Science and Technology

6. Effects of the Citrate-Coated Nanosized Ag Pastes on Joining Reliable Cu-Cu Joints for Current 3D ICs
Shuye Zhang - Harbin Institute of Technology
Dayin Wang - Harbin Institute of Technology
Xiaokang Duan - Harbin Institute of Technology
Shang Zhang - Harbin Institute of Technology
Zhenfeng Li - Harbin Institute of Technology
Peng He - Harbin Institute of Technology
Jiaohao Xu - Harbin Institute of Technology
Kyung-Wook Paik - KAIST

7. Study of i-Line Photosensitive Materials with a Wide Depth of Focus for Fine Pitch Redistribution Layers
Daiki Yukimori - TAIYO HOLDINGS CO., LTD.
Mei Kunito - TAIYO HOLDINGS CO., LTD.
Nobuhiro Ishikawa - TAIYO HOLDINGS CO., LTD.
Atsushi Sekiguchi - Litho Tech Japan corporation
Toshiyuki Ogata - TAIYO HOLDINGS CO., LTD.

8. Assembly Process and Application Studies of Pre-Applied Underfill - Non-Conductive Film (NCF) vs Non-Conductive Paste (NCP) for Advanced Packages
Promod Chowdhury - Henkel Corporation
Kail Shim - Henkel Corporation
Rose Guino - Henkel Corporation
Kevin Lindsey - Henkel Corporation
Jie Bai - Henkel Corporation
Gina Hoang - Henkel Corporation
Ramachandran Trichur - Henkel Corporation

9. A Comparison Study of TIM Degradation of Phase Change Material and Thermal Grease
Junbo Yang - Binghamton University
Yangyang Lai - Binghamton University
Ke Pan - Binghamton University
Jiefeng Xu - Binghamton University
Stephen Cain - Binghamton University
Travis Mikjaniec - Juniper Networks
Seungbae Park - Binghamton University