Technical Program

Session 44: Thermo-Mechanical Analysis for Reliability in Packaging Technology
Committee: Interactive Presentations

Session Co-Chairs:

Mark Eblen
Kyocera International SC
T +1-858-614-2537
mark.eblen@kyocera.com
Kuo-Ning Chiang
National Tsinghua University
T +886-3-574-2925
knchiang@pme.nthu.edu.tw

Papers:

1. Warpage of Compression Molded SiP Strips
Eric Ouyang - JCET Global
Yonghyuk Jeong - JCET Global
JaeMyong Kim - JCET Global
JaePil Kim - JCET Global
OhYoung Kwon - JCET Global
Michael Liu - JCET Global
Susan Lin - CoreTech System (Moldex3D)
Jenn An Wang - CoreTech System (Moldex3D)
Anthony Yang - CoreTech System (Moldex3D)
Eric Yang - CoreTech System (Moldex3D)

2. High Performance FCBGA Package Evaluation and Characterization for the Networking Application
Vito Lin - Siliconware Precision Industries Co., Ltd
Nicholas Kao - Siliconware Precision Industries Co., Ltd
David Lai - Siliconware Precision Industries Co., Ltd
Yu-Po Wang - Siliconware Precision Industries Co., Ltd

3. Shipping Container Design Optimization for Drop/Shock Impact
Pengcheng Yin - Binghamton University
Seungbae Park - Binghamton University
Ganesh Pandiarajan - SMART Modular Technologies

4. Multi-Objectives Design Optimization Based on Multi-Objectives Gaussian Processes for System-in-Package
Weijing Dai - Southern University of Science and Technology
Zhenkun Wang - Southern University of Science and Technology
Ke Xue - Southern University of Science and Technology

5. Effect of Latching Force on Socketed BGA Packages with Ni-Au Coated Solder Spheres
Omkar Gupte - Georgia Institute of Technology
Gregorio Murtagian - Intel Corporation
Rao Tummala - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

6. Process Dependent Material Characterization for Warpage Control of Fan-Out Wafer Level Packaging
Olaf Wittler - Fraunhofer IZM
Marius van Dijk - Fraunhofer IZM
Saskia Huber - Fraunhofer IZM
Hans Walter - Fraunhofer IZM
Martin Schneider-Ramelow - TU Berlin

7. Multiscale Modeling on the Enhanced Heat Transfer Behavior of Thermal Interface Materials Based on Graphene
Yu Wang - Sensata Technologies

8. Evaluation on Bonding Characteristics of Thermal Compression Bonded Solder Joints Via Nanoindentation Test
Hungsuk You - Sungkyunkwan University
Kyung Deuk Min - Sungkyunkwan University
Choong-Jae Lee - Sungkyunkwan University
Jun Ho Jang - Sungkyunkwan University
Dong Gil Kang - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

9. Characterization of Pressure-less Ag Sinter using Innovative Sample Preparation Approach
Murali Sarangapani - Heraeus Materials Singapore Pte Ltd
Evonne Lim Yee Weon - Heraeus Materials Singapore Pte Ltd
Yu Yuan Chieng - Heraeus Materials Singapore Pte Ltd
Miew Wan Lo - Heraeus Materials Singapore Pte Ltd
Sungsig SS Kang - Heraeus Materials Singapore Pte Ltd
Dennis Ang Kwang Leong - Heraeus Materials Singapore Pte Ltd