Technical Program

Program Sessions: Wednesday May 31st 9:30 AM — 12:35 PM

Session 6: Co-packaged Optical Assembly
Committee: Photonics
Room: Mediterranean 7 & 8

Session Co-Chairs:

Ajey Jacob
University of Southern California
Email: [email protected]

Takaaki Ishigure
Keio University
Email: [email protected]

Papers:

1. A Heterogeneously Integrated Wafer-Level Processed Co-Packaged Optical Engine for Hyper-Scale Data Centres
Sajay Bhuvanendran Nair Gourikutty — Institute of Microelectronics A*STAR
Boon Long Lau — Institute of Microelectronics A*STAR
Wen Wei Seit — Institute of Microelectronics A*STAR
Ming Chinq Jong — Institute of Microelectronics A*STAR
David Ho Soon Wee — Institute of Microelectronics A*STAR
Jiaqi Wu — Institute of Microelectronics A*STAR
Teck Guan Lim — Institute of Microelectronics A*STAR
Ser Choong Chong — Institute of Microelectronics A*STAR
Lai Yee Chia — Institute of Microelectronics A*STAR
Li Xin — Rain Tree Photonics Pte. Ltd.
Tsung-Yang Liow — Rain Tree Photonics Pte. Ltd.
Surya Bhattacharya — Institute of Microelectronics A*STAR

2. High Density Integration Technologies for SiPh Based Optical I/Os
Karlheinz Muth — Broadcom, Inc.
Hari Potluri — Broadcom, Inc.
Sukesh Kannan — Broadcom, Inc.

3. Photonic System Integration by Applying Microelectronic Packaging Approaches Using Glass Substrates
Henning Schroeder — Fraunhofer IZM
Oliver Kirsch — Fraunhofer IZM
Daniel Weber — Technical University Berlin
Hendrick Thiem — TOPTICA eagleyard

4. CPO on Glass for 102.4 Tb/s DC Switches
Lucas Yeary — Corning, Inc.
Lars Brusberg — Corning, Inc.
Seong-ho Seok — Corning, Inc.
Jung-Hyun Noh — Corning, Inc.
Alon Rozenvax — Corning, Inc.
Cheolbok Kim — Corning, Inc.

5. Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
Jay Li — Siliconware Precision Industries Co., Ltd.
Sam Lin — Siliconware Precision Industries Co., Ltd.
Teny Shih — Siliconware Precision Industries Co., Ltd.
Nicholas Kao — Siliconware Precision Industries Co., Ltd.
Yu-Po Wang — Siliconware Precision Industries Co., Ltd.

6. AIM Photonics Demonstration of a 300 mm Si Photonics Interposer
Colin McDonough — SUNY Research Foundation/SUNY Polytechnic Institute
Seth Kruger — SUNY Research Foundation/SUNY Polytechnic Institute
Tat Ngai — SUNY Research Foundation/SUNY Polytechnic Institute
Sarah Baranowski — SUNY Research Foundation/SUNY Polytechnic Institute
Hao Yang — Analog Photonics
Skylar Deckoff-Jones — Analog Photonics
Christopher V. Poulton — Analog Photonics
Michael R. Watts — Analog Photonics
David L. Harame — SUNY Research Foundation/SUNY Polytechnic Institute

7. Advanced 3D Integration TSV and Flip Chip Technologies for Cost-Effective and Miniaturized Packaging of a 256 Channels Optical-Phased Array Based Beam Steering System Designed for Automotive LiDARs
Thierry Mourier — CEA-LETI
Nadia Miloud-Ali — CEA-LETI
Natacha Raphoz — CEA-LETI
Yacoub Sahouane — CEA-LETI
Patrick Peray — CEA-LETI
Damien Saint Patrice — CEA-LETI
Edouard Deschaseaux — CEA-LETI
Francois Simoens — Steerlight