Technical Program
Session 6: Advanced Optoelectronics Packaging
Committee: Photonics
Session Co-Chairs:
|
Harry G. Kellzi Micropac Industries T +1(972)272-3571 harrykellzi@micropac.com |
Ajey Jacob University of Southern California (USC) T +1-703-248-6171 ajey@isi.edu |
Papers:
1. High Density Multi-Chip Module for Photonic Reservoir Computing
Jean Benoit Heroux - IBM Corporation
Toshiyuki Yamane - IBM Corporation
Hidetoshi Numata - IBM Corporation
Daiju Nakano - IBM Corporation
2. Integrated Laser Attach Technology on a Monolithic Silicon Photonics Platform
Yusheng Bian - GLOBALFOUNDRIES
Koushik Ramachandran - GLOBALFOUNDRIES
Bo Peng - GLOBALFOUNDRIES
Brittany Hedrick - GLOBALFOUNDRIES
Keith Donegan - GLOBALFOUNDRIES
Jorge Lubguban - GLOBALFOUNDRIES
Benjamin Fasano - GLOBALFOUNDRIES
Armand Rundquist - Neophotonics
Asli Sahin - GLOBALFOUNDRIES
Ajey Jacob - GLOBALFOUNDRIES
3. Packaging High-power Photodiodes for Microwave Photonic Applications
Peng Yao - Phase Sensitive Innovations
Mathew Konkol - Phase Sensitive Innovations
Victoria Carey - Phase Sensitive Innovations
Jesse Buchan - Phase Sensitive Innovations
Jeffery Whitson Kevin Shreve - Phase Sensitive Innovations
Fuquan Wang - Phase Sensitive Innovations
Dennis Prather - Phase Sensitive Innovations
4. FOWLP and Si Interposer for High Speed Photonic Packaging
Teck Lim - Institute of Microelectronics
David Soon Wee Ho - Institute of Microelectronics
Surya Bhattacharya - Institute of Microelectronics
5. Low ESL High voltage Si-IPD as enabler for 140W LD output and less 1ns FWHM LiDAR Module
Mohamed Mehdi Jatlaoui - Murata Integrated Passive Solutions
Yves Aubry - Murata Integrated Passive Solutions
Stephane Longuet - Murata Integrated Passive Solutions
Sophie Gaborieau - Murata Integrated Passive Solutions
Laurent Dubos - Murata Integrated Passive Solutions
Hiroyuki Nakano - Murata
Takahiro Matsuoka - Murata
Takahito Kushima - Murata
Tatsuya Ohara - Murata
Shota Ando - Murata
6. Heterogeneous Integration of a Compact Universal Photonic Engine for Silicon Photonics Applications in HPC
Hsing-Kuo Hsia - Taiwan Semiconductor Manufacturing Company, Ltd.
C.H. Tsai - Taiwan Semiconductor Manufacturing Company, Ltd.
K.C. Ting - Taiwan Semiconductor Manufacturing Company, Ltd.
F.W. Kuo - Taiwan Semiconductor Manufacturing Company, Ltd.
C.C. Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
C.T. Wang - Taiwan Semiconductor Manufacturing Company, Ltd.
S.Y. Hou - Taiwan Semiconductor Manufacturing Company, Ltd.
W.C. Chiou - Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas Yu - Taiwan Semiconductor Manufacturing Company, Ltd.
7. Integrated Connector for Silicon Photonic Co-Package Optics with Strain Relief Accommodation Through Fiber Bending
Alexander Janta-Polczynski - IBM Corporation
Martin Robitaille - LXsim
