Technical Program
Session 45: Heterogeneous Integration, Flex and Emerging Technologies
Committee: Interactive Presentations
Session Co-Chairs:
|
Patrick Thompson Texas Instruments, Inc. T +1-214-567-0660 patrick.thompson@ti.com |
Tengfei Jiang University of Central Florida T 1-407-823-2284 Tengfei.jiang@ucf.edu |
Papers:
1. 3D Heterogeneous Integration for Physically Flexible CMOS Electronic Systems
Sohail Faizan Shaikh - King Abdullah University of Science and Technology (KAU
Nazek El-Atab - KAUST, UC Berkeley
Muhammad Mustafa Hussain - KAUST, UC Berkeley
2. Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning
Ramanpreet Pahwa - Institute for Infocomm Research
Tin Lay Nwe - Institute for Infocomm Research
Richard Chang - Institute for Infocomm Research
Oo Zaw Min - Institute for Infocomm Research
Jie Wang - Institute of Microelectronics (IME)
Saisubramaniam Gopalakrishnan - Institute of Microelectronics (IME)
David Ho Soon Wee - Institute of Microelectronics (IME)
Ren Qin - Institute of Microelectronics (IME), A*STAR
Vempati Srinivasa Rao - Institute of Microelectronics (IME), A*STAR
Haiwen Dai - Carl Zeiss SMT GmbH
Jens Timo Neumann - Carl Zeiss SMT GmbH
3. An Automated Optical Inspection System for PIP Solder Joint Classification Using Convolutional Neural Networks
Konstantin Schmidt - Friedrich-Alexander-University
D. Rauchensteiner - Siemens AG
Christian Voigt - Friedrich-Alexander-University
Nils Thielen - Friedrich-Alexander-University
Jochen Boenig - Siemens AG
Gunter Beitinger - Siemens AG
Joerg Franke - Friedrich-Alexander-University
4. A Passive Water Transfer/Retention System for Long Term Functionality of an On-Site Sensing Device
Yu Chen - Institute of Microelectronics, A*STAR
Weiguo Chen - Institute of Microelectronics, A*STAR
Ruiqi Lim - Institute of Microelectronics, A*STAR
Ming-Yuan Cheng - Institute of Institute of Microelectronics, A*STAR,A-STAR
5. Heteroeneous Integration with Embedded Fine Interconnect
Tai Chong Chai - Institute of Microelectronics, A*STAR
Teck Guan Lim - Institute of Microelectronics, A*STAR
David Ho - Institute of Microelectronics, A*STAR
Ser Choong Chong - Institute of Microelectronics, A*STAR
Yong Han - Institute of Microelectronics, A*STAR
Sharon Lim PS - Institute of Microelectronics, A*STAR
Surya Bhattacharya - Institute of Microelectronics, A*STAR
6. Enabling Low Loss Thin Glass Solutions for 5G/mmWave Applications
David Levy - Mosaic Microsystems
Shelby Nelson - Mosaic Microsystems
Aric Shorey - Mosaic Microsystems
Paul Ballentine - Mosaic Microsystems
7. Flip Chip Interconnects Based on Carbon Nanofibers-Solder Composites
Elisa Passalacqua - Smoltek
Capucine Laprais - Smoltek
Maria Bylund - Smoltek
Qi Li - Smoltek
Victor Marknäs - Smoltek
Rickard Andersson - Smoltek
Amin M Saleem - Smoltek
Vincent Desmaris - Smoltek
8. Terahertz and Machine Learning Approach to Integrated Circuit Package Assurance
John True - Florida Institute for Cyber Security Research
Chengjie Xi - Florida Institute for Cyber Security Research
Nathan Jessurun - Florida Institute for Cyber Security Research
Kiarash Ahi - University of Connecticut
Mark Tehranipoor - Florida Institute for Cyber Security Research
Navid Asadi - Florida Institute for Cyber Security Research
9. Novel Approach to Highly Robust Fine Pitch RDL Process
Jeongi Jin - Samsung Electronics Company, Ltd.
Gyuho Kang - Samsung Electronics Company, Ltd.
Hyunsu Hwang - Samsung Electronics Company, Ltd.
Byungchan Kim - Samsung Electronics Company, Ltd.
Jumyong Park - Samsung Electronics Company, Ltd.
Taehwa Jeong - Samsung Electronics Company, Ltd.
Chungsun Lee - Samsung Electronics Company, Ltd.
Unbyoung Kang - Samsung Electronics Company, Ltd.
Jongho Lee - Samsung Electronics Company, Ltd.
- Samsung Electronics Company, Ltd.
10. Solving Power Integrity Challenges for Smart Computing Era
Manho Lee - Samsung Electronics Company, Ltd.
Eunseok Song - Samsung Electronics Company, Ltd.
Eonsoo Jang - Samsung Electronics Company, Ltd.
Gyoungbum Kim - Samsung Electronics Company, Ltd.
Dan Oh - Samsung Electronics Company, Ltd.
