Technical Program

Session 44: Thermo-mechanical Analysis for Reliability in Packaging Technology
Committee: Interactive Presentations

Session Co-Chairs:

Mark Eblen
Kyocera International SC
T +1-858-614-2537
mark.eblen@kyocera.com
Kuo-Ning Chiang
National Tsinghua University
T +886-3-574-2925
knchiang@pme.nthu.edu.tw

Papers:

1. Optimization of Copper Filled Through Package Via Geometry to Minimize Thermal Induced Stresses at Glass - TPV Interface in Borosilicate Glass Interposer
Krishna Bhavana Sivaraju - University of Texas at Arlington
Sameer Hemanth Dhandarphale - University of Texas at Arlington
Dereje Agonafer - University of Texas at Arlington

2. Warpage of Compression Molded SiP Strips
Yonghyuk Jeong - JCET Global

3. High Performance FCBGA Package Evaluation and Characterization for the Networking Application
Vito Lin - Siliconware Precision Industries Co., Ltd
Nicholas Kao - Siliconware Precision Industries Co., Ltd
David Lai - Siliconware Precision Industries Co., Ltd
Yu-Po Wang - Siliconware Precision Industries Co., Ltd

4. Shipping Container Design Optimization for Drop/Shock Impact
Pengcheng Yin - Binghamton University
Seungbae Park - Binghamton University
Ganesh Pandiarajan - SMART Modular Technologies

5. Multi-Objectives Design Optimization Based on Multi-Objectives Gaussian Processes for System-in-Package
Weijing Dai - Southern University of Science and Technology
Ke Xue - Southern University of Science and Technology
Zhenkun Wang - Southern University of Science and Technology
Jingshen Wu - Southern University of Science and Technology

6. Effect of Latching Force on Socketed BGA Packages with Ni-Au Coated Solder Spheres
Omkar Gupte - Georgia Institute of Technology
Gregorio Murtagian - Intel Corporation
Rao Tummala - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

7. An Analytical Approach to Thermal Design for Manufacturing in Selective Wave Soldering
Reinhardt Seidel - Institute for Factory Automation and Production Systems
Marcel Sippel - Institute for Factory Automation and Production Systems
Jörg Franke - Institute for Factory Automation and Production Systems

8. Process Dependent Material Characterization for Warpage Control of Fan-Out Wafer Level Packaging
Olaf Wittler - Fraunhofer IZM
Marius van Dijk - Fraunhofer IZM
Saskia Huber - Fraunhofer IZM
Hans Walter - Fraunhofer IZM
Ole Hölck - Fraunhofer IZM
Martin Schneider-Ramelow - TU Berlin

9. Multiscale Modeling on the Enhanced Heat Transfer Behavior of Thermal Interface Materials Based on Graphene
Yu Wang - Sensata Technologies

10. Evaluation on Bonding Characteristics of Thermal Compression Bonded Solder Joints Via Nanoindentation Test
Hungsuk You - Sungkyunkwan University
Kyung Deuk Min - Sungkyunkwan University
Choong-Jae Lee - Sungkyunkwan University
Jun Ho Jang - Sungkyunkwan University
Dong Gil Kang - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

11. Characterization of Pressure-less Ag Sinter using Innovative Sample Preparation Approach
Murali Sarangapani - Heraeus Materials Singapore Pte Ltd
Evonne Lim Yee Weon - Heraeus Materials Singapore Pte Ltd
Yu Yuan Chieng - Heraeus Materials Singapore Pte Ltd
Miew Wan Lo - Heraeus Materials Singapore Pte Ltd
Sungsig SS Kang - Heraeus Materials Singapore Pte Ltd
Dennis Ang Kwang Leong - Heraeus Materials Singapore Pte Ltd