Technical Program

Session 6: Advanced Optoelectronics Packaging
Committee: Photonics

Session Co-Chairs:

Harry G. Kellzi
Micropac Industries
T +1(972)272-3571
harrykellzi@micropac.com
Ajey Jacob
University of Southern California (USC)
T +1-703-248-6171
ajey@isi.edu

Papers:

1. High Density Multi-Chip Module for Photonic Reservoir Computing
Jean Benoit Heroux - IBM Corporation
Toshiyuki Yamane - IBM Corporation
Hidetoshi Numata - IBM Corporation
Daiju Nakano - IBM Corporation

2. Integrated Laser Attach Technology on a Monolithic Silicon Photonics Platform
Yusheng Bian - GLOBALFOUNDRIES
Koushik Ramachandran - GLOBALFOUNDRIES
Bo Peng - GLOBALFOUNDRIES
Brittany Hedrick - GLOBALFOUNDRIES
Keith Donegan - GLOBALFOUNDRIES
Jorge Lubguban - GLOBALFOUNDRIES
Benjamin Fasano - GLOBALFOUNDRIES
Armand Rundquist - Neophotonics
Asli Sahin - GLOBALFOUNDRIES
Ajey Jacob - GLOBALFOUNDRIES

3. Packaging High-power Photodiodes for Microwave Photonic Applications
Peng Yao - Phase Sensitive Innovations
Matthew Konkol - Phase Sensitive Innovations
Victoria Carey - Phase Sensitive Innovations
Jesse Buchan - Phase Sensitive Innovations
Jeffery Whitson Kevin Shreve - Phase Sensitive Innovations
Fuquan Wang - Phase Sensitive Innovations
Dennis Prather - Phase Sensitive Innovations

4. FOWLP and Si Interposer for High Speed Photonic Packaging
Teck Lim - Institute of Microelectronics
Eva Wai Leong Ching - Institute of Microelectronics
Jong Ming Ching - Institute of Microelectronics
Loh Woon Leng - Institute of Microelectronics
David Soon Wee Ho - Institute of Microelectronics
Surya Bhattacharya - Institute of Microelectronics

5. Low ESL High voltage Si-IPD as enabler for 140W LD output and less 1ns FWHM LiDAR Module
Mohamed Mehdi Jatlaoui - Murata Integrated Passive Solutions
Yves Aubry - Murata Integrated Passive Solutions
Stephane Longuet - Murata Integrated Passive Solutions
Sophie Gaborieau - Murata Integrated Passive Solutions
Laurent Dubos - Murata Integrated Passive Solutions
Hiroyuki Nakano - Murata
Takahiro Matsuoka - Murata
Takahito Kushima - Murata
Tatsuya Ohara - Murata
Shota Ando - Murata

6. Heterogeneous Integration of a Compact Universal Photonic Engine for Silicon Photonics Applications in HPC
Hsing-Kuo Hsia - Taiwan Semiconductor Manufacturing Company, Ltd.
C.H. Tsai - Taiwan Semiconductor Manufacturing Company, Ltd.
K.C. Ting - Taiwan Semiconductor Manufacturing Company, Ltd.
F.W. Kuo - Taiwan Semiconductor Manufacturing Company, Ltd.
C.C. Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
C.T. Wang - Taiwan Semiconductor Manufacturing Company, Ltd.
S.Y. Hou - Taiwan Semiconductor Manufacturing Company, Ltd.
W.C. Chiou - Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas Yu - Taiwan Semiconductor Manufacturing Company, Ltd.

7. Integrated Connector for Silicon Photonic Co-Package Optics with Strain Relief Accommodation Through Fiber Bending
Alexander Janta-Polczynski - IBM Corporation
Martin Robitaille - LXsim